JPH0236075U - - Google Patents
Info
- Publication number
- JPH0236075U JPH0236075U JP11536388U JP11536388U JPH0236075U JP H0236075 U JPH0236075 U JP H0236075U JP 11536388 U JP11536388 U JP 11536388U JP 11536388 U JP11536388 U JP 11536388U JP H0236075 U JPH0236075 U JP H0236075U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- wiring board
- printed wiring
- copper
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の第１の実施例の印刷配線板の
パツドの長手方向の断面図、第２図〜第４図は本
考案の第１の実施例の印刷配線板のパツドの製造
方法を説明する工程順に示した断面図、第５図は
本考案の第２の実施例の印刷配線板のパツドの長
手方向の断面図、第６図は本考案の第２の実施例
のチツプ部品用パツドの平面図、第７図は従来の
印刷配線板の一例のフラツトパツケージ用パツド
の平面図、第８図は従来の印刷配線板の一例のフ
ラツトパツケージ用パツドの長手方向の断面図で
ある。
１，１ａ……パツド、２……基板、３……耐め
つきレジストインク、４……チツプ部品、１０ａ
……銅箔、１０ｂ……銅めつき、１０ｃ……半田
、１０ｄ……パターン銅めつき、１０ｅ……銅め
つきの凸部。
FIG. 1 is a longitudinal sectional view of a pad of a printed wiring board according to a first embodiment of the present invention, and FIGS. 2 to 4 are a method of manufacturing a pad of a printed wiring board according to a first embodiment of the present invention. 5 is a cross-sectional view in the longitudinal direction of a pad of a printed wiring board according to a second embodiment of the present invention, and FIG. 6 is a cross-sectional view of a chip component according to a second embodiment of the present invention. FIG. 7 is a plan view of a flat package pad as an example of a conventional printed wiring board, and FIG. 8 is a longitudinal sectional view of a flat package pad as an example of a conventional printed wiring board. It is. 1, 1a...pad, 2...substrate, 3...metal resist ink, 4...chip parts, 10a
...Copper foil, 10b...Copper plating, 10c...Solder, 10d...Pattern copper plating, 10e...Copper plating convex portion.
Claims (1)
用パツドを有する印刷配線板において、前記パツ
ドの長手方向の両端側上面部に中央上面部より一
段高い銅めつきの凸部を設け半田コート処理を施
したことを特徴とする印刷配線板。 In a printed wiring board having a pad for attaching a surface mount component having a plurality of lead parts, a copper-plated convex part higher than the central upper part is provided on the top part of both ends in the longitudinal direction of the pad, and a solder coating process is applied. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11536388U JPH0236075U (en) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11536388U JPH0236075U (en) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236075U true JPH0236075U (en) | 1990-03-08 |
Family
ID=31356956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11536388U Pending JPH0236075U (en) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236075U (en) |
-
1988
- 1988-08-31 JP JP11536388U patent/JPH0236075U/ja active Pending