JPS6318864U - - Google Patents
Info
- Publication number
- JPS6318864U JPS6318864U JP11230486U JP11230486U JPS6318864U JP S6318864 U JPS6318864 U JP S6318864U JP 11230486 U JP11230486 U JP 11230486U JP 11230486 U JP11230486 U JP 11230486U JP S6318864 U JPS6318864 U JP S6318864U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- view
- plan
- main surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例のプリント基板の断面
図、第２図は本考案が実施されたプリント基板の
表主面の平面図、第３図は第２図の裏主面の平面
図、第４図は第２図の裏側（第３図）を透視で見
た平面図、第５図は第２図の上にチツプ部品を取
付けた平面図、第６図は第３図の上にチツプ部品
を取付けた平面図、第７図は従来のプリント基板
の製造工程を説明する断面図、第８図は従来の技
術に於ける製造上の問題点を説明するプリント基
板の断面図、第９図はプリント基板に適用される
回路の一例を示す回路図、第１０図は従来の技術
に於けるプリント基板の表主面の平面図、第１１
図は第１０図の裏主面の平面図、第１２図は第１
０図の裏側（第１１図）を透視で見た平面図、第
１３図は第１０図の上にチツプ部品を取付けた平
面図、第１４図は第１１図の上にチツプ部品を取
付けた平面図である。
１……プリント基板、２，３，２３，２４，２
５……チツプ部品、４……チツプ部品の端子部、
５，１２，１３，１４，１５，１６，１７，１８
……ランド、６……クリーム半田、７……半田槽
の半田、８……接着剤、９……スルーホールの導
体部、１０……充填物、１１……スルーホール、
１９……プリント基板の端子、１９，２０……プ
リント基板の端子、２１……前段からの信号入力
、２２……次段への信号出力、２６……プリント
基板の左端の位置。
Fig. 1 is a sectional view of a printed circuit board according to an embodiment of the present invention, Fig. 2 is a plan view of the front main surface of the printed circuit board in which the present invention is implemented, and Fig. 3 is a plan view of the back main surface of Fig. 2. , Figure 4 is a plan view of the back side of Figure 2 (Figure 3), Figure 5 is a plan view of the top of Figure 2 with chip parts attached, and Figure 6 is the top of Figure 3. 7 is a sectional view illustrating the manufacturing process of a conventional printed circuit board, and FIG. 8 is a sectional view of a printed circuit board illustrating manufacturing problems in the conventional technology. FIG. 9 is a circuit diagram showing an example of a circuit applied to a printed circuit board, FIG. 10 is a plan view of the main surface of the printed circuit board in the conventional technology, and FIG.
The figure is a plan view of the back main surface of Figure 10, and Figure 12 is a plan view of the back main surface of Figure 10.
A transparent plan view of the back side of Figure 0 (Figure 11), Figure 13 is a plan view with the chip parts installed on top of Figure 10, and Figure 14 is a plan view with the chip parts installed on top of Figure 11. FIG. 1...Printed circuit board, 2, 3, 23, 24, 2
5... Chip parts, 4... Terminals of chip parts,
5, 12, 13, 14, 15, 16, 17, 18
... Land, 6 ... Cream solder, 7 ... Solder in the solder tank, 8 ... Adhesive, 9 ... Conductor part of through hole, 10 ... Filler, 11 ... Through hole,
19...Terminals of the printed circuit board, 19, 20...Terminals of the printed circuit board, 21...Signal input from the previous stage, 22...Signal output to the next stage, 26...Left end position of the printed circuit board.
Claims (1)
品を前記両主面に半田付接続したプリント基板に
おいて、前記両主面の配線を電気的に接続するた
めのスルーホールの穴に充填物を設け、貫通した
穴のないことを特徴とするプリント基板。 In a printed circuit board in which printed wiring is applied to both main surfaces and chip components are soldered to both main surfaces, a filling material is provided in a through hole for electrically connecting the wiring on both main surfaces. , a printed circuit board characterized by having no through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11230486U JPS6318864U (en) | 1986-07-21 | 1986-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11230486U JPS6318864U (en) | 1986-07-21 | 1986-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6318864U true JPS6318864U (en) | 1988-02-08 |
Family
ID=30993050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11230486U Pending JPS6318864U (en) | 1986-07-21 | 1986-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6318864U (en) |
-
1986
- 1986-07-21 JP JP11230486U patent/JPS6318864U/ja active Pending