JPH0472667U - - Google Patents
Info
- Publication number
- JPH0472667U JPH0472667U JP11589890U JP11589890U JPH0472667U JP H0472667 U JPH0472667 U JP H0472667U JP 11589890 U JP11589890 U JP 11589890U JP 11589890 U JP11589890 U JP 11589890U JP H0472667 U JPH0472667 U JP H0472667U
- Authority
- JP
- Japan
- Prior art keywords
- iron
- foil
- pasted
- adhesive
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図は、鉄ベース基板の断面図、第２図は、
鉄ベース基板接着時の断面図。
ａは銅箔、ｂは電解鉄箔、ｃはガラスエポキシ
樹脂、Ｄ１，Ｄ２は熱板、Ｅ１，Ｅ２はステンレ
ス鏡面板。
Figure 1 is a cross-sectional view of the iron-based substrate, Figure 2 is
Cross-sectional view when bonding an iron base substrate. a is copper foil, b is electrolytic iron foil, c is glass epoxy resin, D1 and D2 are hot plates, and E1 and E2 are stainless steel mirror plates.
Claims (1)
をベースに銅箔を張りつけた構造をもつ鉄ベース
プリント配線基板材料。 An iron-based printed wiring board material that has a structure in which several sheets of electrolytic iron foil are laminated together with adhesive and copper foil is pasted on the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11589890U JPH0472667U (en) | 1990-11-02 | 1990-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11589890U JPH0472667U (en) | 1990-11-02 | 1990-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472667U true JPH0472667U (en) | 1992-06-26 |
Family
ID=31863707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11589890U Pending JPH0472667U (en) | 1990-11-02 | 1990-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472667U (en) |
-
1990
- 1990-11-02 JP JP11589890U patent/JPH0472667U/ja active Pending
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