JPH0279075U - - Google Patents
Info
- Publication number
- JPH0279075U JPH0279075U JP15916588U JP15916588U JPH0279075U JP H0279075 U JPH0279075 U JP H0279075U JP 15916588 U JP15916588 U JP 15916588U JP 15916588 U JP15916588 U JP 15916588U JP H0279075 U JPH0279075 U JP H0279075U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductor circuit
- hole
- plating resist
- insulation coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の断面図である。
１……基板、３……めつきレジスト、４，５…
…導体回路、６……スルーホール、８……第１絶
縁層、９……第２絶縁層。
FIG. 1 is a sectional view of the present invention. 1...Substrate, 3...Plating resist, 4, 5...
...Conductor circuit, 6...Through hole, 8...First insulating layer, 9...Second insulating layer.
Claims (1)
の導体回路を除く箇所にめつきレジスト層が形成
され、このめつきレジスト層を除く箇所に導体回
路が設けられ、この絶縁基板に孔明けされた箇所
にスルーホールが形成され、この導体回路及びス
ルーホールが形成された絶縁基板の一方の面に導
体回路及びスルーホールの上から第１の絶縁被覆
層及び第２の絶縁被覆層が設けられ、他方の面に
電子部品が面実装されるプリント配線板。 Using an insulating substrate containing a catalyst, a plating resist layer is formed on both sides of the insulating substrate at locations other than the conductor circuit, a conductor circuit is provided at the location excluding the plating resist layer, and holes are drilled in the insulating substrate. A through hole is formed at the location, and a first insulation coating layer and a second insulation coating layer are provided from above the conductor circuit and the through hole on one surface of the insulating substrate on which the conductor circuit and the through hole are formed, A printed wiring board with electronic components mounted on the other side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15916588U JPH0279075U (en) | 1988-12-07 | 1988-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15916588U JPH0279075U (en) | 1988-12-07 | 1988-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279075U true JPH0279075U (en) | 1990-06-18 |
Family
ID=31440137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15916588U Pending JPH0279075U (en) | 1988-12-07 | 1988-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279075U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5043466A (en) * | 1973-08-22 | 1975-04-19 | ||
| JPS6116872A (en) * | 1984-07-03 | 1986-01-24 | Ricoh Co Ltd | Thermal head |
-
1988
- 1988-12-07 JP JP15916588U patent/JPH0279075U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5043466A (en) * | 1973-08-22 | 1975-04-19 | ||
| JPS6116872A (en) * | 1984-07-03 | 1986-01-24 | Ricoh Co Ltd | Thermal head |
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