JPS63119271U - - Google Patents
Info
- Publication number
- JPS63119271U JPS63119271U JP1204687U JP1204687U JPS63119271U JP S63119271 U JPS63119271 U JP S63119271U JP 1204687 U JP1204687 U JP 1204687U JP 1204687 U JP1204687 U JP 1204687U JP S63119271 U JPS63119271 U JP S63119271U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- board
- recess
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 1
- 230000013011 mating Effects 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の基本的構成を示した電子部品
と基板の斜視図、第２図及び第３図は電子部品実
装後の断面図（第１図におけるＸ―Ｘ矢視断面）
、第４図は実施例に係る基板の斜視図、第５図は
同基板と電子部品との関係を示す斜視図、第６図
及び第７図は電子部品の基板への実装段階を示す
斜視図である。
１……電子部品、１ａ……端子、２……基板、
３……凹部、４……回路パターン、５……導電性
接着剤またはハンダ。
Fig. 1 is a perspective view of electronic components and a board showing the basic structure of the present invention, and Figs. 2 and 3 are cross-sectional views after mounting the electronic components (X--X arrow cross section in Fig. 1).
, FIG. 4 is a perspective view of the board according to the embodiment, FIG. 5 is a perspective view showing the relationship between the board and electronic components, and FIGS. 6 and 7 are perspective views showing the stages of mounting electronic components on the board. It is a diagram. 1... Electronic component, 1a... Terminal, 2... Board,
3... Concavity, 4... Circuit pattern, 5... Conductive adhesive or solder.
Claims (1)
品が嵌合する凹部または孔が形成されており、且
つ該電子部品がその凹部または孔に嵌合したとき
の該電子部品の端子部に配線を導くように所要の
回路パターンを作成したことを特徴とする嵌合実
装用配線基板。 (2) 基板の材質が、熱可塑性樹脂からなる実用
新案登録請求の範囲第(1)項記載の嵌合実装用配
線基板。[Claims for Utility Model Registration] (1) A recess or hole into which an electronic component to be mounted is fitted is formed in the wiring board, and when the electronic component is fitted into the recess or hole. A wiring board for fitting and mounting, characterized in that a required circuit pattern is created to guide wiring to a terminal portion of an electronic component. (2) The wiring board for mating mounting according to claim (1) of the utility model registration claim, wherein the material of the board is a thermoplastic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1204687U JPS63119271U (en) | 1987-01-29 | 1987-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1204687U JPS63119271U (en) | 1987-01-29 | 1987-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63119271U true JPS63119271U (en) | 1988-08-02 |
Family
ID=30799811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1204687U Pending JPS63119271U (en) | 1987-01-29 | 1987-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63119271U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013021269A (en) * | 2011-07-14 | 2013-01-31 | Ngk Spark Plug Co Ltd | Wiring substrate with built-in component |
-
1987
- 1987-01-29 JP JP1204687U patent/JPS63119271U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013021269A (en) * | 2011-07-14 | 2013-01-31 | Ngk Spark Plug Co Ltd | Wiring substrate with built-in component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63119271U (en) | ||
| JPH0241491U (en) | ||
| JPS6423883U (en) | ||
| JPS6280373U (en) | ||
| JPS6175156U (en) | ||
| JPH01109186U (en) | ||
| JPS6336076U (en) | ||
| JPH01125526U (en) | ||
| JPS62199975U (en) | ||
| JPH0164220U (en) | ||
| JPH0252471U (en) | ||
| JPH0470767U (en) | ||
| JPS642468U (en) | ||
| JPH0459182U (en) | ||
| JPH0272526U (en) | ||
| JPS6169861U (en) | ||
| JPH0459162U (en) | ||
| JPS58158401U (en) | Chip parts with lead terminals | |
| JPH02129796U (en) | ||
| JPH0263521U (en) | ||
| JPH01126062U (en) | ||
| JPH02136980U (en) | ||
| JPH0296771U (en) | ||
| JPH0280482U (en) | ||
| JPS60125766U (en) | Mold exterior chip parts |