JPH022861U - - Google Patents
Info
- Publication number
- JPH022861U JPH022861U JP7946688U JP7946688U JPH022861U JP H022861 U JPH022861 U JP H022861U JP 7946688 U JP7946688 U JP 7946688U JP 7946688 U JP7946688 U JP 7946688U JP H022861 U JPH022861 U JP H022861U
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- metal foil
- resin
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 2
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
図―１ａおよびｂは本考案の一実施例に係るプ
リント配線基板の要部拡大断面図および平面図、
図―２ａないしｃは本考案のプリント配線基板を
製造する方法の一例を示す断面図、図―３および
図―４はそれぞれ本考案のプリント配線基板を製
造する方法の他の例を示す断面図、図―５は従来
のプリント配線基板を示す要部拡大断面図である
。
１：樹脂基板、２：金属箔導体、Ｗ１：金属箔
導体の表面の幅、Ｗ２：金属箔導体の裏面の幅。
Figures 1a and 1b are an enlarged sectional view and a plan view of the main parts of a printed wiring board according to an embodiment of the present invention,
Figures 2a to 2c are cross-sectional views showing one example of the method of manufacturing the printed wiring board of the present invention, and Figures 3 and 4 are cross-sectional views showing other examples of the method of manufacturing the printed wiring board of the present invention, respectively. , FIG. 5 is an enlarged sectional view of the main parts of a conventional printed wiring board. 1: Resin substrate, 2: Metal foil conductor, W 1 : Width of the front surface of the metal foil conductor, W 2 : Width of the back surface of the metal foil conductor.
Claims (1)
ンに形成された金属箔導体を有するプリント配線
基板において、上記金属箔導体は、その表面が樹
脂基板の表面と同レベルにそろうように樹脂基板
に埋め込まれており、かつその表面の幅より樹脂
基板に埋め込まれた裏面の幅の方が広くなつてい
ることを特徴とするプリント配線基板。 In a printed wiring board having a metal foil conductor formed in a desired wiring pattern on one or both sides of a resin board, the metal foil conductor is embedded in the resin board so that its surface is aligned with the surface of the resin board. A printed wiring board characterized in that the width of the back surface embedded in the resin substrate is wider than the width of the front surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7946688U JPH022861U (en) | 1988-06-17 | 1988-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7946688U JPH022861U (en) | 1988-06-17 | 1988-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022861U true JPH022861U (en) | 1990-01-10 |
Family
ID=31304343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7946688U Pending JPH022861U (en) | 1988-06-17 | 1988-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022861U (en) |
-
1988
- 1988-06-17 JP JP7946688U patent/JPH022861U/ja active Pending