JPS646064U - - Google Patents
Info
- Publication number
- JPS646064U JPS646064U JP9939687U JP9939687U JPS646064U JP S646064 U JPS646064 U JP S646064U JP 9939687 U JP9939687 U JP 9939687U JP 9939687 U JP9939687 U JP 9939687U JP S646064 U JPS646064 U JP S646064U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- hole
- insulating film
- printed
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図は本考案の一実施例に係る射出成形回路
基板の断面図、第２図ないし第５図は同回路基板
を製造する過程を示す断面図である。
１１〜絶縁フイルム、１２〜穴、１３〜穴埋め
層、１４〜第一層回路パターン、１５〜第二層回
路パターン、１６〜パツド、１７〜ソルダーレジ
スト層、１８〜絶縁層、１９〜接着剤層、２０〜
回路フイルム、２１〜樹脂成形体。
FIG. 1 is a sectional view of an injection molded circuit board according to an embodiment of the present invention, and FIGS. 2 to 5 are sectional views showing the process of manufacturing the same circuit board. 11 - Insulating film, 12 - Hole, 13 - Hole filling layer, 14 - First layer circuit pattern, 15 - Second layer circuit pattern, 16 - Pad, 17 - Solder resist layer, 18 - Insulating layer, 19 - Adhesive layer , 20~
Circuit film, 21 - resin molded body.
Claims (1)
成した絶縁フイルムを用い、その絶縁フイルムの
両面に導電ペーストで回路パターンを印刷してな
る回路フイルムと、この回路フイルムの片面に一
体に形成された樹脂成形体とからなる射出成形回
路基板において、上記絶縁フイルムの穴の部分に
導電ペーストによる穴埋め層が印刷され、この穴
埋め層は、樹脂成形体側の面から、穴径より大き
く印刷されていることを特徴とする射出成形回路
基板。 A circuit film is made by using an insulating film with holes formed at positions where the circuit patterns on both sides are conductive, and circuit patterns are printed with conductive paste on both sides of the insulating film, and a resin integrally formed on one side of the circuit film. In an injection molded circuit board consisting of a molded body, a hole-filling layer made of conductive paste is printed in the hole portion of the insulating film, and this hole-filling layer is printed larger than the hole diameter from the side of the resin molded body. Characteristic injection molded circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9939687U JPS646064U (en) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9939687U JPS646064U (en) | 1987-06-30 | 1987-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646064U true JPS646064U (en) | 1989-01-13 |
Family
ID=31326517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9939687U Pending JPS646064U (en) | 1987-06-30 | 1987-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646064U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10206305B2 (en) | 2016-02-23 | 2019-02-12 | Nec Platforms, Ltd. | Support device and support method |
-
1987
- 1987-06-30 JP JP9939687U patent/JPS646064U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10206305B2 (en) | 2016-02-23 | 2019-02-12 | Nec Platforms, Ltd. | Support device and support method |