JPS6310568U - - Google Patents

Info

Publication number
JPS6310568U
JPS6310568U JP10470686U JP10470686U JPS6310568U JP S6310568 U JPS6310568 U JP S6310568U JP 10470686 U JP10470686 U JP 10470686U JP 10470686 U JP10470686 U JP 10470686U JP S6310568 U JPS6310568 U JP S6310568U
Authority
JP
Japan
Prior art keywords
package
electronic component
terminal pins
bending
electrical wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10470686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10470686U priority Critical patent/JPS6310568U/ja
Publication of JPS6310568U publication Critical patent/JPS6310568U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案によるICの一実施例を示す
側面図、第2図はこの考案のICを基板に実装し
た状態を示す断面図、第3図は従来のICを示す
側面図、第4図は従来のICを基板に実装した状
態を示す断面図である。 図において、1はIC、2はパツケージ、2a
はパツケージ側面、2bはパツケージ下面、3は
電気的配線、4は端子ピンである。尚、図中同一
符号は同一又は相当部分を示す。
FIG. 1 is a side view showing an embodiment of an IC according to this invention, FIG. 2 is a sectional view showing the IC of this invention mounted on a board, FIG. 3 is a side view showing a conventional IC, and FIG. The figure is a sectional view showing a state in which a conventional IC is mounted on a board. In the figure, 1 is an IC, 2 is a package, 2a
is the side surface of the package, 2b is the bottom surface of the package, 3 is electrical wiring, and 4 is a terminal pin. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外形を非導体材質のパツケージで覆い、このパ
ツケージ側面から内部の電気的配線と外部の信号
とを電気的に接続する複数個の端子ピンを突出さ
せてなるIC等の電気部品において、上記端子ピ
ンをパツケージ下面に沿つて内側方向に曲折させ
、さらに、その先端側を垂直方向に曲折させて構
成したことを特徴とするIC等の電子部品。
In an electric component such as an IC whose outer shape is covered with a package made of a non-conducting material and a plurality of terminal pins protruding from the side surface of the package to electrically connect internal electrical wiring and external signals, the terminal pins are 1. An electronic component such as an IC, characterized in that an IC or other electronic component is constructed by bending the package inward along the lower surface of the package, and further bending the tip end thereof in the vertical direction.
JP10470686U 1986-07-08 1986-07-08 Pending JPS6310568U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10470686U JPS6310568U (en) 1986-07-08 1986-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10470686U JPS6310568U (en) 1986-07-08 1986-07-08

Publications (1)

Publication Number Publication Date
JPS6310568U true JPS6310568U (en) 1988-01-23

Family

ID=30978451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10470686U Pending JPS6310568U (en) 1986-07-08 1986-07-08

Country Status (1)

Country Link
JP (1) JPS6310568U (en)

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