JPS6169865U - - Google Patents
Info
- Publication number
- JPS6169865U JPS6169865U JP15446484U JP15446484U JPS6169865U JP S6169865 U JPS6169865 U JP S6169865U JP 15446484 U JP15446484 U JP 15446484U JP 15446484 U JP15446484 U JP 15446484U JP S6169865 U JPS6169865 U JP S6169865U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- resin film
- printed wiring
- predetermined
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案一実施例の平面図、第２図は同
じく側断面図、第３図、第４図は基板をマザーボ
ードに接続した状態を示す要部側断面図、第５図
は従来の基板の斜視図である。
１…基板、２…電極、３…樹脂フイルム、４…
第１電極、５…第２電極、７…切り込み、８…半
田、９…他の基板（マザーボード）。
Figure 1 is a plan view of one embodiment of the present invention, Figure 2 is a side sectional view, Figures 3 and 4 are side sectional views of main parts showing the state in which the board is connected to the motherboard, and Figure 5 is a conventional FIG. 1...Substrate, 2...Electrode, 3...Resin film, 4...
First electrode, 5... Second electrode, 7... Notch, 8... Solder, 9... Other board (motherboard).
Claims (1)
に所定の電極が設けられた基板と、該所定の電極
に対応した位置に第１電極と端部に第２電極を有
し前記第１電極と第２電極とを接続する導電路が
設けられた樹脂フイルムとを備え、 前記基板の所定の電極と前記樹脂フイルムの第
１電極とを接続し、前記樹脂フイルムの第２電極
により他の基板の電極と接続し他の基板に積層さ
れることを特徴とする印刷配線基板。 (2) 前記樹脂フイルムの第２電極間には適宜切
り込みが設けられていることを特徴とする実用新
案登録請求の範囲第１項記載の印刷配線基板。[Claims for Utility Model Registration] (1) A substrate having a printed wiring pattern on at least one side and a predetermined electrode at the end, a first electrode at a position corresponding to the predetermined electrode, and a second electrode at the end. and a resin film provided with a conductive path connecting the first electrode and the second electrode, connecting a predetermined electrode of the substrate and the first electrode of the resin film, A printed wiring board characterized in that it is connected to an electrode of another board by a second electrode and is laminated on the other board. (2) The printed wiring board according to claim 1, wherein a notch is appropriately provided between the second electrodes of the resin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15446484U JPS6169865U (en) | 1984-10-12 | 1984-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15446484U JPS6169865U (en) | 1984-10-12 | 1984-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169865U true JPS6169865U (en) | 1986-05-13 |
Family
ID=30712455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15446484U Pending JPS6169865U (en) | 1984-10-12 | 1984-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169865U (en) |
-
1984
- 1984-10-12 JP JP15446484U patent/JPS6169865U/ja active Pending
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