JPS6234470U - - Google Patents
Info
- Publication number
- JPS6234470U JPS6234470U JP12465885U JP12465885U JPS6234470U JP S6234470 U JPS6234470 U JP S6234470U JP 12465885 U JP12465885 U JP 12465885U JP 12465885 U JP12465885 U JP 12465885U JP S6234470 U JPS6234470 U JP S6234470U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- holes
- grid
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 238000003672 processing method Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図本考案に係る導体形状を有する印刷配線
板の部分平面図、第２図は従来の導体形状を有す
る印刷配線板の部分平面図、第３図は本考案の他
の実施例を示す導体形状を有する印刷配線板の部
分平面図である。
１１……基本格子、１２……副格子、１３……
基本格子上の貫通孔、１４……配線部、１５……
基本格子上のランド、１６……副格子上の貫通孔
、１７，１８……副格子上のランド。
Fig. 1 is a partial plan view of a printed wiring board having a conductor shape according to the present invention, Fig. 2 is a partial plan view of a conventional printed wiring board having a conductor shape, and Fig. 3 shows another embodiment of the present invention. FIG. 2 is a partial plan view of a printed wiring board having a conductor shape. 11...basic lattice, 12...sublattice, 13...
Through hole on basic grid, 14... Wiring section, 15...
Land on the basic lattice, 16... Through hole on the sub-lattice, 17, 18... Land on the sub-lattice.
Claims (1)
け、該貫通孔にランドが形成されるシエーパー加
工方式による印刷配線板において、前記副格子上
の貫通孔に基本格子と同様の径を有し、かつ多角
形状のランドを形成するようにしたことを特徴と
する印刷配線板。 (2) 前記ランドの形状は菱形であることを特徴
とする印刷配線板。[Claims for Utility Model Registration] (1) In a printed wiring board using a shaper processing method in which through holes are provided on each of the basic grid and the sub-grid, and lands are formed in the through holes, the through-holes on the sub-grid are 1. A printed wiring board characterized in that a land having a diameter similar to that of a basic lattice and having a polygonal shape is formed. (2) A printed wiring board characterized in that the land has a diamond shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12465885U JPS6234470U (en) | 1985-08-15 | 1985-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12465885U JPS6234470U (en) | 1985-08-15 | 1985-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6234470U true JPS6234470U (en) | 1987-02-28 |
Family
ID=31016876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12465885U Pending JPS6234470U (en) | 1985-08-15 | 1985-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234470U (en) |
-
1985
- 1985-08-15 JP JP12465885U patent/JPS6234470U/ja active Pending