JPH01167054U - - Google Patents
Info
- Publication number
- JPH01167054U JPH01167054U JP6418688U JP6418688U JPH01167054U JP H01167054 U JPH01167054 U JP H01167054U JP 6418688 U JP6418688 U JP 6418688U JP 6418688 U JP6418688 U JP 6418688U JP H01167054 U JPH01167054 U JP H01167054U
- Authority
- JP
- Japan
- Prior art keywords
- die pattern
- pattern
- lead
- die
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例で、同図Ａは平面図
、同図ＢはＵ字溝による座グリの断面図、同図Ｃ
はＶ字溝座グリの断面図、第２図は第２実施例の
平面図、第３図は第２実施例においてダイパター
ン部にレジストを被覆した時の平面図、第４図は
第３実施例の平面図である。
１……基板ベース、２……ダイパターン部、３
……リード部、４……座グリ部。
Fig. 1 shows an embodiment of the present invention, in which Fig. A is a plan view, Fig. B is a sectional view of a counterbore formed by a U-shaped groove, and Fig. C
2 is a sectional view of the V-groove counterbore, FIG. 2 is a plan view of the second embodiment, FIG. 3 is a plan view when the die pattern portion is coated with resist in the second embodiment, and FIG. FIG. 3 is a plan view of the embodiment. 1... Board base, 2... Die pattern section, 3
...Lead part, 4...Spot facing part.
Claims (1)
所にダイパターンを設け、各回路パターンのメツ
キリード部を上記ダイパターン部に接続すると共
に、ダイパターンを他電源と接続するリードパタ
ーンをもこのダイパターンに接続し、上記ダイパ
ターン部に接続された上記他電源に接続するリー
ドパターンをダイパターン部に接続された上記各
回路パターンのメツキリードとして用いて各回路
パターンにメツキ処理を行い、メツキ処理後に上
記ダイパターン部の周辺を削除してダイパターン
部と上記各リード部との接続を切り離したことを
特徴とするプリント基板構造。 (2) 上記メツキリード部の一部を削除せずにダ
イパターン部と接続した状態で残すようにしたこ
とを特徴とする実用新案登録請求の範囲第１項の
プリント基板構造。 (3) 上記ダイパターン部を複数に分離し、一方
のダイパターン部の上面に絶縁樹脂を被覆し、各
ダイパターン部に接続されているリード部の一部
を削除せず残したことを特徴とする実用新案登録
請求の範囲第１項のプリント基板構造。[Scope of Claim for Utility Model Registration] (1) In a resin substrate for COB, a die pattern is provided at the place where the IC is mounted, and the lead portion of each circuit pattern is connected to the die pattern portion, and the die pattern is connected to another power source. The lead pattern connected to the die pattern section is also connected to this die pattern, and the lead pattern connected to the die pattern section is used as a plating lead for each of the circuit patterns connected to the die pattern section, and each circuit pattern is plated. A printed circuit board structure characterized in that the periphery of the die pattern portion is removed after the plating process and the connection between the die pattern portion and each of the lead portions is separated. (2) The printed circuit board structure according to claim 1 of the utility model registration claim, characterized in that a part of the blind lead portion is not removed but is left connected to the die pattern portion. (3) The die pattern section is separated into multiple parts, the top surface of one die pattern section is coated with an insulating resin, and a part of the lead section connected to each die pattern section is left without being removed. A printed circuit board structure according to claim 1 of the utility model registration claim.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6418688U JPH01167054U (en) | 1988-05-16 | 1988-05-16 | |
| KR1019890006521A KR900019543A (en) | 1988-05-16 | 1989-05-16 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6418688U JPH01167054U (en) | 1988-05-16 | 1988-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01167054U true JPH01167054U (en) | 1989-11-22 |
Family
ID=31289663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6418688U Pending JPH01167054U (en) | 1988-05-16 | 1988-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01167054U (en) |
-
1988
- 1988-05-16 JP JP6418688U patent/JPH01167054U/ja active Pending