JPH0164220U - - Google Patents
Info
- Publication number
- JPH0164220U JPH0164220U JP1987158850U JP15885087U JPH0164220U JP H0164220 U JPH0164220 U JP H0164220U JP 1987158850 U JP1987158850 U JP 1987158850U JP 15885087 U JP15885087 U JP 15885087U JP H0164220 U JPH0164220 U JP H0164220U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminals
- element body
- electronic component
- lead
- electrodes provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第1図〜第3図はこの考案の実施例であるリー
ド端子付き電子部品の構造を表す図であり、第1
図は樹脂外装前の外観斜視図、第2図は樹脂外装
前のリード端子方向からみた底面図であり、両図
においてAとBは異なる2つの例を示している。
また、第3図は第1図Aと第2図Aに示した例の
リード端子付き電子部品の回路基板への実装状態
を表す側面図である。第4図〜第6図は従来のリ
ード端子付き電子部品の構造を表す図であり、第
4図は樹脂外装前の外観斜視図、第5図は樹脂外
装前のリード端子側からみた底面図、第6図は回
路基板への実装状態を表す側面図である。
1……板状電子部品素体、5〜7……端子電極
、8〜10……リード端子、A,B……クランク
状屈曲部。
Figures 1 to 3 are diagrams showing the structure of an electronic component with lead terminals that is an embodiment of this invention.
The figure is a perspective view of the external appearance before resin sheathing, and FIG. 2 is a bottom view seen from the lead terminal direction before resin sheathing, and in both figures, A and B show two different examples.
Further, FIG. 3 is a side view showing a state in which the electronic component with lead terminals of the example shown in FIGS. 1A and 2A is mounted on a circuit board. Figures 4 to 6 are diagrams showing the structure of a conventional electronic component with lead terminals. Figure 4 is a perspective view of the external appearance before resin packaging, and Figure 5 is a bottom view as seen from the lead terminal side before resin packaging. , FIG. 6 is a side view showing the mounting state on the circuit board. DESCRIPTION OF SYMBOLS 1... Plate-shaped electronic component body, 5-7... Terminal electrode, 8-10... Lead terminal, A, B... Crank-shaped bent part.
Claims (1)
極にリード端子を接合し、各リード端子を同一方
向に引き出した電子部品において、 前記素体の少なくとも一方の主面に設けた端子
電極に接合するリード端子を素体の端部でクラン
ク状に屈曲させ、全てのリード端子を素体と平行
な同一平面に配したことを特徴とするリード端子
付き電子部品。[Claims for Utility Model Registration] An electronic component in which lead terminals are joined to terminal electrodes provided on both main surfaces of a plate-shaped electronic component element body, and each lead terminal is pulled out in the same direction, at least one of the element bodies. An electronic device with lead terminals, characterized in that the lead terminals connected to the terminal electrodes provided on the main surface of the element body are bent in a crank shape at the ends of the element body, and all the lead terminals are arranged on the same plane parallel to the element body. parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987158850U JPH0164220U (en) | 1987-10-16 | 1987-10-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987158850U JPH0164220U (en) | 1987-10-16 | 1987-10-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0164220U true JPH0164220U (en) | 1989-04-25 |
Family
ID=31439548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987158850U Pending JPH0164220U (en) | 1987-10-16 | 1987-10-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0164220U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001069699A1 (en) * | 2000-03-14 | 2001-09-20 | Matsushita Electric Industrial Co., Ltd. | Secondary cell and method for bonding lead thereof, and battery power supply |
-
1987
- 1987-10-16 JP JP1987158850U patent/JPH0164220U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001069699A1 (en) * | 2000-03-14 | 2001-09-20 | Matsushita Electric Industrial Co., Ltd. | Secondary cell and method for bonding lead thereof, and battery power supply |