JPS62248298A - Manufacture of cubicle with three-dimensional circuit - Google Patents
Manufacture of cubicle with three-dimensional circuitInfo
- Publication number
- JPS62248298A JPS62248298A JP9136586A JP9136586A JPS62248298A JP S62248298 A JPS62248298 A JP S62248298A JP 9136586 A JP9136586 A JP 9136586A JP 9136586 A JP9136586 A JP 9136586A JP S62248298 A JPS62248298 A JP S62248298A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- casing
- circuit
- melting point
- development
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 238000011161 development Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 229920006351 engineering plastic Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、内面に立体形回路を有する筐体の製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method of manufacturing a casing having a three-dimensional circuit on its inner surface.
電子機器用の筐体の内面に回路を立体的に形成できれば
機器の小型化にきわめて有効である。If a circuit can be three-dimensionally formed on the inner surface of a housing for electronic equipment, it will be extremely effective in downsizing the equipment.
最近この目的に合うものとして、樹脂を所望の形にモー
ルド成形すると同時に、その表面に回路パターンを一体
に形成する技術が開発されている。Recently, a technique has been developed to meet this purpose, in which resin is molded into a desired shape and, at the same time, a circuit pattern is integrally formed on its surface.
しかし従来の方法は、成形用の金型に回路パターン用の
溝を形成し、そこに導電材料を埋めてから樹脂の射出成
形を行う方式であるため、金型の加工がきわめて複雑、
微細化し、コスト高になる欠点がある。また射出成形時
に樹脂成形体と回路パターンが一体化されてしまうため
、樹脂成形体に電磁シールド用のメッキなどを施すこと
が困難である。さらに射出成形用の樹脂としては、部品
実装時の半田付けの熱に耐えられるようにスーパーエン
ジニアリングプラスチックと称する高耐熱性の樹脂が使
用されているが、この樹脂はきわめて高価であり、成形
性も悪いという難点がある。However, the conventional method involves forming a groove for a circuit pattern in a mold, filling the groove with a conductive material, and then injection molding the resin, making mold processing extremely complicated.
It has the disadvantage of being miniaturized and increasing costs. Furthermore, since the resin molded body and the circuit pattern are integrated during injection molding, it is difficult to plate the resin molded body for electromagnetic shielding. Furthermore, a highly heat-resistant resin called super engineering plastic is used as the resin for injection molding in order to withstand the heat of soldering during component mounting, but this resin is extremely expensive and has poor moldability. There is a drawback that it is bad.
また上記以外の方法としては、＠離性シート上に回路バ
クーンが印刷された転写シートを射出成形用の金型内に
設置して、樹脂の射出成形を行い、その後上記剥離性シ
ートを剥がすことにより、成形された樹脂基板と回路パ
ターンを一体化する技術も開示されている（特開昭６０
−１２１７９１号公報）。Another method other than the above is to place a transfer sheet with a circuit board printed on a releasable sheet in an injection mold, perform injection molding of the resin, and then peel off the releasable sheet. also disclosed a technique for integrating a molded resin substrate and a circuit pattern (Japanese Patent Application Laid-Open No. 1989-1999)
-121791).
しかしこの方法は平面的な回路を形成するものであり、
回路の立体化については全く考慮されていない。However, this method forms a planar circuit,
There is no consideration given to the three-dimensional structure of the circuit.
本発明は、上記のような従来技術の問題点に鑑み、内面
に立体的な回路を有する筐体を容易に低コストで製造す
る方法を提供するものである。In view of the problems of the prior art as described above, the present invention provides a method for easily manufacturing a casing having a three-dimensional circuit on its inner surface at low cost.
この目的を達成するため本発明は、立体形回路を有する
筐体の製造方法を次のような工程から構成したことを特
徴とするものである。すなわち、回路を形成する面を展
開した形の展開筐体をモールド成形する工程、上記展開
筐体の内外面の少な（とも一方の面に電磁シールド材を
被覆する工程、ネリ離性シート上に導電ペーストによる
回路パターンを印刷してなる転写シートを、上記展開筐
体の展開面に載せ、回路パターンを転写する工程、転写
した回路パターン上に低融点半田にて部品を実装する工
程、および上記展開筐体の展開面を折り曲げて筐体を形
成する工程、から成る点である。In order to achieve this object, the present invention is characterized in that a method for manufacturing a casing having a three-dimensional circuit is comprised of the following steps. That is, the process of molding a deployable casing with the surface forming the circuit expanded, the step of coating the inner and outer surfaces of the deployable casing (one surface of both) with an electromagnetic shielding material, and the process of coating an electromagnetic shielding material on the neri-releasable sheet. A process of placing a transfer sheet formed by printing a circuit pattern using conductive paste on the development surface of the development case and transferring the circuit pattern, a process of mounting components on the transferred circuit pattern with low melting point solder, and the above-mentioned steps. It consists of a step of bending the unfolded surface of the unfolded casing to form the casing.
このような構成をとる理由は、筐体を展開した形に成形
することにより回路パターンの転写や部品実装を容易に
し、また展開一体に回路パターンを形成する前にＴｉ電
磁シールド材被覆することにより電磁シールド材の被覆
を容易にし、また部品実装を低融点半田で行うことによ
り耐熱性の比較的低い汎用エンジニアリングプラスチッ
クの使用を可能にし、さらに回路成形後に展開面を折り
曲げることにより立体的な回路が簡単に構成できるよう
にするためである。The reason for this configuration is that by molding the casing into an expanded shape, it is easier to transfer the circuit pattern and mount components, and by coating the casing with a Ti electromagnetic shielding material before forming the circuit pattern on the expanded unit. By making it easier to cover with electromagnetic shielding material, and by mounting components with low-melting-point solder, it is possible to use general-purpose engineering plastics with relatively low heat resistance.Furthermore, by folding the developed surface after circuit molding, three-dimensional circuits can be formed. This is to enable easy configuration.
以下、本発明の実施例を第１図を参照して詳細に説明す
る。Hereinafter, embodiments of the present invention will be described in detail with reference to FIG.
本発明の方法では、まず射出成形により展開筺体１１を
製造する。この展開筺体１１は底板１２と一つの側壁１
３と蓋板１４とを展開した形で、底板１２と側壁１３の
境、側壁１３と蓋板１４の境にそれぞれ折り曲げを容易
にするための溝１５が形成されている。このほか展開筺
体１１には、ケーブル装着凹部１６、ケーブル装着凸部
１７、掛は止め鉤部１８、掛は止め溝部１９などが形成
されている。In the method of the present invention, first, the unfolded housing 11 is manufactured by injection molding. This deployment housing 11 has a bottom plate 12 and one side wall 1.
Grooves 15 are formed at the boundary between the bottom plate 12 and the side wall 13 and between the side wall 13 and the lid plate 14 to facilitate bending, respectively. In addition, the deployment housing 11 is formed with a cable mounting recess 16, a cable mounting protrusion 17, a hook portion 18, a hook portion 19, and a groove portion 19.
次に、成形された展開筐体１１の全面に無電解メッキ法
などにより電磁シールド用のニッケルメッキ（図示せず
）を施す。Next, nickel plating (not shown) for electromagnetic shielding is applied to the entire surface of the molded expanded housing 11 by electroless plating or the like.
一方、上記工程とは別に、回路パターンの転写シート（
図示せず）を用意する。転写シートは、剥離性シート上
に導電ペーストによる回路パターンを印刷したものであ
る０回路パターンは一層だけでなく多層に形成すること
も可能であり、その場合は各層の回路パターンの間に絶
縁層を介在させる０回路パターンの表面には接着性樹脂
層が設けられる。このような転写シートを、その回路パ
ターン側を下にして上記展開筺体１１の展開面に載置し
、加熱加圧したのち、剥離性シートを引き剥がすことに
より、上記展開面に回路パターン２０を転写する０回路
パターン２０は上記接着性樹脂層により展開面上のメッ
キ層に接着し、かつそのメッキ層と絶縁される。On the other hand, apart from the above process, a circuit pattern transfer sheet (
(not shown). A transfer sheet is a releasable sheet with a circuit pattern printed on it using conductive paste.The circuit pattern can be formed not only in one layer but also in multiple layers, in which case an insulating layer is placed between each layer of circuit patterns. An adhesive resin layer is provided on the surface of the 0 circuit pattern interposed therebetween. The circuit pattern 20 is placed on the development surface of the development case 11 with the circuit pattern side facing down, heated and pressurized, and then the peelable sheet is peeled off to form the circuit pattern 20 on the development surface. The 0 circuit pattern 20 to be transferred is adhered to the plating layer on the developed surface by the adhesive resin layer and is insulated from the plating layer.
次に回路パターン２０の部品実装位置にクリーム状低融
点半田２１を塗布し、その上に必要な電子部品を！３Ｉ
置する。図には電子部品の一部として、Ｂ３１２２、抵
抗２３、ケーブル２４を接続するためのコネクタ２５、
差込み接続用のコネクタ２６などを示した。いずれの電
子部品も表面実装型である。電子部品を載置したのち、
リフロー炉に通し、回路パターン２０と電子部品との半
田付けを行う、この半田付は時の熱で展開筺体１１が損
傷を受けないように、半田としては低融点半田が用いら
れる。Next, apply creamy low melting point solder 21 to the component mounting position of the circuit pattern 20, and place the necessary electronic components on top! 3I
place The figure shows a B3122, a resistor 23, a connector 25 for connecting a cable 24, as part of the electronic components.
A connector 26 for plug-in connection, etc. are shown. Both electronic components are surface-mounted. After placing the electronic components,
The circuit pattern 20 and the electronic component are soldered by passing through a reflow oven. In this soldering, a low melting point solder is used to prevent the development casing 11 from being damaged by the heat.
一般の半田は、融点が約１８０℃で、リフロー炉内の温
度は２５０〜３００℃にする必要があるが、低融点半田
の融点は約１４０〜１５０℃であり、リフロー炉内の温
度は約２００℃でよい、このため筐体用の樹脂として汎
用エンジニアリングプラスチックの使用が可能となる。General solder has a melting point of about 180°C, and the temperature in the reflow oven needs to be 250 to 300°C, but low melting point solder has a melting point of about 140 to 150°C, and the temperature in the reflow oven needs to be about 250 to 300°C. The temperature may be 200°C, which makes it possible to use general-purpose engineering plastics as the resin for the casing.
低融点半田としては、カドミウム入り半田（Ｓｎ５０、
Ｐｂ ３０． Ｃｄ １８、Ａｇ２、各％）、ビスマス
入り半田（Ｓｎ４５、Ｐｂ４０、Ｂ１１５、各％）、イ
ンジウム半田（Ｐｂ１５、Ａｇ５、！ｎ８０、各％）な
どが使用可能である。As a low melting point solder, cadmium-containing solder (Sn50,
Pb30. Cd 18, Ag2, each %), bismuth-containing solder (Sn45, Pb40, B115, each %), indium solder (Pb15, Ag5, !n80, each %), etc. can be used.
半田付は終了後、展開筺体１１の展開面を溝１５のとこ
ろで折り曲げて、掛は止め鉤部１８を掛は止め溝部１９
に掛けると、内面に立体的な回路を有する筐体が出来あ
がる。このときケーブル２４はケーブル装着凹部１６と
ケーブル装着凸部１７の間に挟持される。After soldering is completed, bend the unfolded surface of the unfolded housing 11 at the groove 15 and attach the hooking hook portion 18 to the hooking groove portion 19.
When hung, a housing with a three-dimensional circuit inside is created. At this time, the cable 24 is held between the cable mounting recess 16 and the cable mounting protrusion 17.
なお上記実施例においては、低融点半田で電子部品を実
装する場合について述べたが、前記低融点半田の代わり
にＲ電性接着剤で電子部品を実装してもよい。In the above embodiments, a case has been described in which electronic components are mounted using low melting point solder, but electronic components may be mounted using an R-conducting adhesive instead of the low melting point solder.
また上記実施例では、！磁シールド用のメッキを展開筐
体の全面に施したが、メッキは展開筐体の内面または外
面のみに施してもよい。また電磁シールド材の被覆は、
メッキ以外の手段、例えば導電塗料の塗布によることも
可能である。Moreover, in the above example,! Although the magnetic shielding plating is applied to the entire surface of the expansion case, plating may be applied only to the inner or outer surface of the expansion case. In addition, the coating of electromagnetic shielding material is
It is also possible to use means other than plating, for example, by applying a conductive paint.
以上の説明から明らかなように本発明によれば次のよう
な効果がある。As is clear from the above description, the present invention has the following effects.
（１＋ 回路を形成する面を展開した形の展開筐体を
作り、その展開面に回路パターンを転写により形成する
ようにしたので、回路パターンの形成、部品の実装が容
易であり、また部品実装後にその展開面を折り曲げるこ
とにより簡単に立体形回路を形成できる。(1+ We created a development case with the surface on which the circuit is to be formed expanded, and the circuit pattern was formed on the development surface by transfer, making it easy to form the circuit pattern and mount the components. A three-dimensional circuit can be easily formed by folding the expanded surface later.
（２）回路パターンを転写により形成するため、金型に
回路パターン用の溝を形成する必要がな（、金型製作が
容易で、かつ安価である。(2) Since the circuit pattern is formed by transfer, there is no need to form a groove for the circuit pattern in the mold (the mold is easy to manufacture and inexpensive).
（３） 回路パターン転写の前に展開筐体に電磁シー
ルド材を被覆しているため、電磁シールド材の被覆が回
路パターンと関係なく簡単に行える。(3) Since the expanded casing is coated with the electromagnetic shielding material before the circuit pattern is transferred, the electromagnetic shielding material can be easily coated regardless of the circuit pattern.
（４） 部品実装には低融点半日または導電性接着剤
を用いているため、耐熱性の高い高価なプラスチックを
使用する必要がなく、コスト安である。(4) Since a low melting point adhesive or conductive adhesive is used for component mounting, there is no need to use expensive plastic with high heat resistance, and the cost is low.
第１図は本発明の一実施例に係る筐体の製造方法におけ
る一過程を示す斜視図である。
１１〜展開筐体、１５〜溝、２０〜回路パターン、２１
〜低融点半田、２２−ＬＳＩ、２３〜抵抗。FIG. 1 is a perspective view showing one process in a method for manufacturing a casing according to an embodiment of the present invention. 11~Development housing, 15~Groove, 20~Circuit pattern, 21
~Low melting point solder, 22-LSI, 23~Resistance.
Claims (1)
成形する工程、上記展開筐体の内外面の少なくとも一方
の面に電磁シールド材を被覆する工程、剥離性シート上
に導電ペーストによる回路パターンを印刷してなる転写
シートを、上記展開筐体の展開面に載せ、回路パターン
を転写する工程、転写した回路パターン上に低融点半田
または導電性接着剤にて部品を実装する工程、および上
記展開筐体の展開面を折り曲げて筐体を形成する工程、
を含む立体形回路を有する筐体の製造方法。A step of molding a deployable casing with a surface on which a circuit is to be formed expanded, a step of coating at least one of the inner and outer surfaces of the deployable casing with an electromagnetic shielding material, and a circuit pattern using conductive paste on a removable sheet. A process of placing a printed transfer sheet on the development surface of the development case and transferring the circuit pattern, a process of mounting components on the transferred circuit pattern with low melting point solder or conductive adhesive, and the above-mentioned steps. a step of folding the unfolded surface of the unfolded casing to form a casing;
A method for manufacturing a casing having a three-dimensional circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9136586A JPS62248298A (en) | 1986-04-22 | 1986-04-22 | Manufacture of cubicle with three-dimensional circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9136586A JPS62248298A (en) | 1986-04-22 | 1986-04-22 | Manufacture of cubicle with three-dimensional circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62248298A true JPS62248298A (en) | 1987-10-29 |
Family
ID=14024353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9136586A Pending JPS62248298A (en) | 1986-04-22 | 1986-04-22 | Manufacture of cubicle with three-dimensional circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62248298A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4958260A (en) * | 1987-09-08 | 1990-09-18 | The Furukawa Electric Co., Ltd. | Molded circuit board |
| JP2007533144A (en) * | 2004-04-19 | 2007-11-15 | レンツェ・ドライブ・システムズ・ゲーエムベーハー | Method for manufacturing power electronics equipment by bending |
| WO2012038997A1 (en) * | 2010-09-21 | 2012-03-29 | 三菱電機株式会社 | Light source lighting device and manufacturing method therefor |
-
1986
- 1986-04-22 JP JP9136586A patent/JPS62248298A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4958260A (en) * | 1987-09-08 | 1990-09-18 | The Furukawa Electric Co., Ltd. | Molded circuit board |
| JP2007533144A (en) * | 2004-04-19 | 2007-11-15 | レンツェ・ドライブ・システムズ・ゲーエムベーハー | Method for manufacturing power electronics equipment by bending |
| JP4913039B2 (en) * | 2004-04-19 | 2012-04-11 | レンツェ・ドライブ・システムズ・ゲーエムベーハー | Method for manufacturing power electronics equipment by bending |
| WO2012038997A1 (en) * | 2010-09-21 | 2012-03-29 | 三菱電機株式会社 | Light source lighting device and manufacturing method therefor |
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