JPH0164220U - - Google Patents

Info

Publication number
JPH0164220U
JPH0164220U JP1987158850U JP15885087U JPH0164220U JP H0164220 U JPH0164220 U JP H0164220U JP 1987158850 U JP1987158850 U JP 1987158850U JP 15885087 U JP15885087 U JP 15885087U JP H0164220 U JPH0164220 U JP H0164220U
Authority
JP
Japan
Prior art keywords
lead terminals
element body
electronic component
lead
electrodes provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987158850U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987158850U priority Critical patent/JPH0164220U/ja
Publication of JPH0164220U publication Critical patent/JPH0164220U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第3図はこの考案の実施例であるリー
ド端子付き電子部品の構造を表す図であり、第1
図は樹脂外装前の外観斜視図、第2図は樹脂外装
前のリード端子方向からみた底面図であり、両図
においてAとBは異なる2つの例を示している。
また、第3図は第1図Aと第2図Aに示した例の
リード端子付き電子部品の回路基板への実装状態
を表す側面図である。第4図〜第6図は従来のリ
ード端子付き電子部品の構造を表す図であり、第
4図は樹脂外装前の外観斜視図、第5図は樹脂外
装前のリード端子側からみた底面図、第6図は回
路基板への実装状態を表す側面図である。 1……板状電子部品素体、5〜7……端子電極
、8〜10……リード端子、A,B……クランク
状屈曲部。
Figures 1 to 3 are diagrams showing the structure of an electronic component with lead terminals that is an embodiment of this invention.
The figure is a perspective view of the external appearance before resin sheathing, and FIG. 2 is a bottom view seen from the lead terminal direction before resin sheathing, and in both figures, A and B show two different examples.
Further, FIG. 3 is a side view showing a state in which the electronic component with lead terminals of the example shown in FIGS. 1A and 2A is mounted on a circuit board. Figures 4 to 6 are diagrams showing the structure of a conventional electronic component with lead terminals. Figure 4 is a perspective view of the external appearance before resin packaging, and Figure 5 is a bottom view as seen from the lead terminal side before resin packaging. , FIG. 6 is a side view showing the mounting state on the circuit board. DESCRIPTION OF SYMBOLS 1... Plate-shaped electronic component body, 5-7... Terminal electrode, 8-10... Lead terminal, A, B... Crank-shaped bent part.

Claims (1)

【実用新案登録請求の範囲】 板状電子部品素体の両主面に設けられた端子電
極にリード端子を接合し、各リード端子を同一方
向に引き出した電子部品において、 前記素体の少なくとも一方の主面に設けた端子
電極に接合するリード端子を素体の端部でクラン
ク状に屈曲させ、全てのリード端子を素体と平行
な同一平面に配したことを特徴とするリード端子
付き電子部品。
[Claims for Utility Model Registration] An electronic component in which lead terminals are joined to terminal electrodes provided on both main surfaces of a plate-shaped electronic component element body, and each lead terminal is pulled out in the same direction, at least one of the element bodies. An electronic device with lead terminals, characterized in that the lead terminals connected to the terminal electrodes provided on the main surface of the element body are bent in a crank shape at the ends of the element body, and all the lead terminals are arranged on the same plane parallel to the element body. parts.
JP1987158850U 1987-10-16 1987-10-16 Pending JPH0164220U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987158850U JPH0164220U (en) 1987-10-16 1987-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987158850U JPH0164220U (en) 1987-10-16 1987-10-16

Publications (1)

Publication Number Publication Date
JPH0164220U true JPH0164220U (en) 1989-04-25

Family

ID=31439548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987158850U Pending JPH0164220U (en) 1987-10-16 1987-10-16

Country Status (1)

Country Link
JP (1) JPH0164220U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001069699A1 (en) * 2000-03-14 2001-09-20 Matsushita Electric Industrial Co., Ltd. Secondary cell and method for bonding lead thereof, and battery power supply

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001069699A1 (en) * 2000-03-14 2001-09-20 Matsushita Electric Industrial Co., Ltd. Secondary cell and method for bonding lead thereof, and battery power supply

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