FR2972597B1 - METHOD FOR MANUFACTURING THE WIRING AREAS OF A PRINTED BOARD - Google Patents

METHOD FOR MANUFACTURING THE WIRING AREAS OF A PRINTED BOARD

Info

Publication number
FR2972597B1
FR2972597B1 FR1100720A FR1100720A FR2972597B1 FR 2972597 B1 FR2972597 B1 FR 2972597B1 FR 1100720 A FR1100720 A FR 1100720A FR 1100720 A FR1100720 A FR 1100720A FR 2972597 B1 FR2972597 B1 FR 2972597B1
Authority
FR
France
Prior art keywords
manufacturing
printed board
wiring areas
wiring
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1100720A
Other languages
French (fr)
Other versions
FR2972597A1 (en
Inventor
Diouron Joel Le
Pierre Belec
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR1100720A priority Critical patent/FR2972597B1/en
Publication of FR2972597A1 publication Critical patent/FR2972597A1/en
Application granted granted Critical
Publication of FR2972597B1 publication Critical patent/FR2972597B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
FR1100720A 2011-03-10 2011-03-10 METHOD FOR MANUFACTURING THE WIRING AREAS OF A PRINTED BOARD Active FR2972597B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1100720A FR2972597B1 (en) 2011-03-10 2011-03-10 METHOD FOR MANUFACTURING THE WIRING AREAS OF A PRINTED BOARD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1100720A FR2972597B1 (en) 2011-03-10 2011-03-10 METHOD FOR MANUFACTURING THE WIRING AREAS OF A PRINTED BOARD

Publications (2)

Publication Number Publication Date
FR2972597A1 FR2972597A1 (en) 2012-09-14
FR2972597B1 true FR2972597B1 (en) 2014-08-01

Family

ID=44246430

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1100720A Active FR2972597B1 (en) 2011-03-10 2011-03-10 METHOD FOR MANUFACTURING THE WIRING AREAS OF A PRINTED BOARD

Country Status (1)

Country Link
FR (1) FR2972597B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2087157B (en) * 1980-11-05 1984-06-06 Quassia Electronics Ltd Solder plating printed circuit boards
US4978423A (en) * 1988-09-26 1990-12-18 At&T Bell Laboratories Selective solder formation on printed circuit boards
GB2300524A (en) * 1995-05-05 1996-11-06 Compeq Manufacturing Co Limite Process for making a printed circuit board partially coated with solder
JP2004066017A (en) * 2002-08-01 2004-03-04 Nippon Paint Co Ltd Method of forming of solder resist film

Also Published As

Publication number Publication date
FR2972597A1 (en) 2012-09-14

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