JPH0444173U - - Google Patents
Info
- Publication number
- JPH0444173U JPH0444173U JP8545690U JP8545690U JPH0444173U JP H0444173 U JPH0444173 U JP H0444173U JP 8545690 U JP8545690 U JP 8545690U JP 8545690 U JP8545690 U JP 8545690U JP H0444173 U JPH0444173 U JP H0444173U
- Authority
- JP
- Japan
- Prior art keywords
- land electrodes
- circuit boards
- wiring pattern
- electrodes
- lower land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案における回路基板説明図、第２
図は本考案における回路基板断面図、第３図は本
考案における他の実施例説明図、第４図は本考案
における他の実施例断面図、第５図は従来例にお
ける複合回路基板説明図、第６図は従来例におけ
るフレキシブルケーブル説明図、第７図は従来例
における搬送説明図である。
１，１′……回路基板、２……板状接続部材、
２１……絶縁板状部材、２２……コ字状導電部材
、２３……湾曲部、３……電極リード、４……電
子部品、５……コ字状接続部材、５１……凹部、
５２……導体膜ライン、１１，１１′……上部ラ
ンド電極、１２，１２′……下部ランド電極。
Figure 1 is an explanatory diagram of the circuit board in the present invention, Figure 2
The figure is a sectional view of a circuit board in the present invention, Figure 3 is an explanatory diagram of another embodiment of the invention, Figure 4 is a sectional diagram of another embodiment of the invention, and Figure 5 is an explanatory diagram of a composite circuit board in a conventional example. , FIG. 6 is an explanatory diagram of a flexible cable in a conventional example, and FIG. 7 is an explanatory diagram of conveyance in a conventional example. 1, 1'... circuit board, 2... plate-shaped connection member,
21... Insulating plate member, 22... U-shaped conductive member, 23... Curved portion, 3... Electrode lead, 4... Electronic component, 5... U-shaped connection member, 51... Recessed portion,
52... Conductor film line, 11, 11'... Upper land electrode, 12, 12'... Lower land electrode.
Claims (1)
ンド電極１２，１２′と、当該各ランド電極に接
続された配線パターンとを有し、当該配線パター
ン上に配置された電子部品４が互いに反対方向の
実装面となるように密着された二枚の回路基板１
，１′と、 当該二枚の回路基板１，１′の厚さに等しい幅
で、内部に前記それぞれの回路基板１，１′の上
部ランド電極１１，１１′どうしを電気的および
機械的に接続するコ字状導電部材２２が埋設され
た板状接続部材２と、 前記下部ランド電極１２，１２′から導出され
る電極リード３と、 を備えたことを特徴とする複合回路基板装置。 (2) 上部ランド電極１１，１１′および下部ラ
ンド電極１２，１２′と、当該各ランド電極に接
続された配線パターンとを有し、当該配線パター
ン上に配置された電子部品４が互いに反対方向の
実装面となるように密着された二枚の回路基板１
，１′と、 当該二枚の回路基板１，１′の厚しに等しい幅
の凹部５１を有し、当該凹部５１の内周面に前記
それぞれの回路基板１，１′の上部ランド電極１
１，１１′どうしを電気的および機械的に接続す
るコ字状導体膜ライン５２が形成されたコ字状接
続部材５と、 前記下部ランド電極１２，１２′から導出され
る電極リード３と、 を備えたことを特徴とする複合回路基板装置。[Claims for Utility Model Registration] (1) It has upper land electrodes 11, 11', lower land electrodes 12, 12', and a wiring pattern connected to each of the land electrodes, and is arranged on the wiring pattern. Two circuit boards 1 are closely attached so that the electronic components 4 mounted on the mounting surfaces are in opposite directions.
, 1', with a width equal to the thickness of the two circuit boards 1, 1', and electrically and mechanically connect the upper land electrodes 11, 11' of the respective circuit boards 1, 1' to each other. A composite circuit board device comprising: a plate-shaped connecting member 2 in which a U-shaped conductive member 22 to be connected is embedded; and an electrode lead 3 led out from the lower land electrodes 12, 12'. (2) It has upper land electrodes 11, 11' and lower land electrodes 12, 12', and a wiring pattern connected to each of the land electrodes, and the electronic components 4 arranged on the wiring patterns are arranged in opposite directions. Two circuit boards 1 are closely attached to each other so that the mounting surface is
, 1', and a recess 51 having a width equal to the thickness of the two circuit boards 1, 1', and an upper land electrode 1 of each of the circuit boards 1, 1' on the inner peripheral surface of the recess 51.
A U-shaped connecting member 5 on which a U-shaped conductor film line 52 is formed to electrically and mechanically connect the lower land electrodes 12 and 11', and an electrode lead 3 led out from the lower land electrodes 12 and 12'. A composite circuit board device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8545690U JPH0444173U (en) | 1990-08-14 | 1990-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8545690U JPH0444173U (en) | 1990-08-14 | 1990-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444173U true JPH0444173U (en) | 1992-04-15 |
Family
ID=31816738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8545690U Pending JPH0444173U (en) | 1990-08-14 | 1990-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444173U (en) |
-
1990
- 1990-08-14 JP JP8545690U patent/JPH0444173U/ja active Pending
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