GB2087157B - Solder plating printed circuit boards - Google Patents

Solder plating printed circuit boards

Info

Publication number
GB2087157B
GB2087157B GB8041013A GB8041013A GB2087157B GB 2087157 B GB2087157 B GB 2087157B GB 8041013 A GB8041013 A GB 8041013A GB 8041013 A GB8041013 A GB 8041013A GB 2087157 B GB2087157 B GB 2087157B
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
solder plating
plating printed
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8041013A
Other versions
GB2087157A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QUASSIA ELECTRONICS Ltd
Original Assignee
QUASSIA ELECTRONICS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by QUASSIA ELECTRONICS Ltd filed Critical QUASSIA ELECTRONICS Ltd
Priority to GB8041013A priority Critical patent/GB2087157B/en
Publication of GB2087157A publication Critical patent/GB2087157A/en
Application granted granted Critical
Publication of GB2087157B publication Critical patent/GB2087157B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
GB8041013A 1980-11-05 1980-12-22 Solder plating printed circuit boards Expired GB2087157B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8041013A GB2087157B (en) 1980-11-05 1980-12-22 Solder plating printed circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8035492 1980-11-05
GB8041013A GB2087157B (en) 1980-11-05 1980-12-22 Solder plating printed circuit boards

Publications (2)

Publication Number Publication Date
GB2087157A GB2087157A (en) 1982-05-19
GB2087157B true GB2087157B (en) 1984-06-06

Family

ID=26277419

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8041013A Expired GB2087157B (en) 1980-11-05 1980-12-22 Solder plating printed circuit boards

Country Status (1)

Country Link
GB (1) GB2087157B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3623505A1 (en) * 1986-07-09 1988-01-21 Deutsche Telephonwerk Kabel METHOD FOR PRODUCING CIRCUIT BOARDS WITH GALVANIC LEAD-TIN LAYERS SELECTIVELY APPLIED ON THE SOLUTION EYES AND HOLE WALLS
US4978423A (en) * 1988-09-26 1990-12-18 At&T Bell Laboratories Selective solder formation on printed circuit boards
GB2300524A (en) * 1995-05-05 1996-11-06 Compeq Manufacturing Co Limite Process for making a printed circuit board partially coated with solder
US7910156B2 (en) * 2007-03-30 2011-03-22 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate with selected conductors having solder thereon
FR2972597B1 (en) * 2011-03-10 2014-08-01 Thales Sa METHOD FOR MANUFACTURING THE WIRING AREAS OF A PRINTED BOARD

Also Published As

Publication number Publication date
GB2087157A (en) 1982-05-19

Similar Documents

Publication Publication Date Title
GB2080629B (en) Printed circuit boards
GB2080042B (en) Printed circuit board
GB2063925B (en) Solder coating printed circuit boards
GB2073957B (en) Printed circuit board
JPS56155587A (en) Printed circuit board
GB2124035B (en) Printed circuit boards
GB2120017B (en) Making printed circuit boards having plated through-holes
JPS5713791A (en) Printed circuit board
GB2087157B (en) Solder plating printed circuit boards
GB2087654B (en) Printed circuit boards
GB2118369B (en) Making printed circuit boards
JPS5713674A (en) Printed circuit board
JPS575385A (en) Printed circuit board
JPS5776897A (en) Printed circuit board
JPS572599A (en) Multilayer printed circuit board
JPS5745997A (en) Multilayer printed circuit board
JPS5784196A (en) Multilayer printed circuit board
JPS5785283A (en) Printed circuit board
JPS5743491A (en) Printed circuit board
JPS56150899A (en) Multilayer printed circuit board
JPS5783086A (en) Printed circuit board
JPS5769795A (en) Printed circuit board
JPS56169397A (en) Printed circuit board
JPS575387A (en) Printed circuit board
JPS5752193A (en) Printed circuit board

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee