JPH0363964U - - Google Patents
Info
- Publication number
- JPH0363964U JPH0363964U JP12359789U JP12359789U JPH0363964U JP H0363964 U JPH0363964 U JP H0363964U JP 12359789 U JP12359789 U JP 12359789U JP 12359789 U JP12359789 U JP 12359789U JP H0363964 U JPH0363964 U JP H0363964U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- circuit board
- adhesive
- fitting groove
- metal plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
図−１は本考案の一実施例に係るヒートパイプ
埋め込み回路基板を示す断面図、図−２は本考案
に係る回路基板の表面の温度分布を示す説明図、
図−３は従来の回路基板の表面の温度分布を示す
説明図である。
１１Ａ，１１Ｂ……金属プレート、１２……ヒ
ートパイプ、１３，１４……プリント回路基板、
１５Ａ，１５Ｂ……ヒートパイプ嵌め込み溝、１
６，１７，１８……接着材。
FIG. 1 is a cross-sectional view showing a heat pipe embedded circuit board according to an embodiment of the present invention, FIG. 2 is an explanatory diagram showing the temperature distribution on the surface of the circuit board according to the present invention,
FIG. 3 is an explanatory diagram showing the temperature distribution on the surface of a conventional circuit board. 11A, 11B... Metal plate, 12... Heat pipe, 13, 14... Printed circuit board,
15A, 15B... Heat pipe fitting groove, 1
6, 17, 18...adhesive material.
Claims (1)
枚の金属プレートを、上記嵌め込み溝内にヒート
パイプを収納して、接着材を介して接合すると共
に、少なくとも一方の金属プレートの外面に接着
材を介してプリント回路基板を接合したことを特
徴とするヒートパイプ埋め込み回路基板。 2 with a heat pipe fitting groove formed on the opposing surface
A heat pipe is housed in the fitting groove and the two metal plates are bonded together using an adhesive, and a printed circuit board is bonded to the outer surface of at least one of the metal plates via an adhesive. Heat pipe embedded circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12359789U JPH0363964U (en) | 1989-10-24 | 1989-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12359789U JPH0363964U (en) | 1989-10-24 | 1989-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363964U true JPH0363964U (en) | 1991-06-21 |
Family
ID=31671564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12359789U Pending JPH0363964U (en) | 1989-10-24 | 1989-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363964U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280660A (en) * | 2001-03-16 | 2002-09-27 | Furukawa Electric Co Ltd:The | Light source constituted of laser diode module |
| JP2002280659A (en) * | 2001-03-16 | 2002-09-27 | Furukawa Electric Co Ltd:The | Light source constituted of laser diode module |
-
1989
- 1989-10-24 JP JP12359789U patent/JPH0363964U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280660A (en) * | 2001-03-16 | 2002-09-27 | Furukawa Electric Co Ltd:The | Light source constituted of laser diode module |
| JP2002280659A (en) * | 2001-03-16 | 2002-09-27 | Furukawa Electric Co Ltd:The | Light source constituted of laser diode module |
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