JPS62163390A - External work of printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for processing the contour of a printed circuit board for manufacturing a semiconductor chip carrier such as a bin grid array (PGA) or a leadless chip carrier (LCC).

[Background Art 1 Conventionally, a semiconductor chip is mounted on a printed circuit board, and the external shape is processed by punching, saw teeth, router, etc., and this is used as a semiconductor chip carrier.
Conductors such as the conductor pattern and plated lead #i are exposed on the cut surface after external processing, and when handling, the static electricity charged on the handler is transferred to the semiconductor chip through the exposed conductors. There was a problem in that the semiconductor chip could be destroyed by electricity. Also, moisture was absorbed from this cut surface, resulting in poor moisture resistance.

For this reason, the ylTL process has become complicated due to the need for separate treatments such as fat coating.6 [Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to However, a resin coating layer can be formed on the conductor exposed on the cut surface of the printed circuit board at the same time as the external shape processing, and the mounted semiconductor chip can be prevented from being destroyed by static electricity from the handler without requiring a separate process such as resin coating. It is an object of the present invention to provide a method for processing the external shape of a printed circuit board, which can suppress moisture absorption from the cut surface and produce semiconductor chip carriers and the like with high N moisture.

[Disclosure 1 of the Invention The printed circuit board processing method of the present invention is an external processing method of cutting the printed circuit board 1 into predetermined dimensions,
The outer shape of the printed circuit board 1 is punched out using a vibration punching press, and the A1 lipid wave meter layer 5 is melted using vibration energy to melt the high-density resin layer 3 located on the cut surface 2 of the printed circuit board 1 to form an A1 lipid wave meter layer 5 on the conductor 4 exposed on the cut surface 2 of the printed circuit board 1. This structure is characterized in that it is coated with .The above object can be achieved by this structure. That is, at the same time as the outer shape of the printed circuit board 1 is punched out, the conductor 4 exposed on the cut surface 2 of the printed circuit board 1 is
(It can cover the fat limb covering layer 5, and does not require separate treatment such as resin coating as in the conventional method.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the present invention, the printed circuit board 1 is manufactured from a metal foil-clad laminate or the like by a well-known process. For example, in the subtractive method, a copper-clad laminate is sequentially subjected to drilling, activation treatment, electroless plating, screen printing or exposure C/development (plating renost), heavy impregnation, copper plating, and electrolytic plating. It is manufactured through processes such as (enching lenost), plating lenost peeling, etching, hunong, turgule nostro printing, external finishing, and symbol mark printing.

Money! G The foil-clad laminate 1 is made by placing metal foil on the top of a plurality of resin-impregnated base materials, which will become the insulating resin layer 3, for example, and placing the plurality of sets between hot plates via forming plates as a set. For example, 1.20″C or more, 20-150kg/
It is obtained by heating and pressing at ca+2.40-100 minutes to integrate the layers. Alternatively, a resin substrate may be used in which a resin impregnated base material, metal foil is placed on a metal substrate, or only the chip mounting area is metal.

Resin-impregnated base material is paper, glass cloth, glass paper, S
It is manufactured by impregnating a base material such as MC with phenol resin, imide resin, epoxy resin, unsaturated polyester resin, etc. and drying it. A die bonding portion 7 is formed in a mounting recess provided directly on the surface of this printed circuit board 1 or by mechanical cutting such as milling, and a semiconductor chip 8 is mounted on this die bonding portion 7.
The wire 9 is electrically connected to the conductor pattern 4a.

In this case, the conductor pattern 4a portion-2 to which the wire 9 is connected is plated with gold in order to improve the familiarity with the wire 9 by the through-hole land wire 4b. In this way, the printed circuit board 1 with the semiconductor chip 8 mounted thereon is punched out along the contour line to form the semiconductor chip carrier A. During this punching process, shake the printed circuit board 1! l! I.J.
The outer shape of the printed circuit board 1 is punched out using a punching press, and the insulating resin 1vi3 located on the cut surface 2 of the printed circuit board 1 is melted by vibration energy to form a wave meter on the entire surface of the cut surface 2 of the printed circuit board 1. 1 layer 5 is formed on the exposed conductor 4! (
A wave gauge top layer 5 is applied. The vibration punching press is performed by, for example, setting vibration conditions, operating an actuator in accordance with a command signal from a control VC device, and vibrating the upper and lower punches. For example, the basic waveform of the punch vibration waveform is 50
11z, a sine wave with a half amplitude of 0.33 mm.

-lr))Ql+lISill:"Knee 1?-11 decia4.2$-...d4s-Ifj-Δ, the electrostatic damage of the semiconductor chip 8 is zero, and the moisture absorption from the outer peripheral end surface is It is about 174 to 1/2 of the conventional value.

In practical use, the semiconductor chip 8 is sealed with a sealing resin such as epoxy resin, and the through holes 10 hold terminal bins to form a bin grid array, and the through holes 10 can be used as connection holes. 8! By making this possible, it can be used as a leadless chip carrier. Also, if necessary, cover the semiconductor chip carrier A with a cover made of ceramic or the like! and put it into practical use.

[Effects of the Invention j] In the present invention, a printed circuit board is punched out by a vibration punching press, and an insulating fat layer located on the cut surface of the printed circuit board is melted by vibration energy and exposed on the cut surface of the printed circuit board. Since the conductor is coated with resin coating waste, it is printed at the same time as the outer shape of the printed circuit board is punched out.
The conductor exposed on the cut surface of the board can be coated with a resin coating layer,
Unlike conventional methods, there is no need for additional processing such as wood coating, and the mounted semiconductor chip will not be destroyed by static electricity from the handler.Moreover, moisture absorption from the cut surface can be suppressed, making it highly moisture resistant. It is possible to manufacture high quality semiconductor chip carriers.

[Brief explanation of drawings]

Fig. 1 is a plan view showing a printed circuit board of a punched type according to an embodiment of the present invention, Fig. 2 is a sectional view taken along line XX in Fig. 1,
FIG. 3 is a partially omitted perspective view showing a semiconductor chip carrier manufactured by the same method as above, and FIG. 4 is a YY cross-sectional view of FIG. 3, in which A is a semiconductor chip carrier, 1 is a printed circuit board,
2 is a cut surface, 3 is an insulating resin layer, 4 is a conductor, and 5 is a resin coating layer.

Claims (1)

[Claims] (1) An external shape processing method in which a printed circuit board is cut into predetermined dimensions, in which the printed circuit board is punched out using a vibration punching press, and the insulating resin layer located on the cut surface of the printed circuit board is melted by vibration energy to form the printed circuit board. A printed circuit board external shaping method characterized by coating a conductor exposed at a cut surface with a resin coating layer.