JPS6420765U - - Google Patents
Info
- Publication number
- JPS6420765U JPS6420765U JP11595987U JP11595987U JPS6420765U JP S6420765 U JPS6420765 U JP S6420765U JP 11595987 U JP11595987 U JP 11595987U JP 11595987 U JP11595987 U JP 11595987U JP S6420765 U JPS6420765 U JP S6420765U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- double
- wiring board
- sided wiring
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案に係る両面配線基板の断面図、
第２図は基板を製作する工程を説明する図、第３
図は従来基板の断面図である。
１は基板、２は銅ハクパターン、３はスルホー
ル、４はレジスト材。
FIG. 1 is a sectional view of a double-sided wiring board according to the present invention,
Figure 2 is a diagram explaining the process of manufacturing the board, Figure 3
The figure is a cross-sectional view of a conventional substrate. 1 is a substrate, 2 is a copper strip pattern, 3 is a through hole, and 4 is a resist material.
Claims (1)
ーンを接続する両面配線基板に於て、前記スルホ
ールに銅等のメツキを施したのち、該スルホール
に絶縁性を有するコーテイング材を塗布したこと
を特徴とする両面配線基板。 In a double-sided wiring board that connects patterns formed on both sides of the board via through holes, the through holes are plated with copper or the like, and then an insulating coating material is applied to the through holes. Double-sided wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11595987U JPS6420765U (en) | 1987-07-29 | 1987-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11595987U JPS6420765U (en) | 1987-07-29 | 1987-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420765U true JPS6420765U (en) | 1989-02-01 |
Family
ID=31358078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11595987U Pending JPS6420765U (en) | 1987-07-29 | 1987-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420765U (en) |
-
1987
- 1987-07-29 JP JP11595987U patent/JPS6420765U/ja active Pending