JPH02122466U - - Google Patents

Info

Publication number
JPH02122466U
JPH02122466U JP3045889U JP3045889U JPH02122466U JP H02122466 U JPH02122466 U JP H02122466U JP 3045889 U JP3045889 U JP 3045889U JP 3045889 U JP3045889 U JP 3045889U JP H02122466 U JPH02122466 U JP H02122466U
Authority
JP
Japan
Prior art keywords
wiring board
conductor pattern
printed wiring
board
inner layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3045889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3045889U priority Critical patent/JPH02122466U/ja
Publication of JPH02122466U publication Critical patent/JPH02122466U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の印刷配線板の平面
図、第２図は第１図の部分を拡大して示した断面
図、第３図は従来のチエツク用ランドを設けた連
続編集配線板の平面図である。 １……配線板、２……自動実装基準孔を設ける
余白部、３……Ｖ溝加工線、４……導通孔、５…
…ランド、６……リードパターン、７……内層リ
ードパターン、８……Ｖ溝、９……連続編集配線
板、１０……連続編集多層配線板、１１……多層
配線板。 Fig. 1 is a plan view of a printed wiring board according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view of the part shown in Fig. 1, and Fig. 3 is a conventional continuous editing board with check lands. FIG. 3 is a plan view of the wiring board. DESCRIPTION OF SYMBOLS 1... Wiring board, 2... Margin area for providing automatic mounting reference holes, 3... V-groove processed wire, 4... Conductive hole, 5...
... land, 6 ... lead pattern, 7 ... inner layer lead pattern, 8 ... V groove, 9 ... continuous editing wiring board, 10 ... continuous editing multilayer wiring board, 11 ... multilayer wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 単一の印刷配線板に、連続的に編集された複数
の配線板を互いに分離する予定線を横断する導体
パターンを前記配線板の表面から所定の深さの内
層内に形成し、前記導体パターンの両端に各々電
気的に接続するスルーホールを設けたことを特徴
とする印刷配線板。 A conductor pattern is formed on a single printed wiring board in an inner layer at a predetermined depth from the surface of the wiring board, and the conductor pattern crosses a predetermined line that separates a plurality of successively edited wiring boards from each other. A printed wiring board characterized by having through holes for electrical connection at both ends of the board.
JP3045889U 1989-03-17 1989-03-17 Pending JPH02122466U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3045889U JPH02122466U (en) 1989-03-17 1989-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3045889U JPH02122466U (en) 1989-03-17 1989-03-17

Publications (1)

Publication Number Publication Date
JPH02122466U true JPH02122466U (en) 1990-10-08

Family

ID=31255547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3045889U Pending JPH02122466U (en) 1989-03-17 1989-03-17

Country Status (1)

Country Link
JP (1) JPH02122466U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158410A (en) * 2000-11-21 2002-05-31 Ibiden Co Ltd Printed wiring board and its manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158410A (en) * 2000-11-21 2002-05-31 Ibiden Co Ltd Printed wiring board and its manufacturing method thereof

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