JPS6310568U - - Google Patents
Info
- Publication number
- JPS6310568U JPS6310568U JP10470686U JP10470686U JPS6310568U JP S6310568 U JPS6310568 U JP S6310568U JP 10470686 U JP10470686 U JP 10470686U JP 10470686 U JP10470686 U JP 10470686U JP S6310568 U JPS6310568 U JP S6310568U
- Authority
- JP
- Japan
- Prior art keywords
- package
- electronic component
- terminal pins
- bending
- electrical wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009429 electrical wiring Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第1図はこの考案によるICの一実施例を示す
側面図、第2図はこの考案のICを基板に実装し
た状態を示す断面図、第3図は従来のICを示す
側面図、第4図は従来のICを基板に実装した状
態を示す断面図である。
図において、1はIC、2はパツケージ、2a
はパツケージ側面、2bはパツケージ下面、3は
電気的配線、4は端子ピンである。尚、図中同一
符号は同一又は相当部分を示す。
FIG. 1 is a side view showing an embodiment of an IC according to this invention, FIG. 2 is a sectional view showing the IC of this invention mounted on a board, FIG. 3 is a side view showing a conventional IC, and FIG. The figure is a sectional view showing a state in which a conventional IC is mounted on a board. In the figure, 1 is an IC, 2 is a package, 2a
is the side surface of the package, 2b is the bottom surface of the package, 3 is electrical wiring, and 4 is a terminal pin. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
ツケージ側面から内部の電気的配線と外部の信号
とを電気的に接続する複数個の端子ピンを突出さ
せてなるIC等の電気部品において、上記端子ピ
ンをパツケージ下面に沿つて内側方向に曲折させ
、さらに、その先端側を垂直方向に曲折させて構
成したことを特徴とするIC等の電子部品。 In an electric component such as an IC whose outer shape is covered with a package made of a non-conducting material and a plurality of terminal pins protruding from the side surface of the package to electrically connect internal electrical wiring and external signals, the terminal pins are 1. An electronic component such as an IC, characterized in that an IC or other electronic component is constructed by bending the package inward along the lower surface of the package, and further bending the tip end thereof in the vertical direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10470686U JPS6310568U (en) | 1986-07-08 | 1986-07-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10470686U JPS6310568U (en) | 1986-07-08 | 1986-07-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6310568U true JPS6310568U (en) | 1988-01-23 |
Family
ID=30978451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10470686U Pending JPS6310568U (en) | 1986-07-08 | 1986-07-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6310568U (en) |
-
1986
- 1986-07-08 JP JP10470686U patent/JPS6310568U/ja active Pending
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