JPS61109170U - - Google Patents
Info
- Publication number
- JPS61109170U JPS61109170U JP19227884U JP19227884U JPS61109170U JP S61109170 U JPS61109170 U JP S61109170U JP 19227884 U JP19227884 U JP 19227884U JP 19227884 U JP19227884 U JP 19227884U JP S61109170 U JPS61109170 U JP S61109170U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- sub
- soldering
- modifying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案を実施した副基板の断面図、
第２図は実施例の副基板を主基板に実装した状態
の断面図、第３図は従来の副基板の断面図、第４
図は従来の副基板を主基板に実装した状態の断面
図である。
１′……フレキシブル印刷配線板、２……ベー
スフイルム、３……スルホールめつき部。
FIG. 1 is a sectional view of a sub-board implementing the present invention;
Fig. 2 is a sectional view of the sub-board of the embodiment mounted on the main board, Fig. 3 is a sectional view of a conventional sub-board, and Fig. 4 is a sectional view of a conventional sub-board.
The figure is a sectional view of a conventional sub-board mounted on a main board. 1' ...Flexible printed wiring board, 2...Base film, 3...Through hole plating part.
Claims (1)
線パターンを修正、変更、又は、修飾するための
副印刷配線板とが半田付けにより電気的、及び、
機械的に接続されて構成される複合型の印刷配線
板において、前記副印刷配線板の少なくとも半田
付けがなされる貫通孔部にスルホールめつき処理
が施されることを特徴とした印刷配線板。 The main printed wiring board and the sub printed wiring board for modifying, changing, or modifying the wiring pattern formed on the main printed wiring board are electrically connected by soldering, and
1. A printed wiring board of a composite type configured to be mechanically connected, characterized in that at least a through-hole portion of the sub-printed wiring board to which soldering is performed is subjected to a through-hole plating process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19227884U JPS61109170U (en) | 1984-12-20 | 1984-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19227884U JPS61109170U (en) | 1984-12-20 | 1984-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61109170U true JPS61109170U (en) | 1986-07-10 |
Family
ID=30749701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19227884U Pending JPS61109170U (en) | 1984-12-20 | 1984-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61109170U (en) |
-
1984
- 1984-12-20 JP JP19227884U patent/JPS61109170U/ja active Pending