JPS6363022U - - Google Patents

Info

Publication number
JPS6363022U
JPS6363022U JP15663986U JP15663986U JPS6363022U JP S6363022 U JPS6363022 U JP S6363022U JP 15663986 U JP15663986 U JP 15663986U JP 15663986 U JP15663986 U JP 15663986U JP S6363022 U JPS6363022 U JP S6363022U
Authority
JP
Japan
Prior art keywords
insulating substrate
busbar
groove
wiring board
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15663986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15663986U priority Critical patent/JPS6363022U/ja
Publication of JPS6363022U publication Critical patent/JPS6363022U/ja
Pending legal-status Critical Current

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  • Connection Or Junction Boxes (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す積層ブスバー
配線板の断面図、第2図ないし第4図はそれぞれ
従来例の説明図である。 10,10,10……ブスバー、11,1
,11……絶縁基板、12……凹溝、13
……凸条。
FIG. 1 is a sectional view of a laminated bus bar wiring board showing an embodiment of the present invention, and FIGS. 2 to 4 are explanatory views of conventional examples. 10,10 1,10 2 ...Bus bar, 11,1
1 1 , 11 2 ... Insulating substrate, 12 ... Concave groove, 13
...Protrusions.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 所望のパターンを有するブスバーを絶縁基板に
配設してなる配線板を複数層に重ねた積層ブスバ
ー配線板において、各層の絶縁基板の表面にブス
バーの厚みより大きな深さのブスバーを載置する
凹溝を設け、下層の絶縁基板と対向する絶縁基板
の裏面には前記凹溝に対応する凸条を設けたこと
を特徴とする積層ブスバー配線板の漏洩電流防止
構造。
In a laminated busbar wiring board in which wiring boards each having a desired pattern are arranged on an insulating substrate are stacked in multiple layers, a recess in which a busbar having a depth greater than the thickness of the busbar is placed on the surface of the insulating substrate of each layer. 1. A leakage current prevention structure for a laminated busbar wiring board, characterized in that a groove is provided, and a protruding strip corresponding to the groove is provided on the back surface of the insulating substrate facing the lower layer insulating substrate.
JP15663986U 1986-10-15 1986-10-15 Pending JPS6363022U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15663986U JPS6363022U (en) 1986-10-15 1986-10-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15663986U JPS6363022U (en) 1986-10-15 1986-10-15

Publications (1)

Publication Number Publication Date
JPS6363022U true JPS6363022U (en) 1988-04-26

Family

ID=31078443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15663986U Pending JPS6363022U (en) 1986-10-15 1986-10-15

Country Status (1)

Country Link
JP (1) JPS6363022U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193913U (en) * 1987-12-16 1989-06-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193913U (en) * 1987-12-16 1989-06-21

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