JPS61102080U - - Google Patents
Info
- Publication number
- JPS61102080U JPS61102080U JP18739884U JP18739884U JPS61102080U JP S61102080 U JPS61102080 U JP S61102080U JP 18739884 U JP18739884 U JP 18739884U JP 18739884 U JP18739884 U JP 18739884U JP S61102080 U JPS61102080 U JP S61102080U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- printed circuit
- copper foil
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す外観斜視図、第
２図は第１図のＡ―Ａ断面図、第３図はプリント
基板の電子回路部品搭載面を示す斜視図で、第４
図は第３図の裏面を示す斜視図、第５図ａは従来
装置のケースの一部を開放した外観斜視図、第５
図ｂは第５図ａのＡ―Ａ断面図である。
１１…ケース、１２…電子回路部品、１３…プ
リント基板、１４…銅箔、１５…ランド、１６…
銅箔、１７…ケース、プリント基板間隙半田付部
。
Fig. 1 is an external perspective view showing an embodiment of the present invention, Fig. 2 is a sectional view taken along line AA in Fig. 1, Fig. 3 is a perspective view showing the electronic circuit component mounting surface of the printed circuit board, and Fig.
The figure is a perspective view showing the back side of Fig. 3, Fig. 5a is an external perspective view of the conventional device with part of the case opened,
Figure b is a sectional view taken along line AA in Figure 5a. DESCRIPTION OF SYMBOLS 11... Case, 12... Electronic circuit component, 13... Printed circuit board, 14... Copper foil, 15... Land, 16...
Copper foil, 17... Case, printed circuit board gap soldering part.
Claims (1)
銅箔を施すと共に、裏面の周囲には所定幅の枠状
銅箔を施して成るプリント基板を電子回路モジユ
ールの底板とし、この底板の枠状銅箔部分とこれ
に冠着した上部ケースとを半田付けしてこれら両
者間を封着することを特徴とする気密性を要する
電子回路モジユール構造。 The bottom plate of the electronic circuit module is a printed circuit board, which is made of a printed circuit board with copper foil applied to the entire surface of the electronic circuit component mounting surface except for the areas around the lands, and a frame-shaped copper foil of a predetermined width applied to the periphery of the back side. An electronic circuit module structure requiring airtightness, characterized by soldering a foil part and an upper case attached to the foil part to seal the two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18739884U JPS61102080U (en) | 1984-12-12 | 1984-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18739884U JPS61102080U (en) | 1984-12-12 | 1984-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61102080U true JPS61102080U (en) | 1986-06-28 |
Family
ID=30744862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18739884U Pending JPS61102080U (en) | 1984-12-12 | 1984-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61102080U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02119788U (en) * | 1989-03-15 | 1990-09-27 | ||
| JP2017535466A (en) * | 2014-09-03 | 2017-11-30 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ | Control device for automobile and method for manufacturing the control device |
-
1984
- 1984-12-12 JP JP18739884U patent/JPS61102080U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02119788U (en) * | 1989-03-15 | 1990-09-27 | ||
| JP2017535466A (en) * | 2014-09-03 | 2017-11-30 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ | Control device for automobile and method for manufacturing the control device |
| US10188005B2 (en) | 2014-09-03 | 2019-01-22 | Conti Temic Microelectronic Gmbh | Control unit device for a motor vehicle and method for manufacturing such a device |
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