JPS61188377U - - Google Patents
Info
- Publication number
- JPS61188377U JPS61188377U JP7050985U JP7050985U JPS61188377U JP S61188377 U JPS61188377 U JP S61188377U JP 7050985 U JP7050985 U JP 7050985U JP 7050985 U JP7050985 U JP 7050985U JP S61188377 U JPS61188377 U JP S61188377U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- metal foil
- foil land
- power supply
- signal line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例のプリント基板パタ
ーン構造を示す平面図、第２図Ａ及びＢは第１図
の構造とＩＣのリードとのハンダ付け部分の拡大
平面図及び拡大長手方向断面図、第３図は従来の
プリント基板パターン構造を示す平面図、第４図
Ａ及びＢは第３図の構造とＩＣのリードとのハン
ダ付け部分の拡大平面図及び拡大長手方向断面図
である。
１……プリント基板、２……信号用パターン、
３……電源用パターン、４……銅箔ランド、５…
…ＩＣ、６……リード、７……ハンダ、１４……
銅箔ランド、１５……穴部。
FIG. 1 is a plan view showing a printed circuit board pattern structure according to an embodiment of the present invention, and FIGS. 2A and 2B are an enlarged plan view and an enlarged longitudinal cross-section of the soldered portion between the structure shown in FIG. 1 and an IC lead. 3 is a plan view showing a conventional printed circuit board pattern structure, and FIGS. 4A and 4B are an enlarged plan view and an enlarged longitudinal sectional view of the soldered part between the structure of FIG. 3 and an IC lead. . 1... Printed circuit board, 2... Signal pattern,
3...Power supply pattern, 4...Copper foil land, 5...
...IC, 6...Lead, 7...Solder, 14...
Copper foil land, 15... hole.
Claims (1)
ターン２と該信号線用パターン２より幅広で、先
端に金属箔ランド１４が設けられた電源用パター
ン３を有する面実装用のプリント基板パターン構
造において、 前記電源用パターン３の金属箔ランド１４の面
積を前記信号線用パターン２の面積より大きくす
るとともに、前記電源用パターン３の金属箔ラン
ド１４の一部に穴部１５を設けたことを特徴とす
る面実装用のプリント基板パターン構造。[Claims for Utility Model Registration] Comprising a signal line pattern 2 having a metal foil land 4 at its tip and a power supply pattern 3 which is wider than the signal line pattern 2 and having a metal foil land 14 at its tip. In the printed circuit board pattern structure for surface mounting, the area of the metal foil land 14 of the power supply pattern 3 is made larger than the area of the signal line pattern 2, and a part of the metal foil land 14 of the power supply pattern 3 is A printed circuit board pattern structure for surface mounting characterized by providing a hole portion 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7050985U JPS61188377U (en) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7050985U JPS61188377U (en) | 1985-05-15 | 1985-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61188377U true JPS61188377U (en) | 1986-11-25 |
Family
ID=30607145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7050985U Pending JPS61188377U (en) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61188377U (en) |
-
1985
- 1985-05-15 JP JP7050985U patent/JPS61188377U/ja active Pending