JPS63157988U - - Google Patents
Info
- Publication number
- JPS63157988U JPS63157988U JP5085187U JP5085187U JPS63157988U JP S63157988 U JPS63157988 U JP S63157988U JP 5085187 U JP5085187 U JP 5085187U JP 5085187 U JP5085187 U JP 5085187U JP S63157988 U JPS63157988 U JP S63157988U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- thermoplastic resin
- resistant thermoplastic
- board
- super heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 5
- 229920005992 thermoplastic resin Polymers 0.000 claims 5
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 229920000265 Polyparaphenylene Polymers 0.000 claims 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- -1 polyparaphenylene Polymers 0.000 claims 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図乃至第４図は本考案にかかるハウジング
兼用基板の実施例を示す断面図、第５図は本考案
にかかるハウジング兼用基板の他の実施例を示す
斜視図、第６図は同縦断面図、第７図乃至第１０
図は第１図乃至第４図対応の従来例を示す断面図
である。
１……ハウジング、２……基板、３……配線パ
ターン、４……スルーホール、５……回路素子、
６……スルーホール。
1 to 4 are cross-sectional views showing an embodiment of the housing-cum-board according to the present invention, FIG. 5 is a perspective view showing another embodiment of the housing-cum-use board according to the invention, and FIG. 6 is a longitudinal section of the same. Front view, Figures 7 to 10
The figure is a sectional view showing a conventional example corresponding to FIGS. 1 to 4. 1... Housing, 2... Board, 3... Wiring pattern, 4... Through hole, 5... Circuit element,
6...Through hole.
Claims (1)
ハウジングの全部又は一部に一体成形された基板
であつて、該基板は無電解めつきされたハウジン
グの表面に非配線パターンを印刷後電解めつきさ
れ上記非配線パターン除去後表面全面につき無電
解めつき分相当厚をエツチングにて除去すること
により適宜の配線パターンからなる電気回路が形
成されたことを特徴とするハウジング兼用基板。 超耐熱性熱可塑性樹脂がポリエーテルサルフ
オンである実用新案登録請求の範囲第１項記載の
ハウジング兼用基板。 超耐熱性熱可塑性樹脂がポリエーテルイミド
である実用新案登録請求の範囲第１項記載のハウ
ジング兼用基板。 超耐熱性熱可塑性樹脂がポリパラフエニレン
サルフアイドである実用新案登録請求の範囲第１
項記載のハウジング兼用基板。 超耐熱性熱可塑性樹脂がポリアリルサルフオ
ンである実用新案登録請求の範囲第１項記載のハ
ウジング兼用基板。 上記基板にスルーホールが一体成形された実
用新案登録請求の範囲第１項乃至第５項のいずれ
か記載のハウジング兼用基板。[Claims for Utility Model Registration] A substrate integrally molded on all or a part of a three-dimensional housing made of an ultra-heat-resistant thermoplastic resin, the substrate being non-electrolytically plated on the surface of the housing. A wiring pattern is electrolytically plated after printing, and after the non-wiring pattern is removed, a thickness equivalent to the electroless plating is removed from the entire surface by etching, thereby forming an electric circuit consisting of a suitable wiring pattern. Board that also serves as a housing. The housing/substrate according to claim 1, wherein the super heat-resistant thermoplastic resin is polyether sulfon. The housing/substrate according to claim 1, wherein the super heat-resistant thermoplastic resin is polyetherimide. Utility model registration claim 1 where the super heat-resistant thermoplastic resin is polyparaphenylene sulfide
Housing combination board as described in section. The housing/substrate according to claim 1, wherein the super heat-resistant thermoplastic resin is polyallylsulfone. The housing-cum-use board according to any one of claims 1 to 5, wherein a through hole is integrally formed on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5085187U JPS63157988U (en) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5085187U JPS63157988U (en) | 1987-04-03 | 1987-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157988U true JPS63157988U (en) | 1988-10-17 |
Family
ID=30874586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5085187U Pending JPS63157988U (en) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157988U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008520074A (en) * | 2004-11-11 | 2008-06-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | High electric field / high voltage unit and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5646288B2 (en) * | 1975-09-19 | 1981-11-02 | ||
| JPS5946009A (en) * | 1982-09-09 | 1984-03-15 | Kawasaki Steel Corp | Transformer of low core loss |
-
1987
- 1987-04-03 JP JP5085187U patent/JPS63157988U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5646288B2 (en) * | 1975-09-19 | 1981-11-02 | ||
| JPS5946009A (en) * | 1982-09-09 | 1984-03-15 | Kawasaki Steel Corp | Transformer of low core loss |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008520074A (en) * | 2004-11-11 | 2008-06-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | High electric field / high voltage unit and manufacturing method thereof |
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