JPS6249276U - - Google Patents
Info
- Publication number
- JPS6249276U JPS6249276U JP14023885U JP14023885U JPS6249276U JP S6249276 U JPS6249276 U JP S6249276U JP 14023885 U JP14023885 U JP 14023885U JP 14023885 U JP14023885 U JP 14023885U JP S6249276 U JPS6249276 U JP S6249276U
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- land
- wiring board
- printed wiring
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 description 1
Description
第１図は本考案に係る印刷配線板の要部斜視図
、第２図は同多層印刷配線板の積層形成後の内層
ランド部拡大斜視図、第３図は従来の多層印刷配
線板の部分斜視図、第４図は同多層配線板の部分
側断面図、第５図は同積層構成の側断面図、第６
図は同積層スルーホール形成後の内層ランド部拡
大斜視図である。
１１……内層基材、１２……ランド、１２―１
，１３―１……接続導体、１２―２，１３―２…
…補助接合ランド、１４……未硬化材料、１５…
…片面銅張り積層板、１６……スルーホール。
Fig. 1 is a perspective view of the main parts of the printed wiring board according to the present invention, Fig. 2 is an enlarged perspective view of the inner layer land after lamination of the same multilayer printed wiring board, and Fig. 3 is a part of a conventional multilayer printed wiring board. A perspective view, FIG. 4 is a partial side sectional view of the same multilayer wiring board, FIG. 5 is a side sectional view of the same laminated structure, and FIG.
The figure is an enlarged perspective view of the inner layer land after forming the laminated through holes. 11... Inner layer base material, 12... Land, 12-1
, 13-1... Connection conductor, 12-2, 13-2...
...Auxiliary bonding land, 14...Uncured material, 15...
...Single-sided copper-clad laminate, 16...Through hole.
Claims (1)
間を接続する導体との接合部にスルーホールの位
置ずれを許容する補助接合ランドを形成するよう
にしたことを特徴とする多層印刷配線板の内層接
続構造。 A multilayer printed wiring board characterized in that an auxiliary bonding land that allows through-hole misalignment is formed at a bonding portion between a land formed on the surface of an inner layer base material and a conductor connecting between the lands. Inner layer connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14023885U JPS6249276U (en) | 1985-09-13 | 1985-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14023885U JPS6249276U (en) | 1985-09-13 | 1985-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249276U true JPS6249276U (en) | 1987-03-26 |
Family
ID=31046898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14023885U Pending JPS6249276U (en) | 1985-09-13 | 1985-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249276U (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121176A (en) * | 1973-03-28 | 1974-11-19 | ||
| JPS5235484U (en) * | 1975-09-05 | 1977-03-12 | ||
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS5583294A (en) * | 1978-12-20 | 1980-06-23 | Fujitsu Ltd | Method of fabricating multilayer printed board |
| JPS5921096A (en) * | 1982-07-27 | 1984-02-02 | 日本電気株式会社 | Method of producing multilayer printed circuit board |
| JPS5969997A (en) * | 1982-10-15 | 1984-04-20 | 松下電工株式会社 | Method of producing multilayer printed circuit board |
| JPS59202690A (en) * | 1983-05-04 | 1984-11-16 | 松下電工株式会社 | Multilayer printed circuit board |
| JPS60109297A (en) * | 1983-11-18 | 1985-06-14 | 株式会社日立製作所 | Method of producing printed board |
| JPS60130883A (en) * | 1983-12-19 | 1985-07-12 | 中央銘板工業株式会社 | Multilayer printed circuit board |
-
1985
- 1985-09-13 JP JP14023885U patent/JPS6249276U/ja active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121176A (en) * | 1973-03-28 | 1974-11-19 | ||
| JPS5235484U (en) * | 1975-09-05 | 1977-03-12 | ||
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS5583294A (en) * | 1978-12-20 | 1980-06-23 | Fujitsu Ltd | Method of fabricating multilayer printed board |
| JPS5921096A (en) * | 1982-07-27 | 1984-02-02 | 日本電気株式会社 | Method of producing multilayer printed circuit board |
| JPS5969997A (en) * | 1982-10-15 | 1984-04-20 | 松下電工株式会社 | Method of producing multilayer printed circuit board |
| JPS59202690A (en) * | 1983-05-04 | 1984-11-16 | 松下電工株式会社 | Multilayer printed circuit board |
| JPS60109297A (en) * | 1983-11-18 | 1985-06-14 | 株式会社日立製作所 | Method of producing printed board |
| JPS60130883A (en) * | 1983-12-19 | 1985-07-12 | 中央銘板工業株式会社 | Multilayer printed circuit board |