JPS587897A - Method of producing circuit wiring board - Google Patents
Method of producing circuit wiring boardInfo
- Publication number
- JPS587897A JPS587897A JP10611081A JP10611081A JPS587897A JP S587897 A JPS587897 A JP S587897A JP 10611081 A JP10611081 A JP 10611081A JP 10611081 A JP10611081 A JP 10611081A JP S587897 A JPS587897 A JP S587897A
- Authority
- JP
- Japan
- Prior art keywords
- circuit wiring
- wiring board
- synthetic resin
- plating
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 零発＃４は回路配線板の製造方法に関する。[Detailed description of the invention] Zero issue #4 relates to a method of manufacturing a circuit wiring board.
従来からの回路配線板は、主として合ｒｓ、樹Ｉ危板に
銅箔を２ミネートした後、孔明は加工、エツチングレジ
スト印刷、エツチング、レジスト剥離、および外形パン
チングなどの工程を経て製造されている。またスルホー
ルを有する回路配線板では上記工程の他にメッキ工程が
必要であり、さらにエツチング工程が不要である製造方
法もあるが、回路パターンを形成するための印刷や露光
、および外形や孔明けのためのパンチングやドＩＪ ）
し加工などの工程が必要である。しかも、上記いずれの
方法においても、すべての工程が相対的な精度１に要求
され、特にメッキ工程を有する方法では、孔明は加工は
ドリルに頼らざるを得ない。したがって、工程が複雑で
あり、しかも高精度を要求されるニー程が多かつｔｏ
本発明は、上述の技術的課題を解決し、工程を簡略化す
るとともに高精度の加工精度が必要な工程を減少し九回
路配線板の製造方法を提供することを目的とする。Conventional circuit wiring boards are manufactured mainly by laminating two copper foils on a bonding plate, followed by processing, etching resist printing, etching, resist peeling, and outline punching. . In addition, circuit wiring boards with through holes require a plating process in addition to the above process, and although there are manufacturing methods that do not require an etching process, printing and exposure to form the circuit pattern, as well as the external shape and hole drilling process are required. punching and de-IJ)
Processes such as grinding are required. Moreover, in any of the above-mentioned methods, all steps are required to have a relative accuracy of 1, and in particular, in the method including a plating step, drilling must be performed using a drill. Therefore, the process is complicated, and there are many knee parts that require high precision. The purpose of the present invention is to provide a method for manufacturing a reduced nine-circuit wiring board.
以下、図面によって本発明の詳細な説明する。Hereinafter, the present invention will be explained in detail with reference to the drawings.
第１図は本発明の一実施例の斜視図であり、第２図は第
１図の切断面線■−■から見た断面図である。回路配線
板ｌの製造にあたっては、先ず被メッキ性を有していな
い合成樹脂２の表面に、被メッキ性を有する合成樹脂３
が所望の回路パターン状に露出するようにして、いわゆ
る２色成形により基板４を一体的に成形する。この基板
４は、目的とする回路配線板１の外形形状を有するよう
に形成されておシ、部品の実装用の孔５、基板取付け用
の孔６およびスルホール用の孔７が所望の位置に形成さ
れる。FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a sectional view taken along the section line 1--2 in FIG. In manufacturing the circuit wiring board l, first, a synthetic resin 3 having plating property is applied to the surface of the synthetic resin 2 which does not have plating property.
The substrate 4 is integrally molded by so-called two-color molding so that it is exposed in a desired circuit pattern. This board 4 is formed to have the external shape of the intended circuit wiring board 1, and holes 5 for mounting components, holes 6 for mounting the board, and holes 7 for through holes are located at desired positions. It is formed.
なお、被メッキ性を有する合成樹脂３の露出部分は、第
１ｖＡＫ示すように基板４の上面だけに限定されるもの
ではなく、必要に応じて基板４の下面や側面に露出量る
ようにしてもよく、ま九スルホール用の孔７の内面にも
合成樹脂３が露出している。Note that the exposed portion of the synthetic resin 3 having plating properties is not limited to the upper surface of the substrate 4 as shown in the first vAK, but may be exposed on the lower surface or side surface of the substrate 4 as necessary. The synthetic resin 3 is also exposed on the inner surface of the hole 7 for the through hole.
上述のごとく基板４の成形工程が終了し友後においては
、基板４の全表面にわ念ってメッキ処理を施す。それに
より、被メッキ性を有する合成樹脂３の露出量１１ｉｌ
ｌＫ対応して金属導体８が形成さｎ。After the molding process of the substrate 4 is completed as described above, the entire surface of the substrate 4 is carefully plated. As a result, the exposed amount of the synthetic resin 3 having plating property is 11il.
A metal conductor 8 is formed corresponding to lKn.
回路配線板ｌが完成する。なお、メッキ処理工程の後に
、ブラッシング等の処理を行なうようにしてもよい。The circuit wiring board l is completed. Incidentally, after the plating process, a process such as brushing may be performed.
なお、被メッキ性を有する合成樹脂３ｒｉ導電性を有し
ていてもよく、ま九導電性を有していなくてもよい。In addition, the synthetic resin having plating property may have 3ri electrical conductivity, and does not need to have 9 electrical conductivity.
上述のごとく本発明によれば、被メッキ性を有する合成
樹脂と被メッキ性を有していない合成樹１１
脂とを用いて基板を成形し、その基板のメッキ処理を施
すだけの簡単な工程により回路配線板を製造することが
でき、しかも高精度の加工精度を必要とする工程が少な
いので、製造が容易となる。As described above, according to the present invention, it is a simple process of forming a substrate using a synthetic resin that has plating properties and a synthetic resin that does not have plating properties, and then plating the board. A circuit wiring board can be manufactured using the method, and there are fewer steps that require high processing accuracy, which facilitates manufacturing.
第１図は本発明の一実施例の斜視因、第２図は第１図の
切断面線■−■から見た断面図である。
１・・・回路配線板、２・・・被メッキ性を有していな
い合成樹脂、３・・・被メッキ性を有し九合ｖＸ、樹脂
、４・・・基板
代理人 弁理士 西教圭一部FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the section line 1--2 in FIG. 1...Circuit wiring board, 2...Synthetic resin that does not have plating properties, 3...Kyugo vX, resin that has plating properties, 4...Board agent Patent attorney Nishikyo Keiichibe
Claims (1)
性を有する合成樹脂が所望の回路パターン状に露出する
ようにして基板を一体的に成形し、その基板の全面にメ
ッキ処理を施すことを特徴とする回路配線板の製造方法
。A board is integrally molded on the surface of a synthetic resin that does not have plating properties so that the synthetic resin that has plating properties is exposed in the desired circuit pattern, and the entire surface of the board is plated. A method of manufacturing a circuit wiring board, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10611081A JPS587897A (en) | 1981-07-06 | 1981-07-06 | Method of producing circuit wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10611081A JPS587897A (en) | 1981-07-06 | 1981-07-06 | Method of producing circuit wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS587897A true JPS587897A (en) | 1983-01-17 |
Family
ID=14425331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10611081A Pending JPS587897A (en) | 1981-07-06 | 1981-07-06 | Method of producing circuit wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS587897A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61239694A (en) * | 1985-02-22 | 1986-10-24 | スミス コロナ コーポレイション | Molding suitable for adhesive plating, molded plated productand manufacture thereof |
| US5407622A (en) * | 1985-02-22 | 1995-04-18 | Smith Corona Corporation | Process for making metallized plastic articles |
| JPWO2016021618A1 (en) * | 2014-08-05 | 2017-06-01 | 株式会社江東彫刻 | Wiring circuit component manufacturing method, mold for manufacturing wiring circuit component, resin wiring circuit component |
-
1981
- 1981-07-06 JP JP10611081A patent/JPS587897A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61239694A (en) * | 1985-02-22 | 1986-10-24 | スミス コロナ コーポレイション | Molding suitable for adhesive plating, molded plated productand manufacture thereof |
| US5407622A (en) * | 1985-02-22 | 1995-04-18 | Smith Corona Corporation | Process for making metallized plastic articles |
| JPWO2016021618A1 (en) * | 2014-08-05 | 2017-06-01 | 株式会社江東彫刻 | Wiring circuit component manufacturing method, mold for manufacturing wiring circuit component, resin wiring circuit component |
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