JPS6240896U

JPS6240896U -

Info

Publication number: JPS6240896U
Application number: JP13109685U
Authority: JP
Priority date: 1985-08-27
Filing date: 1985-08-27
Publication date: 1987-03-11

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図であり
、第８図のＡ―Ｂ線位置で切断した状態を表わし
ている。第２図は第１図中のＸ部分の拡大図、第
３図及び第４図は同実施例のプリント基板を示す
それぞれ半田面側及び部品面側である。第５図は
同実施例におけるシールドケースと裏蓋を示す斜
視図、第６図はプリント基板にシールドケースと
裏蓋を取りつけた状態を示す側面図、第７図及び
第８図は電子部品を実装した状態を示すそれぞれ
半田面側及び部品面側の平面図である。第９図は
従来の電子部品実装装置の一例を示す側面図、第
１０図は従来の電子部品実装装置の他の例を示す
断面図である。１０ａ，１０ｂ……電子部品、２０……両面プ
リント基板、２２…シールドケース、２４……裏
蓋、２６……グランドパターン、２８……スルー
ホール、３０……半田。 FIG. 1 is a sectional view showing an embodiment of the present invention, taken along the line AB in FIG. 8. FIG. 2 is an enlarged view of the X portion in FIG. 1, and FIGS. 3 and 4 are views of the solder side and component side of the printed circuit board of the same embodiment, respectively. Figure 5 is a perspective view showing the shield case and back cover in the same embodiment, Figure 6 is a side view showing the shield case and back cover attached to the printed circuit board, and Figures 7 and 8 are electronic components. FIG. 3 is a plan view of the solder side and the component side, respectively, showing the mounted state. FIG. 9 is a side view showing an example of a conventional electronic component mounting apparatus, and FIG. 10 is a sectional view showing another example of the conventional electronic component mounting apparatus. 10a, 10b...Electronic components, 20...Double-sided printed circuit board, 22...Shield case, 24...Back cover, 26...Ground pattern, 28...Through hole, 30...Solder.

Claims

[Scope of claim for utility model registration] Electronic components are attached to a double-sided printed circuit board,
A shield case and a back cover are provided to cover the electronic components, and most of the parts where the edge of the shield case and the edge of the back cover come into contact around the component mounting areas on both sides of the double-sided printed circuit board are covered with a shield case and a back cover. A ground pattern is formed, and through holes are formed side by side on a tangent between the ground pattern and the edge of the shield case or the edge of the back cover, and the contact portion between the ground pattern and the edge of the shield case and the edge of the back cover are formed. An electronic component mounting apparatus characterized in that a contact portion between the ground pattern and the edge of the back cover, and all of the through holes are soldered.