JPH0296771U - - Google Patents
Info
- Publication number
- JPH0296771U JPH0296771U JP483489U JP483489U JPH0296771U JP H0296771 U JPH0296771 U JP H0296771U JP 483489 U JP483489 U JP 483489U JP 483489 U JP483489 U JP 483489U JP H0296771 U JPH0296771 U JP H0296771U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductor layer
- wiring conductor
- integrated circuit
- metal frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 8
- 238000005476 soldering Methods 0.000 claims 2
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案の実施例の混成集積回路を示す
斜視図、第２図はその取付け状態を示す正面図、
第３図は本考案の他の実施例の混成集積回路の斜
視図、第４図は本考案のさらに他の実施例の混成
集積回路を示す要部横断面図、第５図は従来例の
混成集積回路を説明するための正面図である。
１……混成集積回路、２……絶縁基板、３……
能動部品、４……受動部品、５……リード端子、
６……配線基板、７……金属枠体、８……被覆部
、９，１０……折曲部、１１，１２……接合部、
１３，１４，１５……取付け部、１６……樹脂。
FIG. 1 is a perspective view showing a hybrid integrated circuit according to an embodiment of the present invention, and FIG. 2 is a front view showing its installed state.
FIG. 3 is a perspective view of a hybrid integrated circuit according to another embodiment of the present invention, FIG. 4 is a cross-sectional view of main parts showing a hybrid integrated circuit according to still another embodiment of the present invention, and FIG. 5 is a conventional example. FIG. 2 is a front view for explaining a hybrid integrated circuit. 1... Hybrid integrated circuit, 2... Insulating substrate, 3...
Active components, 4...Passive components, 5...Lead terminals,
6...Wiring board, 7...Metal frame, 8...Coating part, 9, 10...Bending part, 11, 12...Joining part,
13, 14, 15...Mounting portion, 16...Resin.
Claims (1)
けた絶縁基板と、 前記配線導体層と電気的に接続され、かつ、配
線導体層面に沿つて下方向へ伸びるリード端子と
からなる混成集積回路において、 能動部品等を設けた絶縁基板面を覆う被覆と、
その左右両端を絶縁基板方向へ折曲げた折曲部と
、その先端を絶縁基板の中心方向へ折曲げた接合
部と、下方向に突出した取付け部とからなる金属
枠体を具備し、 前記金属枠体は前記絶縁基板面上の取付け用導
体層に半田付けにより接合されることを特徴とす
る混成集積回路。 (2) 配線導体層、能動部品、および受動部品品
を設けた絶縁基板と、 前記配線導体層と電気的に接続され、かつ、配
線導体層面に沿つて下方向へ伸びるリード端子と
からなる混成集積回路において、 能動部品等を設けた絶縁基板面に平行な平行部
と、その左右両端を絶縁基板方向へ折曲げた折曲
部と、その先端を絶縁基板の中心方向へ折曲げた
接合部と、下方向に突出した取付け部とからなる
金属枠体を具備し、 前記金属枠体が前記絶縁基板面上の取付け用導
体層に半田付けにより接合され、 少なくともその金属枠体内に樹脂が設けられて
いることを特徴とする混成集積回路。[Scope of Claim for Utility Model Registration] (1) An insulating substrate provided with a wiring conductor layer, active components, and passive components, and an insulating substrate that is electrically connected to the wiring conductor layer and extends downward along the wiring conductor layer surface. In a hybrid integrated circuit consisting of lead terminals, a coating that covers the insulating substrate surface on which active components etc. are installed;
It has a metal frame consisting of a bent portion whose left and right ends are bent toward the insulating substrate, a joint portion whose tip is bent toward the center of the insulated substrate, and a mounting portion which protrudes downward; A hybrid integrated circuit characterized in that the metal frame is joined to the mounting conductor layer on the surface of the insulating substrate by soldering. (2) A hybrid consisting of an insulating substrate provided with a wiring conductor layer, active components, and passive components, and a lead terminal that is electrically connected to the wiring conductor layer and extends downward along the wiring conductor layer surface. In an integrated circuit, a parallel part parallel to the surface of an insulating substrate on which active components etc. are installed, a bent part whose left and right ends are bent toward the insulating substrate, and a joint part whose tip is bent toward the center of the insulated substrate. and a mounting portion protruding downward, the metal frame being joined to the mounting conductor layer on the insulating substrate surface by soldering, and at least a resin provided within the metal frame. A hybrid integrated circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP483489U JPH0296771U (en) | 1989-01-19 | 1989-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP483489U JPH0296771U (en) | 1989-01-19 | 1989-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296771U true JPH0296771U (en) | 1990-08-01 |
Family
ID=31207696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP483489U Pending JPH0296771U (en) | 1989-01-19 | 1989-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296771U (en) |
-
1989
- 1989-01-19 JP JP483489U patent/JPH0296771U/ja active Pending
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