JPS61174780U - - Google Patents
Info
- Publication number
- JPS61174780U JPS61174780U JP5989985U JP5989985U JPS61174780U JP S61174780 U JPS61174780 U JP S61174780U JP 5989985 U JP5989985 U JP 5989985U JP 5989985 U JP5989985 U JP 5989985U JP S61174780 U JPS61174780 U JP S61174780U
- Authority
- JP
- Japan
- Prior art keywords
- masking
- sheet
- printed circuit
- circuit board
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000873 masking effect Effects 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ないし第５図は本考案に係るプリント基
板のデイツプ半田付け用マスキングシートの具体
的実施例を示し、第１図は全体概略斜視図、第２
図は部分的な拡大断面図、第３図は部分的な拡大
平面図、第４図は別実施例の要部の拡大平面図、
そして、第５図イ，ロ，ハは夫々その使用手順を
説明するための全体概略斜視図である。また、第
６図は本考案の技術的背景および従来技術を説明
するためのものであつて、プリント基板の全体概
略斜視図を示している。
Ａ…プリント基板、Ｂ…プリント基板のデイツ
プ半田付け面、Ｄ…デイツプ半田付け面における
マスキング必要箇所、Ｓ…シート、１…マスキン
グ用膜体、２…接着剤層、３…離型用紙、４…マ
スキング部分、５Ａ…分離用スリツト、５Ｂ…分
離用孔。
1 to 5 show specific embodiments of the masking sheet for dip soldering of printed circuit boards according to the present invention, and FIG. 1 is an overall schematic perspective view, and FIG.
The figure is a partially enlarged sectional view, FIG. 3 is a partially enlarged plan view, and FIG. 4 is an enlarged plan view of the main part of another embodiment.
FIGS. 5A, 5B, and 5C are overall schematic perspective views for explaining the procedure for using the device. Further, FIG. 6 is for explaining the technical background of the present invention and the prior art, and shows an overall schematic perspective view of a printed circuit board. A... Printed circuit board, B... Deep soldering surface of the printed circuit board, D... Areas requiring masking on the deep soldering surface, S... Sheet, 1... Masking film body, 2... Adhesive layer, 3... Release paper, 4 ...Masking part, 5A... Separation slit, 5B... Separation hole.
Claims (1)
半田付け面における全てのマスキング必要箇所を
一括して覆うに足る面積を有する大きさのマスキ
ング用膜体の片面の実質的に全体に亘つて接着剤
層を形成すると共に、その接着剤層の表面全体に
離型用紙を付設して構成された一枚のシートに対
して、そのシートにおける前記プリント基板の各
マスキング必要箇所に夫々対応する各マスキング
部分の周囲に、その周方向において不連続であつ
て且つそのシートの表裏両面に亘つて貫通する複
数の分離用スリツトまたは孔を穿設してあること
を特徴とするプリント基板のデイツプ半田付け用
マスキングシート。 An adhesive layer is formed over substantially the entire surface of one side of a masking film having an area large enough to collectively cover all the masking required areas on the dip soldering surface of the printed circuit board to be masked. At the same time, for one sheet configured by attaching a release paper to the entire surface of the adhesive layer, around each masking part corresponding to each masking required part of the printed circuit board on the sheet, 1. A masking sheet for dip soldering of a printed circuit board, characterized in that a plurality of separation slits or holes are formed that are discontinuous in the circumferential direction and penetrate through both the front and back surfaces of the sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5989985U JPS61174780U (en) | 1985-04-22 | 1985-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5989985U JPS61174780U (en) | 1985-04-22 | 1985-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61174780U true JPS61174780U (en) | 1986-10-30 |
Family
ID=30586748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5989985U Pending JPS61174780U (en) | 1985-04-22 | 1985-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61174780U (en) |
-
1985
- 1985-04-22 JP JP5989985U patent/JPS61174780U/ja active Pending