JPS614457U - Board structure - Google Patents

Board structure

Info

Publication number
JPS614457U
JPS614457U JP8860284U JP8860284U JPS614457U JP S614457 U JPS614457 U JP S614457U JP 8860284 U JP8860284 U JP 8860284U JP 8860284 U JP8860284 U JP 8860284U JP S614457 U JPS614457 U JP S614457U
Authority
JP
Japan
Prior art keywords
board structure
abstract
copper foil
points
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8860284U
Other languages
Japanese (ja)
Inventor
清 橋本
Original Assignee
日本ビクター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ビクター株式会社 filed Critical 日本ビクター株式会社
Priority to JP8860284U priority Critical patent/JPS614457U/en
Publication of JPS614457U publication Critical patent/JPS614457U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案になる基板構造の第１一実施例の斜視図
、第２図は第１図に示す基板構造に部品を取付けた状態
を示す縦断面図、第３図はソリのある基板構造に部品を
取付けた状態を説明するための側面薗、第４図は本考案
になる基板構造の第２実施例の平面図、第５図は第４図
中■−■線に沿う断面図である。 １，１０・・・・・・基板構造、２，１１・・・・・・
ベース、３・・・・・・絶縁層、−４，７，１５・・・
・・・銅箔パターン、５，１２・・・・・・機構部品、
６，１３・・・・・・取付部分、訃・・・・・レジスト
膜、９，１７・・・・・・取付ネジ、１６・・・・・・
取付穴。Fig. 1 is a perspective view of an eleventh embodiment of the board structure according to the present invention, Fig. 2 is a vertical cross-sectional view showing a state in which parts are attached to the board structure shown in Fig. Figure 4 is a plan view of the second embodiment of the board structure according to the present invention, and Figure 5 is a cross section taken along the line ■-■ in Figure 4. It is a diagram. 1, 10... Substrate structure, 2, 11...
Base, 3... Insulating layer, -4, 7, 15...
...Copper foil pattern, 5,12... Mechanical parts,
6,13...Mounting part, end...Resist film, 9,17...Mounting screw, 16...
Mounting holes.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ３点で部品を取付けられる取付位置に銅箔パターンで部
品取付スペーサを形成してなる基板構造。A board structure in which component mounting spacers are formed using copper foil patterns at mounting positions where components can be mounted at three points.
JP8860284U 1984-06-14 1984-06-14 Board structure Pending JPS614457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8860284U JPS614457U (en) 1984-06-14 1984-06-14 Board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8860284U JPS614457U (en) 1984-06-14 1984-06-14 Board structure

Publications (1)

Publication Number Publication Date
JPS614457U true JPS614457U (en) 1986-01-11

Family

ID=30641896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8860284U Pending JPS614457U (en) 1984-06-14 1984-06-14 Board structure

Country Status (1)

Country Link
JP (1) JPS614457U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61169159A (en) * 1985-01-23 1986-07-30 Matsushita Electric Ind Co Ltd Soldering device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61169159A (en) * 1985-01-23 1986-07-30 Matsushita Electric Ind Co Ltd Soldering device

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