JPS6419788A - Surface mounting printed wiring board - Google Patents

Surface mounting printed wiring board

Info

Publication number
JPS6419788A
JPS6419788A JP17664387A JP17664387A JPS6419788A JP S6419788 A JPS6419788 A JP S6419788A JP 17664387 A JP17664387 A JP 17664387A JP 17664387 A JP17664387 A JP 17664387A JP S6419788 A JPS6419788 A JP S6419788A
Authority
JP
Japan
Prior art keywords
pattern
face
smd
holes
foot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17664387A
Other languages
Japanese (ja)
Other versions
JPH0744319B2 (en
Inventor
Nobuhiro Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17664387A priority Critical patent/JPH0744319B2/en
Publication of JPS6419788A publication Critical patent/JPS6419788A/en
Publication of JPH0744319B2 publication Critical patent/JPH0744319B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To enable a very dense mounting by a method wherein foot patterns are provided at the position facing leads 1-1 of an SMD 1 and connected to a signal or a power pattern, and through-holes provided halfway between the foot patterns are connected to the outer end face edges of the foot patterns. CONSTITUTION:A surface mounting part, for instance, rectangular foot patterns 3 are provided at the position of a SMD 1 shown by a broken line so as to face leads 1-1 in such a manner as they are disposed to face each other on a primary face of a laminated plate which is provided with a signal and a power pattern inside it. And, drilled holes are provided halfway between each pair of foot pattern facing each other and a pair of through-holes 4 connected with a power and a signal pattern mentioned above through a copper plating is provided each and a narrow wiring pattern 15 is provided which connects the through-holes 4 on a primary face side with the outer end face edges of the foot patterns 3. By these processes, a highly dense mounting can be realized and a pattern cut position 7 is out of the mounting region of the SMD 1, therefore a pattern cut can be performed with the SMD 1 mounted when the circuit is remodeled and a corrective connection can be done with a remodeling wire 8.
JP17664387A 1987-07-14 1987-07-14 Printed wiring board for surface mounting Expired - Fee Related JPH0744319B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17664387A JPH0744319B2 (en) 1987-07-14 1987-07-14 Printed wiring board for surface mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17664387A JPH0744319B2 (en) 1987-07-14 1987-07-14 Printed wiring board for surface mounting

Publications (2)

Publication Number Publication Date
JPS6419788A true JPS6419788A (en) 1989-01-23
JPH0744319B2 JPH0744319B2 (en) 1995-05-15

Family

ID=16017167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17664387A Expired - Fee Related JPH0744319B2 (en) 1987-07-14 1987-07-14 Printed wiring board for surface mounting

Country Status (1)

Country Link
JP (1) JPH0744319B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7114389B1 (en) 2000-10-10 2006-10-03 Vkr Holding A/S Rain sensor arrangement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7114389B1 (en) 2000-10-10 2006-10-03 Vkr Holding A/S Rain sensor arrangement

Also Published As

Publication number Publication date
JPH0744319B2 (en) 1995-05-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees