JPH0369290U - - Google Patents
Info
- Publication number
- JPH0369290U JPH0369290U JP13225389U JP13225389U JPH0369290U JP H0369290 U JPH0369290 U JP H0369290U JP 13225389 U JP13225389 U JP 13225389U JP 13225389 U JP13225389 U JP 13225389U JP H0369290 U JPH0369290 U JP H0369290U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- substrate
- metal
- vent hole
- gas vent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図はこの考案の一実施例を示す平面図、第
２図はそのＡ−Ａ線上の断面図、第３図はこの考
案の要部を説明するための拡大断面図、第４図は
セラミツク基板を金属基板に半田付けする方法を
説明するための側面図、第５図は従来の技術を説
明するための断面図である。
１，１Ａ，１Ｂ……セラミツク基板、２……金
属基板、２Ｂ……ガス抜用孔、３……アース用導
電層、５……半田層、５Ａ……空孔。
Fig. 1 is a plan view showing an embodiment of this invention, Fig. 2 is a sectional view taken along the line A-A, Fig. 3 is an enlarged sectional view for explaining the main parts of this invention, and Fig. 4 is a plan view showing an embodiment of this invention. FIG. 5 is a side view illustrating a method of soldering a ceramic substrate to a metal substrate, and FIG. 5 is a sectional view illustrating a conventional technique. 1, 1A, 1B... Ceramic substrate, 2... Metal substrate, 2B... Gas vent hole, 3... Conductive layer for grounding, 5... Solder layer, 5A... Hole.
Claims (1)
にアース導体が形成されたセラミツク基板と、 Ｂ 上記セラミツク基板が実装されるべき面にガ
ス抜用孔が複数形成された金属基板と、 Ｃ この金属基板と上記セラミツク基板との間に
介挿され両者を接合する半田層と、 から成るセラミツク基板取付構造。[Scope of Claim for Utility Model Registration] A: A ceramic substrate on which a circuit is formed on one side and a ground conductor formed on the entire other side, and B: A gas vent hole is provided on the surface on which the ceramic substrate is to be mounted. A ceramic substrate mounting structure comprising: a plurality of metal substrates; and a solder layer inserted between the metal substrate and the ceramic substrate to bond them together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13225389U JPH075663Y2 (en) | 1989-11-13 | 1989-11-13 | Ceramic board mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13225389U JPH075663Y2 (en) | 1989-11-13 | 1989-11-13 | Ceramic board mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0369290U true JPH0369290U (en) | 1991-07-09 |
| JPH075663Y2 JPH075663Y2 (en) | 1995-02-08 |
Family
ID=31679720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13225389U Expired - Lifetime JPH075663Y2 (en) | 1989-11-13 | 1989-11-13 | Ceramic board mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075663Y2 (en) |
-
1989
- 1989-11-13 JP JP13225389U patent/JPH075663Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH075663Y2 (en) | 1995-02-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |