JPH02102770U - - Google Patents
Info
- Publication number
- JPH02102770U JPH02102770U JP991089U JP991089U JPH02102770U JP H02102770 U JPH02102770 U JP H02102770U JP 991089 U JP991089 U JP 991089U JP 991089 U JP991089 U JP 991089U JP H02102770 U JPH02102770 U JP H02102770U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- board part
- printed wiring
- board
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Description
第１図は本考案による多層プリント配線板の実
施例の断面概要図、第２図及び第３図は本考案に
よる多層プリント配線板の他の実施例を示す断面
概要図、第４図〜第７図は従来の多層プリント配
線板の例を示す断面概要図である。
１：複合多層基板、２：硬質基板部、３：フレ
キシブル基板部、６：表面層の回路導体、７：内
層の回路導体、１５：開口部。
FIG. 1 is a schematic cross-sectional view of an embodiment of the multilayer printed wiring board according to the present invention, FIGS. 2 and 3 are schematic cross-sectional views showing other embodiments of the multilayer printed wiring board according to the present invention, and FIGS. FIG. 7 is a schematic cross-sectional view showing an example of a conventional multilayer printed wiring board. 1: Composite multilayer board, 2: Hard board part, 3: Flexible board part, 6: Circuit conductor on surface layer, 7: Circuit conductor on inner layer, 15: Opening part.
Claims (1)
した複合多層基板の表面層に電子部品を実装して
なる多層プリント配線板において、硬質基板部に
開口部を設けて内層のフレキシブル基板部の回路
導体を露出させ、前記開口部に電子部品が配置さ
れ上記内層の回路導体に実装されたのち、樹脂に
より前記開口部を封止してなることを特徴とする
多層プリント配線板。 In a multilayer printed wiring board in which electronic components are mounted on the surface layer of a composite multilayer board in which a hard board part and a flexible board part are bonded and laminated, an opening is provided in the hard board part and the circuit conductor of the inner layer flexible board part is inserted. A multilayer printed wiring board characterized in that the opening is exposed, electronic components are arranged in the opening, mounted on the circuit conductor of the inner layer, and then the opening is sealed with a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP991089U JPH02102770U (en) | 1989-02-01 | 1989-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP991089U JPH02102770U (en) | 1989-02-01 | 1989-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102770U true JPH02102770U (en) | 1990-08-15 |
Family
ID=31217072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP991089U Pending JPH02102770U (en) | 1989-02-01 | 1989-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102770U (en) |
-
1989
- 1989-02-01 JP JP991089U patent/JPH02102770U/ja active Pending
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