JP3266036B2 - Busbar wiring board - Google Patents

Busbar wiring board

Info

Publication number
JP3266036B2
JP3266036B2 JP03744797A JP3744797A JP3266036B2 JP 3266036 B2 JP3266036 B2 JP 3266036B2 JP 03744797 A JP03744797 A JP 03744797A JP 3744797 A JP3744797 A JP 3744797A JP 3266036 B2 JP3266036 B2 JP 3266036B2
Authority
JP
Japan
Prior art keywords
bus bar
gate
wiring board
upward
downward
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP03744797A
Other languages
Japanese (ja)
Other versions
JPH10243522A (en
Inventor
誠 鳥越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP03744797A priority Critical patent/JP3266036B2/en
Publication of JPH10243522A publication Critical patent/JPH10243522A/en
Application granted granted Critical
Publication of JP3266036B2 publication Critical patent/JP3266036B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4685Manufacturing of cross-over conductors

Landscapes

  • Connection Or Junction Boxes (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、小型化に適したブ
スバー配線板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bus bar wiring board suitable for miniaturization.

【0002】[0002]

【従来の技術】ブスバー配線板は、一般に上向きまたは
下向きのタブを起立連成した複数のブスバーを絶縁基板
に配設して構成され、複数のブスバー配線板を積層した
状態で使用する。従って、積層した絶縁基板の端子挿通
孔を通って上下に突出するタブ(コネクタ端子)を避
け、また、同一絶縁基板内での回路交叉を避けるため、
ブスバーにはチャンネル状の迂回路を設ける場合が多
い。
2. Description of the Related Art In general, a bus bar wiring board is constituted by arranging a plurality of bus bars in which an upward or downward tab is erected and connected to an insulating substrate, and is used in a state where a plurality of bus bar wiring boards are stacked. Therefore, in order to avoid tabs (connector terminals) projecting up and down through the terminal insertion holes of the laminated insulating substrates, and to avoid circuit crossover within the same insulating substrate,
The bus bar is often provided with a channel-like detour.

【0003】図5のブスバー配線板21は、絶縁基板2
2上のブスバー231 と232 に下層から立ち上がるタ
ブ241 と242 を避けるためにそれぞれチャンネル状
の迂回路251 ,252 を設けた例である。しかし、迂
回路251 ,252 の配設のために絶縁基板22が大型
化する。すなわち、迂回路251 ,252 の配設が不要
であれば、少なくとも線Pから右側の部分Qを省くこと
ができ、ブスバー配線板21を小型化できる。
[0005] The bus bar wiring board 21 shown in FIG.
Bus bar 23 1 and 23 tab 24 1 a detour 25 1 of channel-shaped respectively in order to avoid the 24 2 which rises from below 2 on 2, an example in which a 25 2. However, the size of the insulating substrate 22 increases due to the provision of the detours 25 1 and 25 2 . That is, if it is not necessary to arrange the detours 25 1 and 25 2 , at least the portion Q on the right side from the line P can be omitted, and the bus bar wiring board 21 can be downsized.

【0004】そこで、実開平1−120726号公報に
は、図6〜図8に示すように、ブスバー231 と232
の上記迂回路251 ,252 を門形の立ち上がりブスバ
ー261 ,262 として形成すると共に、該ブスバー2
1 ,262 は平面展開時に互いに接触しない絶縁間隙
Eを有し、該絶縁間隙Eにより互に離れた状態(距離
L)で折り曲げ並設する構造としたブスバー配線板2
1′が開示されている。なお、図中27はブスバー配線
板21′を収容した電気接続箱の上カバー、28は絶縁
基板を兼用する下カバーを示す。
[0004] Therefore, the actual Hei 1-120726 discloses, as shown in FIGS. 6 to 8, busbar 23 1 and 23 2
Of the bypass path 25 1, to form a 25 2 as the rising bus bar 26 1, 26 2 of the gate-shaped, the bus bars 2
The bus bar wiring boards 2 1 and 26 2 each have an insulating gap E that does not contact each other when developed on a plane, and are bent and juxtaposed at a distance (distance L) from each other by the insulating gap E.
1 'is disclosed. In the figure, reference numeral 27 denotes an upper cover of the electric connection box accommodating the bus bar wiring board 21 ', and reference numeral 28 denotes a lower cover which also serves as an insulating substrate.

【0005】[0005]

【発明が解決しようとする課題】しかし、上記ブスバー
配線板21′では、二つの立ち上がブスバー261 ,2
2 に平面展開時に互いに接触しない絶縁間隙E(図8
参照)をもたせて形成する。即ち、一方のブスバー26
1 が他方のブスバー262 の門形の折り曲げ空間Sにす
っぽりと入る寸法であって、折曲時にブスバー262
ブスバー261 より高く、図7に示すように、高低差h
0 ができる。従って、積層ブスバー配線板全体の高さが
高い方の立ち上がりブスバー262 に支配され、十分な
小型化を達成することができず、ブスバーの金属板から
の打抜き歩留りが低かった。
However, in the bus bar wiring board 21 ', the two rising edges are the bus bars 26 1 , 2.
6 2 do not contact each other at the planar development the insulating gap E (FIG. 8
Reference). That is, one bus bar 26
1 is a size to enter comfortably in the bent space S of the other bus bars 26 and second gate-shaped, when bending the bus bars 26 2 is higher than the bus bar 26 1, as shown in FIG. 7, the height difference h
0 is possible. Thus, dominated by rising bus bars 26 2 having the higher the total height of the laminated bus bar wiring board, it is not possible to achieve sufficient miniaturization, lower punching yield from the metal plate of the bus bar.

【0006】本発明は上記の問題点に着目してなされた
もので、ブスバーの打抜き歩留りを高め、より小型化に
適した構造のブスバー配線板を提供することを課題とす
る。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a bus bar wiring board having a structure suitable for further reducing the size of the bus bar by increasing the punching yield.

【0007】[0007]

【課題を解決するための手段】前述した課題を解決する
ために、請求項1の発明においては、絶縁基板の同一面
に複数のブスバーを配設すると共に、該複数のブスバ
ーから選ばれる一のブスバーにはチャンネル状に第1の
迂回路を設け、他の一のブスバーにはチャンネル状に第
2の迂回路を設けて成るブスバー配線板であって、前記
第1および第2の迂回路の一方に下向きの門形ブスバー
が形成され、他方の迂回路に上向きの門形ブスバーが形
成され、前記絶縁基板の一側縁において、前記下向きの
門形ブスバーは該側縁に沿って下向きに配設され、前記
上向きの門形ブスバーはその下向きの門形ブスバーとほ
ぼ同一面上に延在する上向きに配設されていることを特
徴とする。請求項2の発明は、前記上向きの門形ブスバ
ーは下向きの門形ブスバーの両側の垂下部を支持連結す
る平面延設部の一方を跨いだ状態で上向きに配設されて
いるものである。
In order to solve the above-mentioned problems, according to the first aspect of the present invention, the same surface of an insulating substrate is provided.
A plurality of busbars are disposed on the busbar, one busbar selected from the plurality of busbars is provided with a first detour in a channel shape, and the other busbar is provided with a second detour in a channel shape. A busbar wiring board comprising: a downward gate-shaped busbar formed on one of the first and second detours; and an upward gate-shaped busbar formed on the other detour; At the side edge, the downward gate busbar is disposed downward along the side edge, and the upward gate busbar is approximately the same as the downward gate busbar.
It is characterized by being arranged upwardly extending on the same plane . According to a second aspect of the present invention, the upwardly-facing gate-shaped bus bar is disposed upwardly so as to straddle one of the planar extending portions that support and connect the hanging parts on both sides of the downwardly-facing gate-shaped bus bar.

【0008】請求項1の発明によれば、第1と第2の迂
回路はそれぞれ下向きと上向きの門形ブスバーとして互
いに逆向きに形成してあるから、従来の同じ上向きの立
ち上がりブスバーとは異なり、相互の接触や短絡を避け
るために一方を他方よりも高くする必要はなく、その分
だけブスバー配線板または積層ブスバー配線板の高さを
低くすることができ、全体とし小型化される。請求項2
の発明によれば、上向きの門形ブスバーは下向きの門形
ブスバーの両側の垂下部を支持連結する平面延設部の一
方を跨いだ状態で配設されるから、迂回路形成のための
デッドスペースを減らし、ブスバーの配設密度およびブ
スバーの金属板からの打抜き歩留りを高めることができ
る。
According to the first aspect of the present invention, since the first and second detours are formed as downward and upward gate-shaped bus bars, respectively, in opposite directions, unlike the conventional upward rising bus bar of the related art. There is no need to make one higher than the other in order to avoid mutual contact or short circuit, and the height of the bus bar wiring board or the laminated bus bar wiring board can be reduced accordingly, and the overall size is reduced. Claim 2
According to the invention, the upwardly-facing gate-shaped bus bar is disposed so as to straddle one of the planar extending portions that support and connect the hanging portions on both sides of the downwardly-facing gate-shaped bus bar. The space can be reduced and the arrangement density of the bus bars and the punching yield of the bus bars from the metal plate can be increased.

【0009】前記複数のブスバーには、請求項3に記載
のように、それぞれ端部,中間部などの所望の位置に上
向きまたは下向きのタブが連成される。従って、従来の
ブスバー配線板と同様に重ね合わせて積層ブスバー配線
板を組立て、電気接続箱の内部回路として使用すること
ができる。
As described in claim 3, an upward or downward tab is connected to a desired position such as an end portion or an intermediate portion of each of the plurality of bus bars. Therefore, a laminated bus bar wiring board can be assembled by being superposed like a conventional bus bar wiring board and used as an internal circuit of an electric junction box.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して具体的に説明する。図1(A)は本発明に係
る積層ブスバー配線板1の要部の斜視図、図1(B)は
その配設過程を示す要部の斜視図である。積層ブスバー
配線板1において、最上層(上から第1層)の絶縁基板
1 には複数のブスバー3,4,5…が配設されてお
り、第1のブスバー3にはチャンネル状に第1の迂回路
6が設けられ、第2のブスバー4には同じくチャンネル
状に第2の迂回路7が設けられている。なお、ブスバー
3,4,5…には、その端部または中間部の所望の部位
にコネクタ端子としてのタブ(図5参照)が上向きまた
は下向きに連成されるが、図面の複雑化を避けるため、
図示を省略した。
Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1A is a perspective view of a main part of the laminated bus bar wiring board 1 according to the present invention, and FIG. 1B is a perspective view of the main part showing an arrangement process thereof. In the laminated bus bar wiring board 1, a plurality of bus bars 3, 4, 5 ... is disposed on the insulating substrate 2 1 of the top layer (first layer from the top), the first bus bar 3 the channel-shaped One detour 6 is provided, and the second bus bar 4 is similarly provided with a second detour 7 in a channel shape. A tab (refer to FIG. 5) as a connector terminal is coupled to a desired portion at an end or an intermediate portion of the bus bars 3, 4, 5,... In an upward or downward direction, but the drawing is not complicated. For,
Illustration is omitted.

【0011】第1の迂回路6は、その先端部分が下向き
に折り曲げられて、下向きの門形ブスバー6′として形
成されており、絶縁基板21の一側縁において、積層さ
れた他の絶縁基板22,23,24の側面に沿って下向き
に配設されている。一方、第2の迂回路7の先端部分は
上記とは逆に上向きに折り曲げられて、上向きの門形ブ
スバー7′として形成されており、同様に絶縁基板21
の一側縁に沿うと共に下向きの門形ブスバー6′とほぼ
同一面上に延在する上向きに配設されている。この上向
きの門形ブスバー7′は下向きの門形ブスバー6′の両
側の垂下部6a,6bを支持連結する平面延設部6A,
6Bの一方(6B)を跨いだ状態で上向きに配設されて
いる。
[0011] The first bypass passage 6, its tip portion is bent downward, is formed as a downward portal bus bars 6 ', the one side edge of the insulating substrate 2 1, another insulating laminated It is disposed downward along the side surface of the substrate 2 2, 2 3, 2 4. On the other hand, the tip portion of the second bypass passage 7 is reversed upwardly bent in the above, is formed as an upward portal bus bars 7 ', similarly insulated substrate 2 1
Almost a gantry bus bars 6 'Yan Utotomoni down one side edge of the
They are arranged upward to extend on the same plane . The upwardly-facing gate-shaped bus bar 7 'is a planar extension 6A for supporting and connecting the hanging parts 6a, 6b on both sides of the downwardly-facing gate-shaped bus bar 6'.
It is arranged upward while straddling one side (6B) of 6B.

【0012】即ち、第1のブスバー3は絶縁基板21
側縁と直交して平行にのびる平面延設部6A,6Bとそ
の先端部の下向きの門形ブスバー6′とで構成されるチ
ャンネル状の迂回路6を有し、同様に第2のブスバー4
は平行にのびる平面延設部7A,7Bとその先端部の上
向きの門形ブスバー7′とで構成されるチャンネル状の
迂回路7を有する。そして、第1のブスバー3の平面延
設部6A,6B間に形成されたスペースS 1 に第2のブ
スバー4の平面延設部7Aが配設され、第2のブスバー
4の平面延設部7A,7B間に形成されたスペースS2
に第1のブスバー3の平面延設部6Bが配設される。こ
れにより、平面延設部6Bを門形ブスバー7′を構成す
る両側の立ち上がり部7a,7bと両者を連結する装架
部7cとが跨いで配設される構造となるから、第1,第
2の二つのブスバー3,4は交叉,接触しないで同一の
絶縁基板21 に配設することができる。
That is, the first bus bar 3 is connected to the insulating substrate 21of
Planar extending portions 6A and 6B extending parallel to the side edges in parallel with
And a downwardly-facing gate-shaped bus bar 6 '
It has a channel-like detour 6, and likewise has a second busbar 4
Are above the plane extending portions 7A and 7B extending in parallel and the tips thereof.
Channel-shaped bus bar 7 '
It has a detour 7. Then, the first bus bar 3 extends in a plane.
The space S formed between the installation portions 6A and 6B 1The second bu
The planar extension 7A of the subbar 4 is provided, and the second busbar
4 is a space S formed between the planar extension portions 7A and 7B.Two
The plane extending portion 6B of the first bus bar 3 is disposed at the second position. This
Thereby, the plane extending portion 6B constitutes the gate-shaped bus bar 7 '.
Mounting portions 7a, 7b on both sides and connecting them
Since the structure is arranged so as to straddle the portion 7c, the first and
2 busbars 3 and 4 are the same without crossing and touching
Insulating substrate 21Can be arranged.

【0013】積層ブスバー配線板1の組立は、図1
(B)に示すように行う。先ず、第4,3,2層の絶縁
基板24 ,23 ,22 と各層のブスバー(図示せず)と
を通常の方法に従って重ね合わせる。しかる後、最上層
に第1層の絶縁基板21 を重ね、その上に下向きの門形
ブスバー6′をもつ第1のブスバー3…と門形ブスバー
を有しない通常のブスバー5…とを配設する。その際、
下向きの門形ブスバー6′は積層した絶縁基板21 〜2
4 の側縁に沿い所定の位置に配設する。なお、絶縁基板
1 〜24 の表面には通常上記ブスバー3,4,5…の
各パターンに対応するブスパー載置溝(図示せず)が凹
設されており、各ブスバーは対応するブスパー載置溝に
置くだけで位置決めさる。従って、下向きの門形ブスバ
ー6′も特定の側縁の所定の位置に位置決めされる。
The assembly of the laminated bus bar wiring board 1 is shown in FIG.
This is performed as shown in FIG. First, 4,3,2-layer insulating substrate 2 4, 2 3, 2 2 and each bus bar (not shown) and a superimposed according to conventional methods. Thereafter, repeated insulating substrate 2 1 of the first layer to the top layer, the first normal no busbar 3 ... and portal bus bar bus bar 5 ... and with downward portal bus bars 6 'thereon distribution Set up. that time,
Downward portal bus bars 6 'insulating substrate 2 1 to 2 obtained by laminating the
It is arranged in a predetermined position along the side edge of 4 . Incidentally, Busupa mounting置溝usually corresponds to the bus bars 3, 4, 5 ... each pattern in the surface of the insulating substrate 21 to 24 (not shown) which are recessed, each bus bar corresponding Busupa It is positioned simply by placing it in the mounting groove. Accordingly, the downwardly-facing gate-shaped bus bar 6 'is also positioned at a predetermined position on a specific side edge.

【0014】最後に、上向きの門形ブスバー7′を有す
る第2のブスバー4…を配設する。即ち、下向きの門形
ブスバー6′を有する第1のブスバー3は、スペースS
1 を有し、第2のブスバー4はスペースS2 を有するか
ら、第2のブスバー4の平面延設部7AはスペースS1
内に、また第2のブスバー4の上向きの門形ブスバー
7′はスペースS2 により第1のブスバー3の平面延設
部6Bを跨いで互いに交叉接触または短絡しないで配設
される。
Finally, the second bus bars 4 having an upwardly-facing gate-shaped bus bar 7 'are provided. That is, the first bus bar 3 having the downward-facing gate-shaped bus bar 6 ′ is
1 and the second bus bar 4 has the space S 2, so that the planar extension 7A of the second bus bar 4 has the space S 1.
Among the, also upward portal bus bar 7 of the second bus bars 4 'are arranged without intersecting contact or shorted together across a planar extending portion 6B of the first bus bar 3 by the space S 2.

【0015】図2は上記積層ブスバー配線板1を電気接
続箱8に収納した状態の要部断面図である。9は電気接
続箱8の上カバー、10は下カバーである。図2に見る
ように、下向きの門形ブスバー6′は絶縁基板21 〜2
4 の上下の一側面に沿って配設され、第1層の絶縁基板
1 から上に突出するのは上向きの門形ブスバー7′と
図示しない前記タブのみである。この上向きの門形ブス
バー7′の高さhは前記タブの突出長さ以下の範囲で任
意に形成することができるから、電気接続箱8の全体の
高さHを図7(B)の高さh0 の分だけ確実に低くし、
小型化することができる。
FIG. 2 is a cross-sectional view of a main part in a state where the laminated bus bar wiring board 1 is housed in an electric connection box 8. 9 is an upper cover of the electric junction box 8, and 10 is a lower cover. As seen in FIG. 2, a downward portal bus bars 6 'insulating substrate 2 1 to 2
Are disposed along one side of the upper and lower 4, to protrude upward from the insulating substrate 2 1 of the first layer is only the tub (not shown) with the upward portal bus bars 7 '. Since the height h of the upward gate-shaped bus bar 7 'can be arbitrarily formed within a range not more than the projection length of the tab, the entire height H of the electric connection box 8 is set to the height shown in FIG. reliably lowered by the amount of h 0,
The size can be reduced.

【0016】図3は図1の第1のブスバー3の下向きの
門形ブスバー6′を上向きの門形ブスバー6″に、ま
た、第2のブスバー4の上向きの門形ブスバー7′を下
向きの門形ブスバー7″に折曲形成して配設した例であ
る。このように、互いに交叉する形状の下向きの門形ブ
スバーと上向きの門形ブスバーとは互いに逆の組み合わ
せが可能である。
FIG. 3 shows the first bus bar 3 of FIG. 1 with the downwardly-facing gate-shaped bus bar 6 'facing upward and the second bus bar 4 with the upwardly-facing portal bus bar 7' facing downward. This is an example in which a gate-shaped bus bar 7 "is bent and formed. In this manner, the downwardly-facing gate-shaped busbars and the upwardly-facing gate-shaped busbars that intersect with each other can be reversely combined.

【0017】図4は本発明の他の実施の形態を示すもの
で、第1のブスバー11の迂回路13が第2のブスバー
12の迂回路14内にすっぽり入り、互いに交叉しない
例である。この場合、第1のブスバー11の迂回路13
に下向きの門形ブスバー13′、第2のブスバー12の
迂回路14に上向きの門形ブスバー14′を折曲形成し
て、図1と同様に配設したものである。
FIG. 4 shows another embodiment of the present invention, in which the detour 13 of the first bus bar 11 completely enters the detour 14 of the second bus bar 12 and does not cross each other. In this case, the detour 13 of the first bus bar 11
A downwardly-facing gate-shaped bus bar 13 'and an upwardly-facing gate-shaped bus bar 14' are formed on the detour 14 of the second bus bar 12 in the same manner as in FIG.

【0018】図4と従来例を示す図7(B)との対比か
ら明らかなように、本発明によれば二つの立ち上がりブ
スバー261 ,262 間の高低差h0 が解消するから、
同様にブスバー配線板の小型化が達成できる。
[0018] Figure 4 and is apparent from comparison with FIG. 7 showing a conventional example (B), since the height difference h 0 between the two rising bus bars 26 1, 26 2 according to the present invention is eliminated,
Similarly, downsizing of the bus bar wiring board can be achieved.

【0019】[0019]

【発明の効果】以上説明したように、本発明によれば、
第1と第2の迂回路はそれぞれ下向きと上向きの門形ブ
スバーとして互いに逆向きに形成してあるから、相互の
接触や短絡を避けるために一方を他方よりも高くする必
要はなく、その分だけブスバー配線板または積層ブスバ
ー配線板の高さを低くすることができ、全体とし小型化
される(請求項1)。また、上記上向きの門形ブスバー
は下向きの門形ブスバーの両側の垂下部を支持連結する
平面延設部の一方を跨いだ状態で配設されるから、迂回
路形成のためのデッドスペースを減らし、ブスバーの配
設密度およびブスバーの金属板からの打抜き歩留りを高
めることができる(請求項2)。さらに、前記複数のブ
スバーには、それぞれ端部,中間部などの所望の位置に
上向きまたは下向きのタブが連成されから、従来のブス
バー配線板と同様に重ね合わせて積層ブスバー配線板を
組立て、電気接続箱の内部回路として使用することがで
きる(請求項3)。
As described above, according to the present invention,
Since the first and second detours are formed as downward and upward gate-shaped bus bars, respectively, in opposite directions, it is not necessary to make one higher than the other in order to avoid mutual contact or short circuit. Only the height of the bus bar wiring board or the laminated bus bar wiring board can be reduced, and the overall size is reduced (claim 1). In addition, since the upward gate-shaped bus bar is disposed so as to straddle one of the planar extending portions that support and connect the hanging parts on both sides of the downward gate-shaped bus bar, the dead space for forming a detour is reduced. The arrangement density of the bus bars and the yield of punching the bus bars from the metal plate can be increased (claim 2). Further, since the plurality of busbars are each formed with an upward or downward tab at a desired position such as an end portion or an intermediate portion, the stacked busbar wiring board is assembled by overlapping the busbars in the same manner as a conventional busbar wiring board. It can be used as an internal circuit of an electric junction box (claim 3).

【図面の簡単な説明】[Brief description of the drawings]

【図1】(A)は本発明の実施の形態の一例を示すブス
バー配線板を積層した状態の斜視図、(B)はその組立
過程を示す斜視図である。
FIG. 1A is a perspective view showing an example of an embodiment of the present invention in which busbar wiring boards are stacked, and FIG. 1B is a perspective view showing an assembling process thereof.

【図2】図1(A)の要部の断面図である。FIG. 2 is a sectional view of a main part of FIG.

【図3】本発明の実施の形態の他の例を示すブスバー配
線板を積層した状態の斜視図である。
FIG. 3 is a perspective view showing a state in which busbar wiring boards according to another embodiment of the present invention are stacked.

【図4】本発明の実施の形態の別の例を示すブスバー配
線板の斜視図である。
FIG. 4 is a perspective view of a bus bar wiring board showing another example of the embodiment of the present invention.

【図5】従来のブスバー配線板の説明図である。FIG. 5 is an explanatory diagram of a conventional bus bar wiring board.

【図6】従来の他のブスバー配線板の要部の斜視図であ
る。
FIG. 6 is a perspective view of a main part of another conventional bus bar wiring board.

【図7】(A)は図6の立ち上がりブスバーの部分の平
面図、(B)は電気接続箱に収納した状態の要部断面図
である。
7A is a plan view of a rising bus bar portion of FIG. 6, and FIG. 7B is a cross-sectional view of a main part in a state where the bus bar is housed in an electric connection box.

【図8】図6の立ち上がりブスバーの展開図である。FIG. 8 is a developed view of the rising bus bar of FIG. 6;

【符号の説明】[Explanation of symbols]

1 積層ブスバー配線板 21 〜24 絶縁基板 3〜5 ブスバー 6,7 迂回路 6A,6B 平面延設部 6a,6b 垂下部 6′ 下向きの門形ブスバー 6″ 上向きの門形ブスバー 7′ 上向きの門形ブスバー 7″ 下向きの門形ブスバー 11,12 ブスバー1 laminated bus bar wiring board 21 to 24 insulating substrate 3-5 busbar 6,7 detour 6A, 6B plane extending portions 6a, 6b suspended portion 6 'downward portal bus bar 6 "upward portal bus bars 7' upwards Gate Busbar 7 "Downward Gate Busbar 11,12 Busbar

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 絶縁基板の同一面上に複数のブスバーを
配設すると共に、該複数のブスバーから選ばれる一のブ
スバーにはチャンネル状に第1の迂回路を設け、他の一
のブスバーにはチャンネル状に第2の迂回路を設けて成
るブスバー配線板であって、前記第1および第2の迂回
路の一方に下向きの門形ブスバーが形成され、他方の迂
回路に上向きの門形ブスバーが形成され、前記絶縁基板
の一側縁において、前記下向きの門形ブスバーは該側縁
に沿って下向きに配設され、前記上向きの門形ブスバー
その下向きの門形ブスバーとほぼ同一面上に延在する
上向きに配設されていることを特徴とするブスバー配線
板。
1. A plurality of bus bars are provided on the same surface of an insulating substrate , a first detour is provided in a channel shape on one bus bar selected from the plurality of bus bars, and the other bus bar is provided on another bus bar. Is a bus bar wiring board provided with a second detour in the form of a channel, wherein a downward gate-shaped bus bar is formed on one of the first and second detours, and an upward gate is formed on the other detour. A bus bar is formed, and at one side edge of the insulating substrate, the downward gate busbar is disposed downward along the side edge, and the upward gate busbar is substantially flush with the downward gate busbar. A bus bar wiring board extending upward and being disposed upward.
【請求項2】 前記上向きの門形ブスバーは下向きの門
形ブスバーの両側の垂下部を支持連結する平面延設部の
一方を跨いだ状態で上向きに配設されている請求項1の
ブスバー配線板。
2. The bus bar wiring according to claim 1, wherein the upwardly-facing gate-shaped bus bar is disposed upwardly so as to straddle one of the plane extending portions that support and connect the hanging portions on both sides of the downwardly-facing gate-shaped bus bar. Board.
【請求項3】 前記複数のブスバーは、それぞれ端部,
中間部などの所望の位置に上向きまたは下向きのタブが
連成されている請求項1または2記載のブスバー配線
板。
3. The plurality of busbars each have an end,
3. The bus bar wiring board according to claim 1, wherein an upward or downward tab is coupled to a desired position such as an intermediate portion.
JP03744797A 1997-02-21 1997-02-21 Busbar wiring board Expired - Fee Related JP3266036B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03744797A JP3266036B2 (en) 1997-02-21 1997-02-21 Busbar wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03744797A JP3266036B2 (en) 1997-02-21 1997-02-21 Busbar wiring board

Publications (2)

Publication Number Publication Date
JPH10243522A JPH10243522A (en) 1998-09-11
JP3266036B2 true JP3266036B2 (en) 2002-03-18

Family

ID=12497766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03744797A Expired - Fee Related JP3266036B2 (en) 1997-02-21 1997-02-21 Busbar wiring board

Country Status (1)

Country Link
JP (1) JP3266036B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100814932B1 (en) 2006-09-12 2008-03-19 한국단자공업 주식회사 Bus-bar assembly
JP2017195324A (en) * 2016-04-22 2017-10-26 株式会社オートネットワーク技術研究所 Circuit structure and electrical junction box

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2514429Y2 (en) * 1988-02-05 1996-10-16 矢崎総業株式会社 Bus bar wiring board
JPH08256420A (en) * 1995-03-17 1996-10-01 Yazaki Corp Bus bar wiring board

Also Published As

Publication number Publication date
JPH10243522A (en) 1998-09-11

Similar Documents

Publication Publication Date Title
JPH09172136A (en) Power semiconductor module with several submodules
JPH098192A (en) Power semiconductor module with connection pin
JP3446672B2 (en) Electrical junction box
JP2514429Y2 (en) Bus bar wiring board
JP3266036B2 (en) Busbar wiring board
JP2569292Y2 (en) Laminated busbar wiring board
JPH1146426A (en) Electric connection box
JP5177801B2 (en) Electrical junction box
EP1342397B1 (en) Circuit structure for electrical connection box and method of forming circuit thereof
JP3736342B2 (en) Method for forming junction box and connector module
JP2700112B2 (en) How to change the busbar circuit
JP2000032629A (en) Wiring board assembly and its manufacture
JP2512028Y2 (en) Electrical junction box
JPS622783Y2 (en)
JPH0357058Y2 (en)
JPH028772Y2 (en)
JPH0231793Y2 (en)
JP4561205B2 (en) Inverter device
JP2002008759A (en) High insulating stud and printed circuit board having the same
JP3736341B2 (en) Method for forming circuit board to be accommodated in junction box and junction box for accommodating circuit board
JP2002299800A (en) Method of forming circuit using printed-wiring board
JPH0241612A (en) Laminated bus-bar distribution board and treating method of bus bar circuit
JP2001286032A (en) Internal circuit connection method of junction box and connection structure
JPH0685613B2 (en) Busbar wiring board and electrical junction box
JPH1186933A (en) Controller

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20011120

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090111

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100111

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100111

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110111

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110111

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120111

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120111

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130111

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140111

Year of fee payment: 12

LAPS Cancellation because of no payment of annual fees