JPS5870617U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS5870617U JPS5870617U JP16581781U JP16581781U JPS5870617U JP S5870617 U JPS5870617 U JP S5870617U JP 16581781 U JP16581781 U JP 16581781U JP 16581781 U JP16581781 U JP 16581781U JP S5870617 U JPS5870617 U JP S5870617U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- copper foil
- conductive pattern
- printed board
- fixed contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Contacts (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の実施例の要部を示す平面図、第2図は
第1図の■−■線に沿った断面を一部省略して示した拡
大断面図である。
1・・・絶縁基板、2・・・銅箔回路、3,3′・・・
キースイッチ用固定接点パターン、4・・・配線用導電
パターン、50・スルーホール導体。FIG. 1 is a plan view showing a main part of an embodiment of the present invention, and FIG. 2 is an enlarged sectional view showing a cross section taken along the line ■-■ in FIG. 1 with a portion omitted. 1... Insulating substrate, 2... Copper foil circuit, 3, 3'...
Fixed contact pattern for key switch, 4... Conductive pattern for wiring, 50. Through-hole conductor.
Claims (1)
ーンと銅箔回路とを絶縁基板上に設けてなるプリント基
板において、前記銅箔回路は前記絶縁基板の一方の面に
のみ形成され、前記キースイッチ用固定接点のパターン
及び導電パターンは前記絶縁基板の他方の面にカーボン
塗料により形成され、前記銅箔回路の所定の部分と前記
導電パターンの所定部分とが前記絶縁基板を貫通させた
スルーホール導体により相互に接続されていることを特
徴とするプリント基板。In a printed circuit board comprising a fixed contact pattern for a key switch, a conductive pattern for wiring, and a copper foil circuit on an insulating substrate, the copper foil circuit is formed only on one surface of the insulating substrate, and the key switch A fixed contact pattern and a conductive pattern are formed on the other surface of the insulating substrate using carbon paint, and a predetermined portion of the copper foil circuit and a predetermined portion of the conductive pattern form a through-hole conductor that penetrates the insulating substrate. A printed circuit board characterized by being interconnected by.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16581781U JPS5870617U (en) | 1981-11-09 | 1981-11-09 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16581781U JPS5870617U (en) | 1981-11-09 | 1981-11-09 | Printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5870617U true JPS5870617U (en) | 1983-05-13 |
JPH021779Y2 JPH021779Y2 (en) | 1990-01-17 |
Family
ID=29958004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16581781U Granted JPS5870617U (en) | 1981-11-09 | 1981-11-09 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5870617U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50139358A (en) * | 1974-04-26 | 1975-11-07 | ||
JPS5557222U (en) * | 1978-10-13 | 1980-04-18 |
-
1981
- 1981-11-09 JP JP16581781U patent/JPS5870617U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50139358A (en) * | 1974-04-26 | 1975-11-07 | ||
JPS5557222U (en) * | 1978-10-13 | 1980-04-18 |
Also Published As
Publication number | Publication date |
---|---|
JPH021779Y2 (en) | 1990-01-17 |
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