JPH01108989U

JPH01108989U -

Info

Publication number: JPH01108989U
Application number: JP309688U
Authority: JP
Priority date: 1988-01-16
Filing date: 1988-01-16
Publication date: 1989-07-24

Description

[Brief explanation of the drawing]

第１図乃至第３図はこの考案に係る電子機器の
配線構造の実施例を示し、第１図は全体を示す側
面図、第２図は第１図の要部を示す斜視図、第３
図は他の応用例であり、ケース内壁面を示す側面
図、第４図は従来の電子機器の配線構造を示す側
面図である。主な符号の説明、１，１１：ケース、２，３：
プリント配線基板、２ａ，３ａ：パターン、４，
１２：配線パターン、５：取付け部、２ｂ，３ｂ
，５ａ：取付け孔、２ｃ，３ｃ，５ｂ：接続パタ
ーン、６：ビス、７：部品、８：フレシキブル配
線基板、１３：絶縁層、Ａ：電子機器。 1 to 3 show an embodiment of the wiring structure of an electronic device according to this invention, FIG. 1 is a side view showing the whole, FIG. 2 is a perspective view showing the main part of FIG. 1, and FIG.
The figures show another example of application, and are a side view showing the inner wall surface of the case, and FIG. 4 is a side view showing the wiring structure of a conventional electronic device. Explanation of main codes, 1, 11: Case, 2, 3:
Printed wiring board, 2a, 3a: pattern, 4,
12: Wiring pattern, 5: Mounting part, 2b, 3b
, 5a: mounting hole, 2c, 3c, 5b: connection pattern, 6: screw, 7: component, 8: flexible wiring board, 13: insulating layer, A: electronic device.

Claims

[Scope of claim for utility model registration] (1) In a wiring structure that is installed inside the case of an electronic device and electrically connects at least two printed wiring boards, a wiring structure that is installed on the inner wall of the case made of a non-conductive material. A conductive wiring pattern, a conductive connection pattern is provided on each of the wiring pattern and at least two printed wiring boards, and the at least two printed wiring boards are attached to the case. A wiring structure for an electronic device characterized by being configured to enable electrical connection between boards. (2) The wiring structure for an electronic device according to claim 1 of the utility model registration, characterized in that the mounting surface of the printed wiring board in the case is formed by a convex portion. (3) The wiring structure for an electronic device according to claim 1 of the utility model registration claim, characterized in that the mounting surface of the printed wiring board in the case is formed with a recess. (4) The wiring structure for an electronic device according to claim 1 of claim 1, characterized in that an insulating layer is provided on the inner wall surface of a case made of a conductive material, and a connection pattern is formed on this insulating layer. (5) The wiring structure for an electronic device according to claims 1 and 4 of the utility model registration claim, characterized in that the connection land is formed by plating or laminating means.