JPS6175158U - - Google Patents
Info
- Publication number
- JPS6175158U JPS6175158U JP15937784U JP15937784U JPS6175158U JP S6175158 U JPS6175158 U JP S6175158U JP 15937784 U JP15937784 U JP 15937784U JP 15937784 U JP15937784 U JP 15937784U JP S6175158 U JPS6175158 U JP S6175158U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- soldering
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の１実施例を示す斜視図、第２
図は従来例を示す斜視図である。
１……電子部品のシールドケース、５，６……
アースパターン、７……孔、８……絶縁面、９…
…端子、１０……プリント基板。
Figure 1 is a perspective view showing one embodiment of the present invention, Figure 2 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing a conventional example. 1... Shield case for electronic components, 5, 6...
Earth pattern, 7...hole, 8...insulating surface, 9...
...terminal, 10...printed circuit board.
Claims (1)
に接続された端子が該シールドケースから突出す
る電子部品と、 前記端子の挿通する孔を有し、一方の面には該
孔の周面に絶縁面が形成されると共に該絶縁面に
隣接してアースパターンが形成され、他方の面の
前記孔の周面に前記端子の半田付用のパターンが
形成されてなるプリント基板とからなり、 前記電子部品の端子を前記プリント基板の孔を
介在して前記一方の面から他方の面に挿通して前
記端子を前記半田付用パターンに半田付し、前記
シールドケースを前記アースパターンに半田付す
ることにより前記電子部品を前記プリント基板に
取付けたことを特徴とする電子部品の取付装置。[Claims for Utility Model Registration] A terminal whose outer shell is formed by a shield case and which is connected to an internal circuit has an electronic component protruding from the shield case, and a hole through which the terminal is inserted, and one side has the hole. An insulating surface is formed on the circumferential surface of the printed circuit board, a ground pattern is formed adjacent to the insulating surface, and a pattern for soldering the terminal is formed on the circumferential surface of the hole on the other surface. The terminals of the electronic component are inserted through the holes of the printed circuit board from the one surface to the other surface, the terminals are soldered to the soldering pattern, and the shield case is connected to the ground pattern. 1. An electronic component mounting device, characterized in that the electronic component is mounted on the printed circuit board by soldering the electronic component to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15937784U JPS6175158U (en) | 1984-10-22 | 1984-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15937784U JPS6175158U (en) | 1984-10-22 | 1984-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6175158U true JPS6175158U (en) | 1986-05-21 |
Family
ID=30717333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15937784U Pending JPS6175158U (en) | 1984-10-22 | 1984-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6175158U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087289A (en) * | 2008-09-30 | 2010-04-15 | Nippon Chemicon Corp | Electrolytic capacitor module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54119673A (en) * | 1978-03-09 | 1979-09-17 | Canon Kk | Electronic appliance |
-
1984
- 1984-10-22 JP JP15937784U patent/JPS6175158U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54119673A (en) * | 1978-03-09 | 1979-09-17 | Canon Kk | Electronic appliance |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087289A (en) * | 2008-09-30 | 2010-04-15 | Nippon Chemicon Corp | Electrolytic capacitor module |
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