JPH0645380U - Flexible printed circuit board connection device - Google Patents

Flexible printed circuit board connection device

Info

Publication number
JPH0645380U
JPH0645380U JP8039692U JP8039692U JPH0645380U JP H0645380 U JPH0645380 U JP H0645380U JP 8039692 U JP8039692 U JP 8039692U JP 8039692 U JP8039692 U JP 8039692U JP H0645380 U JPH0645380 U JP H0645380U
Authority
JP
Japan
Prior art keywords
flexible printed
printed circuit
circuit board
flexible
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8039692U
Other languages
Japanese (ja)
Other versions
JP2566842Y2 (en
Inventor
幸延 沢田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP1992080396U priority Critical patent/JP2566842Y2/en
Publication of JPH0645380U publication Critical patent/JPH0645380U/en
Application granted granted Critical
Publication of JP2566842Y2 publication Critical patent/JP2566842Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

(57)【要約】 【目的】 フレキシブル配線基板同志を接離可能に電気
的に結合する接続装置に関するもので、従来のように導
電パターンとコネクターとを接続する作業を不必要と
し、その接続部の大きさも小さく出来る具体構成を提供
するものである。 【構成】 フレキシブルな基板1に形成された複数本の
導電パターン3の端部に近接する位置に、それぞれ突状
部2を形成し、前記基板1の表面に前記導電パターン3
との間に所定の間隙を有し、かつ前記端部側に開口した
空間7を形成するように剛性を有する補強板5を貼着し
た第一のフレキシブルプリント基板と、フレキシブルな
基板9の表面に形成された複数本の導電パターン10を
有し、前記端部近傍の下面に剛性基板13が貼着された
第二のフレキシブルプリント基板とよりなり、前記第二
のフレキシブルプリント基板の端部は前記開口7より空
間に圧入可能に構成されている
(57) [Abstract] [Purpose] The present invention relates to a connecting device for electrically connecting flexible wiring boards to each other so that they can be separated from each other, and eliminates the conventional work of connecting a conductive pattern and a connector. The present invention provides a specific configuration in which the size of can be reduced. A protrusion 2 is formed at a position close to the ends of a plurality of conductive patterns 3 formed on a flexible substrate 1, and the conductive patterns 3 are formed on the surface of the substrate 1.
The surface of the flexible substrate 9 and a first flexible printed board having a reinforcing plate 5 having a predetermined gap between the first flexible printed board and the rigid board so as to form a space 7 open to the end side. A second flexible printed circuit board having a plurality of conductive patterns 10 formed on the lower surface of the second flexible printed circuit board and a rigid substrate 13 attached to the lower surface in the vicinity of the end portion. It is configured to be press-fitted into the space through the opening 7.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、フレキシブルなプリント基板同志を接離可能に接続する接続装置に 関するもので、簡単な構成による低コストの接続装置の具体的な構成に特徴を有 するものである。 The present invention relates to a connection device for connecting flexible printed circuit boards to each other so that they can be connected to and separated from each other, and is characterized by a specific structure of a low-cost connection device having a simple structure.

【0002】[0002]

【従来の技術】[Prior art]

従来より、フレキシブルプリント基板同志を接離可能に電気的に接続する場合 、接続すべき各プリント基板にそれぞれ別個に製造されたコネクターを接続し、 そのコネクターを介して接続していた。 Conventionally, when electrically connecting two flexible printed circuit boards to each other so that they can be connected to and separated from each other, a separately manufactured connector was connected to each printed circuit board to be connected, and the connection was made via the connector.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら、この構成によると、別個に製造されたコネクターの各端子とプ リント配線基板の導電パターンとをそれぞれ接続する作業が必要であり、また、 コネクターそのものの大きさも大きなものであった。 However, according to this configuration, it is necessary to connect each terminal of the separately manufactured connector and the conductive pattern of the printed wiring board, and the size of the connector itself is large.

【0004】 本考案は、特にコネクターとの接続作業を必要とせず、かつ、小体積の接続装 置を提供せんとするものである。The present invention is to provide a connection device that does not require a connection work with a connector and has a small volume.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

本考案のフレキシブルプリント基板の接続装置は、フレキシブルな基材の表面 にその端部から互いに並行すように形成された複数本の導電パターンの前記端部 に近接する位置に、それぞれ突状部を形成し、前記端部近傍の下面に剛性基板を 貼着するとともに、前記基材の表面に前記導電パターンとの間に所定の間隙を有 し、かつ前記端部側に開口した空間を形成するように剛性を有する板を貼着した 第一のフレキシブルプリント基板と、フレキシブルな基材の表面にその端部から 互いに並行すように形成された複数本の導電パターンを有し、前記端部近傍の下 面に剛性基板が貼着された第二のフレキシブルプリント基板とよりなり、前記第 二のフレキシブルプリント基板の端部は前記開口より空間に圧入可能に構成され ていることを特徴とする。 The flexible printed circuit board connection device of the present invention has a plurality of conductive patterns formed on the surface of a flexible base material in parallel with each other from their ends, and has protruding portions at positions close to the ends. And a rigid substrate is attached to the lower surface in the vicinity of the end portion, and a space is formed on the surface of the base material with a predetermined gap between the conductive pattern and the end portion side. The first flexible printed circuit board with a rigid plate attached to it, and a plurality of conductive patterns formed on the surface of the flexible base material in parallel with each other from the end, The second flexible printed circuit board has a rigid substrate adhered to the lower surface of the second flexible printed circuit board, and the end portion of the second flexible printed circuit board is configured to be press fit into the space through the opening. To.

【0006】[0006]

【作用】[Action]

上記構成によれば、フレキシブルプリント基板上の導電パターンそのものを、 利用してコネクター部を形成しているため、従来のように導電パターンとコネク ターとを接続する作業を必要としないものである。また、フレキシブルプリント 基板の上に直接コネクターを形成するものであるため、その大きさも小さく出来 るものである。 According to the above configuration, since the connector portion is formed by utilizing the conductive pattern itself on the flexible printed circuit board, there is no need to connect the conductive pattern and the connector as in the conventional case. Also, since the connector is formed directly on the flexible printed circuit board, its size can be reduced.

【0007】[0007]

【実施例】【Example】

図1は本考案のフレキシブルプリント基板の接続装置の一実施例の要部を示す 断面図、図2は同要部の分解斜視図であり、図1および図2において、1はポリ イミド樹脂あるいはガラスエポキシ樹脂等からなる第一のフレキシブルな基板で あり、その一端部の近傍には約0.04mm程度の突起2が複数個一体的に形成されて いる。3は前記基板1の端部より互いに並行して伸びるよう形成された複数の導 電パターンであり、それぞれの導電パターン3は前記各突起2の上を通過するよ う形成され、その部分が突出するよう構成されている。 FIG. 1 is a sectional view showing an essential part of an embodiment of a flexible printed circuit board connecting device of the present invention, and FIG. 2 is an exploded perspective view of the same part. In FIGS. This is a first flexible substrate made of glass epoxy resin or the like, and a plurality of protrusions 2 of about 0.04 mm are integrally formed near one end of the substrate. Reference numeral 3 denotes a plurality of conductive patterns formed so as to extend in parallel with each other from the end portion of the substrate 1, and each conductive pattern 3 is formed so as to pass over each of the protrusions 2, and that portion is projected. Is configured to.

【0008】 そして、この突出した部分の近傍の導電パターン3上にはパラジュウム等の耐 磨耗性のある金属層4が形成されており、その金属層4に続く導電パターン3上 には絶縁層6が形成されている。5は前記フレキシブル基板1に比べて剛性を有 する第一の補強板であり、その一面には端部に開口した切り溝7が形成されてお り、前記導電パターン3を覆うようにフレキシブル基板1上に接着剤により接合 されている。A metal layer 4 having a wear resistance such as palladium is formed on the conductive pattern 3 near the protruding portion, and an insulating layer 6 is formed on the conductive pattern 3 following the metal layer 4. Are formed. Reference numeral 5 is a first reinforcing plate having rigidity as compared with the flexible substrate 1, and a kerf 7 having an opening at an end is formed on one surface thereof so that the flexible substrate is covered with the conductive pattern 3. It is bonded to the top of the 1 by an adhesive.

【0009】 8は前記フレキシブル基板1に比べて剛性を有するアルミ板等よりなる第二の 補強板であり、前記フレキシブル基板1と第二の補強板8とはそれぞれ接着材に より接合されている。9はポリイミド樹脂あるいはガラスエポキシ樹脂等からな る第二のフレキシブルな基板であり、その一端部より前記第一の基板上に形成さ れた導電パターン3の間隔と等しい間隔で互いに並行して伸びるように複数の導 電パターン10が形成されている。そして、この端部近傍の導電パターン10上 にはパラジュウム等の耐磨耗性のある金属層11が形成されており、その金属層 11に続く導電パターン10上には絶縁層12が形成されている。Reference numeral 8 is a second reinforcing plate made of an aluminum plate or the like having rigidity higher than that of the flexible substrate 1, and the flexible substrate 1 and the second reinforcing plate 8 are respectively joined by an adhesive material. . Reference numeral 9 is a second flexible substrate made of polyimide resin or glass epoxy resin, and extends from one end of the second flexible substrate in parallel with each other at an interval equal to the interval of the conductive patterns 3 formed on the first substrate. Thus, a plurality of conductive patterns 10 are formed. Then, a metal layer 11 having abrasion resistance such as palladium is formed on the conductive pattern 10 near the end portion, and an insulating layer 12 is formed on the conductive pattern 10 following the metal layer 11. There is.

【0010】 13は前記第二のフレキシブル基板9に比べて剛性を有するガラスエポキシ樹 脂等よりなる第三の補強板であり、前記第二のフレキシブル基板9の端部裏面に 接着剤により接合されている。 そして、この第二のフレキシブル基板9と第三 の補強板13との接合体の厚さは前記切り溝6の深さと等しくなるよう構成され ている。Reference numeral 13 denotes a third reinforcing plate made of glass epoxy resin or the like, which is more rigid than the second flexible substrate 9, and is bonded to the rear surface of the end of the second flexible substrate 9 with an adhesive. ing. The thickness of the joined body of the second flexible substrate 9 and the third reinforcing plate 13 is equal to the depth of the kerf 6.

【0011】 以上のように構成された第一のフレキシブル基板1と第二のフレキシブル基板 9とを接合する際には、前記第二のフレキシブル基板9を前記切り溝7により形 成された開口部に圧入することにより、導電パターン3と導電パターン10とが それぞれ金属層4、11を介して接触して電気的導通が得られるものである。 このとき、第一の導電パターン3に突起部が形成されているため、より良い接合 が望めるものである。When the first flexible substrate 1 and the second flexible substrate 9 configured as described above are joined, the second flexible substrate 9 has an opening formed by the cut groove 7. By press-fitting into the conductive pattern 3, the conductive pattern 3 and the conductive pattern 10 are brought into contact with each other via the metal layers 4 and 11, respectively, so that electrical conduction is obtained. At this time, since the protrusions are formed on the first conductive pattern 3, better bonding can be expected.

【0012】[0012]

【考案の効果】[Effect of device]

以上のように本考案によれば、フレキシブル基板上に形成された導電パターン そのものを利用してコネクター部を形成しているため、従来のように導電パター ンとコネクターとを接続する作業を必要としないものである。また、フレキシブ ルプリント基板の上に直接コネクターを形成するものであるため、その大きさも 小さく出来るものである。 As described above, according to the present invention, since the connector portion is formed by using the conductive pattern itself formed on the flexible substrate, it is necessary to connect the conductive pattern and the connector as in the conventional case. It does not. Also, since the connector is formed directly on the flexible printed circuit board, its size can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例のフレキシブル配線基板の接
続装置の要部断面図
FIG. 1 is a sectional view of an essential part of a flexible wiring board connecting device according to an embodiment of the present invention.

【図2】同実施例の要部分解斜視図FIG. 2 is an exploded perspective view of essential parts of the embodiment.

【符号の説明】[Explanation of symbols]

1 第1のフレキシブル基板 2 突起 3,10 導電パターン 4,11 金属層 5 第一の補強板 6,12 絶縁層 7 切り溝 8 第二の補強板 9 第二のフレキシブル基板 13 第三の補強板 DESCRIPTION OF SYMBOLS 1 1st flexible board 2 Protrusion 3 and 10 Conductive pattern 4 and 11 Metal layer 5 1st reinforcement board 6 and 12 Insulation layer 7 Cut groove 8 2nd reinforcement board 9 2nd flexible board 13 3rd reinforcement board

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】フレキシブルな基材の表面にその端部から
互いに並行すように形成された複数本の導電パターンの
前記端部に近接する位置に、それぞれ突状部を形成し、
前記端部近傍の下面に剛性基板を貼着するとともに、前
記基材の表面に前記導電パターンとの間に所定の間隙を
有し、かつ前記端部側に開口した空間を形成するように
剛性を有する板を貼着した第一のフレキシブルプリント
基板と、フレキシブルな基材の表面にその端部から互い
に並行すように形成された複数本の導電パターンを有
し、前記端部近傍の下面に剛性基板が貼着された第二の
フレキシブルプリント基板とよりなり、前記第二のフレ
キシブルプリント基板の端部は前記開口より空間に圧入
可能に構成されていることを特徴とするフレキシブルプ
リント基板の接続装置。
1. A projecting portion is formed on a surface of a flexible base material at a position close to the ends of a plurality of conductive patterns formed so as to be parallel to each other from the ends thereof.
A rigid substrate is attached to the lower surface in the vicinity of the end portion, and a rigid substrate is formed on the surface of the base material so as to have a predetermined gap between the conductive pattern and the end portion side. A first flexible printed circuit board having a plate attached thereto, and a plurality of conductive patterns formed on the surface of the flexible base material so as to be parallel to each other from the end thereof, and on the lower surface near the end. Connection of a flexible printed circuit board, comprising a second flexible printed circuit board to which a rigid substrate is adhered, and an end portion of the second flexible printed circuit board is configured to be press-fitted into a space through the opening. apparatus.
JP1992080396U 1992-11-20 1992-11-20 Flexible printed circuit board connection device Expired - Lifetime JP2566842Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1992080396U JP2566842Y2 (en) 1992-11-20 1992-11-20 Flexible printed circuit board connection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1992080396U JP2566842Y2 (en) 1992-11-20 1992-11-20 Flexible printed circuit board connection device

Publications (2)

Publication Number Publication Date
JPH0645380U true JPH0645380U (en) 1994-06-14
JP2566842Y2 JP2566842Y2 (en) 1998-03-30

Family

ID=13717134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1992080396U Expired - Lifetime JP2566842Y2 (en) 1992-11-20 1992-11-20 Flexible printed circuit board connection device

Country Status (1)

Country Link
JP (1) JP2566842Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283839A (en) * 1992-12-14 1994-10-07 Hughes Aircraft Co Electric interconnection of supported protrusive structure
JP2007273785A (en) * 2006-03-31 2007-10-18 Teikoku Tsushin Kogyo Co Ltd Connection structure and connection method of circuit substrates

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226882U (en) * 1985-07-31 1987-02-18
JPH01135673U (en) * 1988-03-09 1989-09-18
JPH0468383U (en) * 1990-10-26 1992-06-17

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226882U (en) * 1985-07-31 1987-02-18
JPH01135673U (en) * 1988-03-09 1989-09-18
JPH0468383U (en) * 1990-10-26 1992-06-17

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283839A (en) * 1992-12-14 1994-10-07 Hughes Aircraft Co Electric interconnection of supported protrusive structure
JP2007273785A (en) * 2006-03-31 2007-10-18 Teikoku Tsushin Kogyo Co Ltd Connection structure and connection method of circuit substrates

Also Published As

Publication number Publication date
JP2566842Y2 (en) 1998-03-30

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