JPS63145360U - - Google Patents

Info

Publication number
JPS63145360U
JPS63145360U JP3855487U JP3855487U JPS63145360U JP S63145360 U JPS63145360 U JP S63145360U JP 3855487 U JP3855487 U JP 3855487U JP 3855487 U JP3855487 U JP 3855487U JP S63145360 U JPS63145360 U JP S63145360U
Authority
JP
Japan
Prior art keywords
insulating substrate
holes
board
diameters
penetrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3855487U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3855487U priority Critical patent/JPS63145360U/ja
Publication of JPS63145360U publication Critical patent/JPS63145360U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例のスルーホールの縦
断面図。第2図は本考案のスルーホールに部品を
実装したときの縦断面図、第3図は従来のスルー
ホールの縦断面図。第4図は従来のスルーホール
に部品を実装したときの縦断面図である。 1……スルーホール、2……部品、3……パタ
ーン、4……ランド、5……絶縁基板、6……リ
ード、7……半田。
FIG. 1 is a longitudinal sectional view of a through hole according to an embodiment of the present invention. FIG. 2 is a vertical cross-sectional view of a through-hole of the present invention when a component is mounted, and FIG. 3 is a vertical cross-sectional view of a conventional through-hole. FIG. 4 is a vertical cross-sectional view when components are mounted in a conventional through hole. 1...Through hole, 2...Component, 3...Pattern, 4...Land, 5...Insulating board, 6...Lead, 7...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板の表裏を貫通接続するスルーホールを
有する印刷配線板において、前記絶縁基板に設け
られた少なくとも一部のスルーホールの径が所望
の深さを境に異なつていることを特徴とする印刷
配線板。
A printed wiring board having through-holes that penetrate and connect the front and back sides of an insulating substrate, wherein the diameters of at least some of the through-holes provided in the insulating substrate differ at a desired depth. Board.
JP3855487U 1987-03-16 1987-03-16 Pending JPS63145360U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3855487U JPS63145360U (en) 1987-03-16 1987-03-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3855487U JPS63145360U (en) 1987-03-16 1987-03-16

Publications (1)

Publication Number Publication Date
JPS63145360U true JPS63145360U (en) 1988-09-26

Family

ID=30850909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3855487U Pending JPS63145360U (en) 1987-03-16 1987-03-16

Country Status (1)

Country Link
JP (1) JPS63145360U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020202347A (en) * 2019-06-13 2020-12-17 日本電波工業株式会社 Electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020202347A (en) * 2019-06-13 2020-12-17 日本電波工業株式会社 Electronic apparatus

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