JPS59166464U - wiring board - Google Patents
wiring boardInfo
- Publication number
- JPS59166464U JPS59166464U JP6113383U JP6113383U JPS59166464U JP S59166464 U JPS59166464 U JP S59166464U JP 6113383 U JP6113383 U JP 6113383U JP 6113383 U JP6113383 U JP 6113383U JP S59166464 U JPS59166464 U JP S59166464U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- metal substrate
- conductive pattern
- subjected
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案による配線基板を示す概略斜視図である
。第２図Ａないし第２図りはその製造工程を示す要部縦
断面図であり、第２図Ａは金属基体を示し、第２図Ｂは
着色処理工程、第２図Ｃは絶縁層被着工程、第２図りは
導電パターン形成工程をそれぞれ示すものである。
１・・・・・・金属基体、３・・・・・・導電パターン
、４・・曲着色被膜。FIG. 1 is a schematic perspective view showing a wiring board according to the present invention. Figures 2A and 2D are vertical cross-sectional views of main parts showing the manufacturing process. Figure 2A shows the metal substrate, Figure 2B shows the coloring process, and Figure 2C shows the insulating layer coating. The process and the second diagram respectively show the conductive pattern forming process. DESCRIPTION OF SYMBOLS 1... Metal base, 3... Conductive pattern, 4... Curved colored film.
Claims (1)
いて、上記金属基体表面に光の反射率を減少するような
着色処理が施されてなる配線基板。A wiring board comprising a conductive pattern formed on a metal substrate, wherein the surface of the metal substrate is subjected to a coloring treatment to reduce reflectance of light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6113383U JPS59166464U (en) | 1983-04-23 | 1983-04-23 | wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6113383U JPS59166464U (en) | 1983-04-23 | 1983-04-23 | wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59166464U true JPS59166464U (en) | 1984-11-08 |
Family
ID=30191354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6113383U Pending JPS59166464U (en) | 1983-04-23 | 1983-04-23 | wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59166464U (en) |
-
1983
- 1983-04-23 JP JP6113383U patent/JPS59166464U/en active Pending
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