JPH0170378U - - Google Patents
Info
- Publication number
- JPH0170378U JPH0170378U JP1987166185U JP16618587U JPH0170378U JP H0170378 U JPH0170378 U JP H0170378U JP 1987166185 U JP1987166185 U JP 1987166185U JP 16618587 U JP16618587 U JP 16618587U JP H0170378 U JPH0170378 U JP H0170378U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- plated portion
- wiring board
- area
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Description
第１図は本考案のプリント配線板の原理平面図
、第２図は本考案の一実施例のプリント配線板の
形成平面図、第３図は従来のプリント配線板の形
成平面図、第４図は従来のプリント配線板のめつ
き厚を示す図である。
図において、１はプリント配線板、２はプリン
ト母材、３は接続枝部、４は大型の非めつき部分
、５はスルホール、６は小型の非めつき部分、７
は導体パターンを示している。
FIG. 1 is a plan view of the principle of the printed wiring board of the present invention, FIG. 2 is a plan view of the formation of a printed wiring board according to an embodiment of the invention, FIG. 3 is a plan view of the formation of a conventional printed wiring board, and FIG. The figure is a diagram showing the plating thickness of a conventional printed wiring board. In the figure, 1 is a printed wiring board, 2 is a printed base material, 3 is a connecting branch, 4 is a large non-plated part, 5 is a through hole, 6 is a small non-plated part, 7
indicates a conductor pattern.
Claims (1)
リント配線板１の表面に電気めつきを行うに際し
、 前記各プリント配線板１の表面に混在する大、
小の非めつき部分の内の最終的に廃却される個所
としての大型の非めつき部分４の表面に、該非め
つき部分４の面積の２分の１以上の面積を有する
導体パターン７を形成したことを特徴とするプリ
ント配線板。[Claims for Utility Model Registration] When performing electroplating on the surfaces of a plurality of printed wiring boards 1 formed on one printed base material 2, large particles mixed on the surface of each printed wiring board 1,
A conductor pattern 7 having an area equal to or more than half of the area of the non-plated portion 4 is formed on the surface of a large non-plated portion 4 which is a part of the small non-plated portion 4 that will be eventually discarded. A printed wiring board characterized by forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166185U JPH0170378U (en) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166185U JPH0170378U (en) | 1987-10-29 | 1987-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170378U true JPH0170378U (en) | 1989-05-10 |
Family
ID=31453346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166185U Pending JPH0170378U (en) | 1987-10-29 | 1987-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170378U (en) |
-
1987
- 1987-10-29 JP JP1987166185U patent/JPH0170378U/ja active Pending