JPS639133U - - Google Patents
Info
- Publication number
- JPS639133U JPS639133U JP10222086U JP10222086U JPS639133U JP S639133 U JPS639133 U JP S639133U JP 10222086 U JP10222086 U JP 10222086U JP 10222086 U JP10222086 U JP 10222086U JP S639133 U JPS639133 U JP S639133U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting structure
- component mounting
- resin film
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Description
第１図は本考案に係る電子部品の取付構造を示
す説明図、第２図は同取付構造で用いる樹脂フイ
ルムの平面図、第３図は同フイルムの一部側断面
図、第４及び５図は樹脂フイルムの変形例を示す
平面並びに一部側断面図、第６図は本考案の別の
実施例に係る電子部品の取付構造を示す説明図、
第７及び８図は従来例に係る電子部品の取付構造
を示す説明図である。
１０：電子部品、１１：回路基板、１２：半田
、１３：樹脂フイルム、１４，１４……：導体箔
。
Fig. 1 is an explanatory diagram showing a mounting structure for electronic components according to the present invention, Fig. 2 is a plan view of a resin film used in the mounting structure, Fig. 3 is a partial side sectional view of the same film, and Fig. 4 and 5 The figures are a plan view and a partial side sectional view showing a modified example of the resin film, and FIG. 6 is an explanatory view showing a mounting structure for electronic components according to another embodiment of the present invention.
7 and 8 are explanatory diagrams showing a conventional electronic component mounting structure. 10: Electronic component, 11: Circuit board, 12: Solder, 13: Resin film, 14, 14...: Conductor foil.
Claims (1)
体装着し、その導体箔を介して樹脂フイルム上に
搭載する電子部品を半田付けで回路基板と電気的
に接続してなることを特徴とする電子部品の取付
構造。 (2) 上記電子部品が、集積回路部品であるとこ
ろの実用新案登録請求の範囲第１項記載の電子部
品の取付構造。 (3) 上記フイルムが、ポリイミド樹脂で形成さ
れているところの実用新案登録請求の範囲第１項
記載の電子部品の取付構造。 (4) 上記導体箔が、樹脂フイルム上に搭載する
電子部品の端子数と少なくとも同数装着されてい
るところの実用新案登録請求の範囲第１項記載の
電子部品の取付構造。[Scope of claim for utility model registration] (1) Conductor foil is integrally attached to a flexible resin film, and electronic components mounted on the resin film are electrically connected to a circuit board by soldering through the conductor foil. An electronic component mounting structure characterized by: (2) The electronic component mounting structure according to claim 1, wherein the electronic component is an integrated circuit component. (3) The electronic component mounting structure according to claim 1, wherein the film is made of polyimide resin. (4) The electronic component mounting structure according to claim 1, wherein the number of conductor foils is at least equal to the number of terminals of the electronic component mounted on the resin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10222086U JPS639133U (en) | 1986-07-03 | 1986-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10222086U JPS639133U (en) | 1986-07-03 | 1986-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS639133U true JPS639133U (en) | 1988-01-21 |
Family
ID=30973671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10222086U Pending JPS639133U (en) | 1986-07-03 | 1986-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS639133U (en) |
-
1986
- 1986-07-03 JP JP10222086U patent/JPS639133U/ja active Pending
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