JPS6413137U - - Google Patents
Info
- Publication number
- JPS6413137U JPS6413137U JP9641487U JP9641487U JPS6413137U JP S6413137 U JPS6413137 U JP S6413137U JP 9641487 U JP9641487 U JP 9641487U JP 9641487 U JP9641487 U JP 9641487U JP S6413137 U JPS6413137 U JP S6413137U
- Authority
- JP
- Japan
- Prior art keywords
- carrier body
- conductive pattern
- electrical component
- thick film
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案実施の１例の斜視図、第２図は
その底面図、第３図は第１図の−線截断面図
、第４図は本考案の他の実施例の底面図、第５図
は第４図の−線截断面図、第６図は本考案の
変形例の底面図、第７図は本考案の他の変形例の
底面図、第８図は従来例の下方よりの斜視図、第
９図は第８図の−線截断面図である。
１……キヤリア本体、６……外部接続端子、７
……厚膜電気部品、８……接続用導電パターン、
９……被膜。
Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a bottom view thereof, Fig. 3 is a sectional view taken along the line - - of Fig. 1, and Fig. 4 is a bottom view of another embodiment of the present invention. , FIG. 5 is a cross-sectional view taken along the line -- in FIG. 4, FIG. 6 is a bottom view of a modified example of the present invention, FIG. 7 is a bottom view of another modified example of the present invention, and FIG. 8 is a bottom view of a conventional example. A perspective view from below, and FIG. 9 is a sectional view taken along the line -- in FIG. 8. 1...Carrier body, 6...External connection terminal, 7
... Thick film electrical component, 8 ... Conductive pattern for connection,
9...Coating.
Claims (1)
を備えると共に、該キヤリア本体の下面に厚膜電
気部品を備え、該厚膜電気部品を接続用導電パタ
ーンを介して外部接続端子に接続して成るリード
レスチツプキヤリアにおいて、キヤリア本体の下
面に少なくとも該接続用導電パターンを被覆する
絶縁性材料から成る被膜を形成したことを特徴と
するリードレスチツプキヤリア。 A plurality of external connection terminals are provided on the outer surface of the carrier body, a thick film electrical component is provided on the lower surface of the carrier body, and the thick film electrical component is connected to the external connection terminal via a conductive pattern for connection. 1. A leadless chip carrier, characterized in that a film made of an insulating material is formed on the lower surface of the carrier body to cover at least the connection conductive pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9641487U JPS6413137U (en) | 1987-06-23 | 1987-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9641487U JPS6413137U (en) | 1987-06-23 | 1987-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413137U true JPS6413137U (en) | 1989-01-24 |
Family
ID=31321315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9641487U Pending JPS6413137U (en) | 1987-06-23 | 1987-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413137U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59178768A (en) * | 1983-03-30 | 1984-10-11 | Tdk Corp | Composite component parts |
-
1987
- 1987-06-23 JP JP9641487U patent/JPS6413137U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59178768A (en) * | 1983-03-30 | 1984-10-11 | Tdk Corp | Composite component parts |