JPS61121745U - - Google Patents
Info
- Publication number
- JPS61121745U JPS61121745U JP390585U JP390585U JPS61121745U JP S61121745 U JPS61121745 U JP S61121745U JP 390585 U JP390585 U JP 390585U JP 390585 U JP390585 U JP 390585U JP S61121745 U JPS61121745 U JP S61121745U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- integrated circuit
- covered
- hybrid integrated
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000009977 dual effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図で、ａはシ
ングルインラインタイプ、ｂはデユアルインライ
ンタイプである。第２図は従来の混成集積回路装
置の断面図でａはシングルインラインタイプ、ｂ
はデユアルインラインタイプである。
１……厚膜回路基板、２……電子部品、３……
はんだ、４……外部リード、５……電子部品搭載
側端子部、６……電子部品非搭載側端子部、７…
…シリコン樹脂、８……電極パターン、９……フ
エノール樹脂又はエポキシ樹脂。
FIG. 1 is a sectional view of an embodiment of the present invention, in which a is a single in-line type and b is a dual in-line type. Figure 2 is a cross-sectional view of a conventional hybrid integrated circuit device, where a is a single in-line type and b is a single in-line type.
is a dual inline type. 1... Thick film circuit board, 2... Electronic components, 3...
Solder, 4...External lead, 5...Electronic component mounting side terminal part, 6...Electronic component non-mounting side terminal part, 7...
... Silicone resin, 8 ... Electrode pattern, 9 ... Phenol resin or epoxy resin.
Claims (1)
、電子部品を搭載した外部リードを有する混成集
積回路において、電子部品搭載面をシリコン樹脂
で外装し、電子部品非搭載面の外部リード端子部
をフエノール樹脂又はエポキシ樹脂で塗布したこ
とを特徴とする混成集積回路装置。 In a hybrid integrated circuit in which a thick film pattern is formed on one side of a ceramic substrate and has external leads on which electronic components are mounted, the surface on which electronic components are mounted is covered with silicone resin, and the external lead terminals on the surface where electronic components are not mounted are covered with phenol resin. or a hybrid integrated circuit device characterized in that it is coated with epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP390585U JPS61121745U (en) | 1985-01-16 | 1985-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP390585U JPS61121745U (en) | 1985-01-16 | 1985-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61121745U true JPS61121745U (en) | 1986-07-31 |
Family
ID=30478971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP390585U Pending JPS61121745U (en) | 1985-01-16 | 1985-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121745U (en) |
-
1985
- 1985-01-16 JP JP390585U patent/JPS61121745U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61121745U (en) | ||
| JPS6398678U (en) | ||
| JPS58158443U (en) | hybrid integrated circuit board | |
| JPS62170646U (en) | ||
| JPH01137571U (en) | ||
| JPS63152272U (en) | ||
| JPS63191673U (en) | ||
| JPH02106867U (en) | ||
| JPS61146977U (en) | ||
| JPS6387839U (en) | ||
| JPH0262769U (en) | ||
| JPH0270411U (en) | ||
| JPS61207077U (en) | ||
| JPS58131654U (en) | Thick film electrode structure | |
| JPS6188248U (en) | ||
| JPS6226050U (en) | ||
| JPH03106758U (en) | ||
| JPS64301U (en) | ||
| JPH01165699U (en) | ||
| JPS6151774U (en) | ||
| JPS6273549U (en) | ||
| JPS63149570U (en) | ||
| JPS63108675U (en) | ||
| JPS63136378U (en) | ||
| JPS63100872U (en) |