JPS6240871U - - Google Patents
Info
- Publication number
- JPS6240871U JPS6240871U JP13257685U JP13257685U JPS6240871U JP S6240871 U JPS6240871 U JP S6240871U JP 13257685 U JP13257685 U JP 13257685U JP 13257685 U JP13257685 U JP 13257685U JP S6240871 U JPS6240871 U JP S6240871U
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive layer
- depth
- utility
- polyolefin resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012787 coverlay film Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 claims description 4
- 229920005672 polyolefin resin Polymers 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Description
第１図は本考案に係るフレキシブルプリント回
路用カバーレイフイルムの断面図、第２図は従来
のカバーレイ付きフレキシブルプリント回路板の
断面図、第３図は貫通孔を有する従来のカバーレ
イ付きフレキシブルプリント回路板の断面図、第
４図は本考案の実施例による貫通孔を有するカバ
ーレイフイルム付きフレキシブルプリント回路板
の断面図である。
１…基材フイルム、２…接着剤層、３…離型紙
、４…金属回路部、５…空隙、６…貫通孔、１１
…基材フイルム、２１…接着剤層。
Fig. 1 is a sectional view of a coverlay film for a flexible printed circuit according to the present invention, Fig. 2 is a sectional view of a conventional flexible printed circuit board with a coverlay, and Fig. 3 is a sectional view of a conventional flexible printed circuit board with a coverlay having through holes. Cross-sectional view of printed circuit board FIG. 4 is a cross-sectional view of a flexible printed circuit board with a cover lay film having through holes according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Base film, 2...Adhesive layer, 3...Release paper, 4...Metal circuit part, 5...Gap, 6...Through hole, 11
... Base film, 21 ... Adhesive layer.
Claims (1)
状凹凸模様をつけた離型紙３をラミネートしてな
るフレキシブルプリント回路板用カバーレイフイ
ルム。 (2) 波状凹凸の深さが接着剤層の平均厚さの２
／３以下であり、その大きさが深さと同じか、ま
たは５倍以内である実用新案登録請求の範囲第１
項記載のカバーレイフイルム。 (3) 離型紙がポリオレフイン樹脂フイルムまた
はポリオレフイン樹脂ラミネート紙である実用新
案登録請求の範囲第１項記載のカバーレイフイル
ム。[Claims for Utility Model Registration] (1) A cover lay film for a flexible printed circuit board, which is made by laminating a release paper 3 with a wavy pattern on a base film 1 via an adhesive layer 2. (2) The depth of the wavy irregularities is 2 times the average thickness of the adhesive layer.
/3 or less and the size is the same as the depth or less than 5 times the first claim for utility model registration.
Cover lay film as described in section. (3) The coverlay film according to claim 1, wherein the release paper is a polyolefin resin film or a polyolefin resin laminated paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13257685U JPS6240871U (en) | 1985-08-30 | 1985-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13257685U JPS6240871U (en) | 1985-08-30 | 1985-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240871U true JPS6240871U (en) | 1987-03-11 |
Family
ID=31032093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13257685U Pending JPS6240871U (en) | 1985-08-30 | 1985-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03295638A (en) * | 1989-09-29 | 1991-12-26 | Shin Etsu Chem Co Ltd | Cover lay film |
-
1985
- 1985-08-30 JP JP13257685U patent/JPS6240871U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03295638A (en) * | 1989-09-29 | 1991-12-26 | Shin Etsu Chem Co Ltd | Cover lay film |
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