JPS59178768A - Composite component parts - Google Patents

Abstract

PURPOSE:To simplify the structure and thus facilitate the manufacture by a method wherein a composite network is formed in a substrate, a resistor network on one surface of the substrate, and in IC chip on the other surface thereof, respectively, thus being made as the composite component. CONSTITUTION:A dielectric layer resulting from turning dielectric power pasty by kneading with binder and a capacitor electrode layer and a wiring layer resulting from turning conductive powder such as Ag-Pt pasty are alternately laminated and integrally sintered into a laminated dielectric substrate 1. Next, external terminals 5 are formed in the outer periphery thereof by baking metallec paste, etc., and dielectric parts 2, a plurality of capacitors 3 positioned therein, and wirings and lead-out wiring conductors 4 which interconnected them are contained in the substrate 1. Then, a plurality of resistors and wiring conductors 7 are provided on one surface of this substrate 1, and the IC chip 8 and lead- out wires 9 are formed on the other surface. Thereafter, both these surfaces are covered with resin 10 containing high permeable magnetic power, and further upper part thereof is protected with a magnetic shield 11.

Description

[Detailed description of the invention] The present invention relates to the construction of composite parts.

Composite parts are constructed by mounting a large number of electronic elements on a substrate and wiring between the elements, but it is extremely inefficient to attach the electronic elements individually to the substrate. Furthermore, when an integrated circuit (IC) is incorporated, there is a problem in that interference occurs between an external circuit and the integrated circuit due to the influence of its distributed induction.

The purpose of the present invention is to eliminate a major part or all of these defects.

Briefly stated, the composite electronic component of the present invention uses a capacitor network board containing a plurality of capacitors and having a lead-out end at the periphery as a board on which electronic elements are mounted. Next, a resistance network including a plurality of resistance elements necessary for constructing the composite component is formed on one surface of this substrate, and its lead end is drawn out around the substrate body. An integrated circuit chip is mounted on the other side of the substrate, and its lead end is led out to the periphery of the substrate by wire bonding, face bonding, or the like. If necessary, at least the surface of the integrated circuit chip is coated or sprayed with a resin mixed with high permeability magnetic powder to form a magnetic shield layer. The above configuration significantly simplifies the manufacturing process of the composite part. Furthermore, the structure of the composite part itself is extremely simple, which helps stabilize quality.

Referring to the drawings, FIG. 1 shows a laminated dielectric substrate 1 incorporating a capacitor network. The substrate 1 includes a dielectric layer made by kneading dielectric powder with a binder and turning it into a paste;
Capacitor electrode layers and wiring layers made of a paste of conductive metal powder such as Ag or Ag-Pt are laminated alternately and sintered together, and external terminals are attached to the portions of the wiring layers that are exposed at iJ1 around the laminated dielectric. It is formed by baking with the same metal paste or low-temperature baking type conductive paste. The substrate 1 thus obtained includes a dielectric portion 2, a plurality of capacitors 3 formed therein, wiring conductors 4 for interconnecting and drawing out the capacitors 3, and connections to the drawing ends of these conductors 4. It consists of a plurality of external terminals 5.

As shown in FIG. 2, a resistor network is formed on one side of the dielectric substrate 1. As shown in FIG. This resistance network is
It consists of a plurality of resistors 6 and wiring conductors 7, the resistors 6 being printed from resistor powder paste, and the wiring conductors 7 being formed from the same as above or from a low-temperature baking type conductor. The lead wires are connected to external terminals, and the resistor network thus formed is integrated into the substrate 1 by high-temperature or low-temperature baking.

Next, as shown in FIG. 3, an integrated circuit (IC) chip 8 is mounted on the opposite surface of the substrate 1, and a lead wire 9 is connected between the chip 8 and the lead conductor 5 by wire bonding. be done. Note that this connection can also be made by other known methods such as face bonding.

Furthermore, as shown in FIG. 4, a protective layer 10 is formed on the surface of the resistor network by spraying or molding a paste containing highly permeable magnetic powder mixed in resin.
As shown in the figure, a magnetic shield 11 is applied to the integrated circuit chip 8 side at the same time as shaping by molding a similar magnetic paste.

The composite component configured as described above can realize a circuit as shown in FIG. 6, for example.

Since the composite component of the present invention is configured as described above, the circuit configuration can be simplified. In the conventional structure, the integrated circuit chip, resistor, and capacitor were mounted on the same side, making the circuit complicated and difficult to manufacture. However, in the present invention, the capacitor network is inside the board, and the resistor network is only on one side of the board. In addition, since the integrated circuit chip is formed separately or mounted on the other side, the structure is simplified and manufacturing is facilitated.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a substrate of the present invention, and FIG. 2 is a plan view of a substrate with a resistor network mounted on one side.
The figure is a plan view of an integrated circuit chip mounted on the other side of the substrate, FIG. 4 is a perspective view of the resistor network side of the composite component of the present invention, and FIG. 5 is a perspective view of the integrated circuit side of the composite component of the present invention. and FIG. 6 are diagrams showing the circuit side of the composite component of the present application. The main parts in the diagram are as follows. 1: Dielectric substrate 2: NnoF% Body 6: Capacitor 4: Wiring conductor 5; External terminal 6: Resistor 7: Wiring conductor 8: Integrated circuit chip 9: Wire 10: Magnetic shield 11: Magnetic shield

Claims (2)

[Claims] (1) A composite in which an integrated circuit chip is mounted on the surface of a dielectric laminate containing a plurality of capacitor electrodes, its lead conductors are drawn out around the laminate, and a resistor network is configured on the back surface of the laminate. parts. (2) The composite component according to item 1 above, wherein the integrated circuit chip on the surface has a surface layer of resin mixed with high permeability magnetic powder.