JPS6338362U - - Google Patents
Info
- Publication number
- JPS6338362U JPS6338362U JP13115286U JP13115286U JPS6338362U JP S6338362 U JPS6338362 U JP S6338362U JP 13115286 U JP13115286 U JP 13115286U JP 13115286 U JP13115286 U JP 13115286U JP S6338362 U JPS6338362 U JP S6338362U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- boards
- stacked
- integrated circuit
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は本考案の一実施例の斜視図、第２図は
その側面図、第３図は製造途中の状態の斜視図、
第４図ａは従来の一例の側面図、同図ｂは従来の
異なる例の側面図である。
１，２……基板、３……フレキシブル回路板、
４……絶縁板、５……プリント回路、６……電子
部品、７……外部リード、１１……回路基板、１
２……電子部品、１３……外部リード。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a perspective view of a state in the middle of manufacturing.
FIG. 4a is a side view of a conventional example, and FIG. 4b is a side view of a different conventional example. 1, 2... Board, 3... Flexible circuit board,
4...Insulating board, 5...Printed circuit, 6...Electronic component, 7...External lead, 11...Circuit board, 1
2...Electronic component, 13...External lead.
Claims (1)
ハイブリツド集積回路において、前記回路基板を
２枚の基板と、これら両基板に亘つて接着したフ
レキシブル回路板で構成し、このフレキシブル回
路板に電子部品を実装するとともに、このフレキ
シブル回路板を折曲げて前記各基板を背中合わせ
に重ねたことを特徴とするハイブリツド集積回路
。 (2) 重ねた基板の端部に外部リードを機械的及
び電気的に接続し、この外部リードで重ねた両基
板を一体的にクランプしてなる実用新案登録請求
の範囲第１項記載のハイブリツド集積回路。[Claims for Utility Model Registration] (1) In a hybrid integrated circuit in which electronic components are mounted on both sides of a circuit board, the circuit board is comprised of two boards and a flexible circuit board bonded across both boards. 1. A hybrid integrated circuit comprising: a flexible circuit board having electronic components mounted thereon; and the flexible circuit board being bent and the respective boards stacked back to back. (2) The hybrid according to claim 1, which is obtained by mechanically and electrically connecting external leads to the ends of stacked boards, and integrally clamping both stacked boards with the external leads. integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13115286U JPS6338362U (en) | 1986-08-29 | 1986-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13115286U JPS6338362U (en) | 1986-08-29 | 1986-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6338362U true JPS6338362U (en) | 1988-03-11 |
Family
ID=31029327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13115286U Pending JPS6338362U (en) | 1986-08-29 | 1986-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6338362U (en) |
-
1986
- 1986-08-29 JP JP13115286U patent/JPS6338362U/ja active Pending
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