JPS5917232A - Composite laminated ceramic part and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite multilayer ceramic component having a capacitor, a resistor, and conductor wiring, a multilayer ceramic component in which a conductor is simultaneously fired and composited, and a manufacturing method thereof.

Passive components such as wires, resistors, capacitors, and inductances, and active components such as transistors and diodes in conventional electric circuits are made by providing a printed wiring layer on a ceramic substrate, soldering it to form a circuit, and using it as a unit. was being carried out. In this case, disk-shaped or chip-shaped capacitors, chip resistors, etc. had to be installed one by one.

In addition, in resistor composite parts, electrodes and resistors are baked on a ceramic or resintered base to span one layer, and when a capacitor is added, a cheese-shaped capacitor is soldered to the provided electrode layer. was obtained. In this case as well, the capacitors had to be attached one by one, and it was difficult to downsize the composite component.

On the other hand, in the case of capacitors and multilayer ceramic substrates with resistors using alumina clean sheets as shown in Figure 1, the capacitors are formed at the same time as the substrate is fired, and then the resistors are fired and formed at +1' +°C. . However, in this case, since f-luminescence) 1 is used as the base wing 1, the firing temperature must be as high as 1500°C or higher, and four materials 2 with low conductivity such as N10°W and Mn are used as conductive materials. In addition, since alumina is used as the dielectric layer 4 of the capacitor forming part 3, the dielectric constant is very low at about 9, and the capacitance is about 3 pF/2 at most. All I could get was a joke. Furthermore, in the process of forming the resistor (the resistor 5 is printed on the J1 sintered body by screen printing, etc. and baked, the number of steps increases, and as the number of resistors increases, the area of the base becomes smaller). However, LC composite parts as shown in Figures 2 to 4 are also being considered.Each figure shows the composite parts. Schematic perspective view (R)
Equivalent 11j path diagram (bl has been removed. In Figures 2 and 3, the electrode section 11 of the multilayer chip capacitor ■3)
A structure in which the resistor 12 is formed on the
I kelp No. 17 and resistance! It is difficult to configure children into one part, and there are many processes involved! : Since thermal cycles are also added, there are problems in terms of cost and reliability. In Fig. 4, a capacitor and a resistor 12 are formed in a laminated structure, and the ceramic sheets of the g-electric body 15 and the insulator 16 are made of the same material, and are made of alumina, steatite, follisterite, barium titanate. , TlO2, etc., the mechanical strength of the ceramic after sintering is low, and although it is sufficient for use as chip parts, it is insufficient for board parts on which various chip parts are mounted and used for mounting etc. Moreover, after firing, the external electrode 11 is baked to form a finished part, which requires many steps, and it is difficult to construct a large number of resistor and capacitor elements. Therefore, there is also a problem in increasing the density.

It is an object of the present invention to eliminate the various problems and drawbacks of the conventional methods, and to construct a plurality of RCs by simultaneous firing at low temperatures in an oxidizing atmosphere, and to use a d' turtle body with a high dielectric constant. We provide compact ^density components that form larger capacitance capacitors or high-density, large-area mounting composite boards with sufficient mechanical strength, and improve workability and reliability by simplifying the process and reducing costs through simultaneous firing. The object of the present invention is to provide a composite laminated ceramic component having a capacitor, a resistor, and a conductor wiring, which can use a high conductivity conductor as a conductor and have improved functionality, and a method for manufacturing the same. , a dielectric, a resistor, and a conductor, each mixed with an organic substance and formed into a sheet or paste form, are integrally molded and fired, and one or more capacitor elements are formed inside. It is a composite laminated ceramic component characterized by comprising one or more resistance elements and a wiring conductor, and includes a step of forming an S dielectric raw sheet, a resistor raw sheet, and an insulator raw sheet, and an insulator raw sheet and Step 7 of drilling a through hole in the current-visiting material raw sheet, filling the through hole with a conductive material, and simultaneously forming a conductor layer on the surface of the resistor material raw sheet.
9 into the desired shape, and the through holes No. 41 are provided on the surface of the insulator green sheet in which the holes are filled with a thick physical substance or on the surface of the insulator green sheet without through holes. A composite laminated ceramic comprising the steps of laminating the raw sheets so that they are in contact with each other, forming a laminated body by thermo-compression bonding the respective raw sheets in layers, and cutting the laminated body into a predetermined size and firing the laminated body. This is a method for manufacturing parts.

Hereinafter, the present invention will be explained in detail using Example 1.0 Example 1 First, the insulating green sheet used in the present invention was made of aluminum oxide 40-60% by weight, crystallized glass 40-60% by weight
A mixed powder selected to have a total fi of 100% within the composition range is made into a paste with a binder, an organic solvent, and a plasticizer,
A raw sheet of 20 μm to 300 μm is formed on a polyester film by slip casting film forming such as a doctor blade method, peeled off, and then punched to a desired size to obtain a sheet. The composition of the crystallized glass powder used here is 7% oxidation and 7% acid ratio according to the oxide exchange boundary notation.
Silicon dioxide, Group I element oxides, and Group IV elements (excluding vertical lines, silicon, and lead) oxidized in weight ratios of 3 to 65%, 2 to 50%, and 4 to 65%, respectively. 01-50 section,
It is composed of a composition selected such that ajtzoo=4 and t in a composition range of 0.02 to 20%.

Dielectric raw sheet is Fetus, pbo, Nb*08, W
A predetermined amount of OI powder was weighed, mixed in a ball mill, filtered and dried, and pre-baked at 700 to 800°C. A sheet of 10 μm to 2001J1+ was obtained by slip casting film formation using a doctor blade method, etc. in the same manner as in the preparation of the insulator green sheet.
) +/z) Os Pb (F e 2/s ・W
+/a) The raw material (was weighed to form an Os binary composite perovskite compound).

In addition, the raw resistor sheet contains the ruthenium dioxide powder and the crystallized glass powder used for producing the raw insulator sheet in a weight ratio of 10:90 to 50, respectively! Mix to obtain the desired resistance value in the range of 50%, add ethyl cellosolve, butylnoclichtol, butyl butylphthalate, and polyhinylbutyral fat to form a slurry, and repeat in the same manner as above.
# A sheet with a thickness of 20 μm to 200 μm was obtained.

! The conductor used for the 8th layer and signal line is Al1% Ag1
Single metals such as PD and PT or alloy powders containing one or more of these metals were kneaded together with an organic vehicle to form a paste.

5 to 14 show a composite laminated ceramic component and a method of manufacturing the same according to one embodiment of the present invention. In each figure, (a'l is a plan view of the green sheet, and (g) is a cross-sectional view.) The formed insulator sheet is punched to desired dimensions and the insulator sheet shown in Figure 5 is used as 20. Ori use. Prepare two raw resistor sheets shown in Figure 6.

As shown in FIG. 7, the dielectric raw sheet 22 is obtained by punching the dielectric raw sheet 22 to a desired size as shown in FIG.

Next, a through hole is formed using a mold 1 noser, a drill, etc. to provide a through hole. The diameter of the through hole formed here could be up to a minimum of 100 μm. Through-holes 23 for conducting the internal electrodes of the capacitor are formed using the same method for the dielectric raw sheet (Fig. 9).
. On the other hand, the resistor raw sheet 21 is punched and cut into designed dimensions as shown in FIG. 10 so as to obtain a desired resistance value, thereby forming a resistor raw sheet piece 24.

Next, as shown in FIG. 11, a conductor layer 25 for signal lines and shield lines is formed on the insulating green sheet provided with through holes by screen printing or the like, and at the same time, conductors are embedded in the through holes. As a conductor, Au, Ag, Pc
A paste consisting of a single metal such as T or PT or an alloy containing one or more of these metals was used.

We also fabricated a raw insulator sheet with a conductor formed in the through-hole area and its vicinity.

As shown in FIG. 12, on the dielectric green sheet 22 with the through-holes 23 formed, a conductor for the internal electrodes for condensation → J- is printed by screen printing or the like, and at the same time, in order to provide continuity between the upper and lower electrodes at the through-hole portions. Embed in. On the other hand, as shown in FIG. 13, resistor sheet pieces U punched and cut into predetermined dimensions are laminated onto a raw insulator sheet by adhesive or hot press to obtain an integrated sheet.

Next, as shown in FIG. 14, the insulator sheets and through poles in FIG. 5 are used to adjust the thickness of the sheets and laminates in FIGS. A raw insulator sheet with a conductor formed in the area and its vicinity is heated at a temperature of 100 to 130°C and a pressure of 200 to 300 K.
97- was laminated and pressed. In Fig. 14, the conductor layers 26 on the upper and lower sides of the FFJ electric raw material sheets 22 stacked in large numbers become capacitor forming portions 32 (indicated by broken lines in the figure) after sintering, and are connected to external terminals via through holes and conductor layers. The conductor Jfia 33 is connected.

By forming the 81 layers of the raw UO tube-based resistor sheet 24 and firing it, the resistance portion 31 (portion not shown by the broken line in the figure) can be formed.
They are led to the outside world by their physical performance, etc. The laminate thus laminated and thermocompressed was made into a desired size and fired according to the temperature profile shown in Figure 7ALS. The firing profile consists of three steps: a binder removal step, a preliminary firing step, and a main firing step. Binder removal is held at a maximum temperature of 400°C for 3 hours, and pre-calcination is performed at 8
A continuous furnace was used at each temperature of 900''C for 0Q'Ct wood 1,11ε.

The present invention makes it possible to temporarily form resistors, U electric bodies, insulators, and conductors at a temperature as low as 900 degrees Celsius compared to conventional methods, and simultaneously fire the resistors, conductors, signal lines, shield layers, etc. We were able to fabricate 11☆ ceramic parts for the Fire Detective, including the following.

Example 2 The manufacturing process of the composite 8L layer ceramic component of this example is mostly the same as the process described in Example 1, or when the raw sheets used in Example 1 are laminated, both sides of the laminate and the near body are It is possible to obtain a laminated composite laminated component having the structure shown in FIG. 16, in which a conductor layer for external terminals is provided. In this case, by effectively utilizing the upper and lower surfaces of the laminated component, it is possible to run, which has the advantage of producing a higher-density and finer composite laminated ceramic component.

The capacitance of the capacitor, resistor, and capacitor formed in the composite laminated ceramic component with conductor obtained according to the embodiment of the present invention is about 1 n I;'/wn', and as an example, a maximum of 10 μF capacitor→J is formed. did.

As a high BM 1-body material, P b (F e '1/2
・Nb II2 ) Os-Pb (Fe 2/3 ・V
i l/s ) Q. In addition to the binary composite perovskite compound, any material that can be sintered at about 850°C to 950°C can be used.

As described above, the composite laminated ceramic component having the laminated structure of the capacitor, resistor, and conductor wiring of the present invention is produced by simultaneously firing at a low temperature of about 900°C in an oxidizing ambient atmosphere, and then forming a plurality of ceramics.
It is also possible to construct small, high-density components with large capacitors formed, or composite boards with sufficient mechanical strength for high-density, large-area mounting, simplifying the process,
There are advantages such as lower cost, improved workability and reliability, and the ability to use conductors with high electrical conductivity.

The composite MP component of the present invention is also suitable for use in televisions. -S+, FM
It can be used in all kinds of electronic circuits such as various circuits for Qi-Chi automobiles.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a conventional part; Figure 2 is a cross-sectional view of the conventional part;
Figures ~ Figure 13 (Example 1 of Oki Invention (-Yoruyur) A diagram showing each manufacturing process of rich layered ceramic parts. Figure 1-1C: [Schematic diagram of completed parts of Example 1 Inner FiK
If Noah Figure 1lii, Figure 15 is Mizusawa, Ming 711
- firing profile of the product, Fig. 16 is a schematic internal view of the completed part of Example 2] J... Alumina sheet, 2...
! , Q, Body 1.3...Condenser forming part,
4...I"i[i, 4 I?j, Ri...Resistor, II...External electrode, J
2...Resistance, 1:3...Laminated container'
Nsa, 14... Conoran "Sukawa Internal Electrode, 1"
5...Discussion↑E body, 1G...Insulator,
20...Insulator raw sheet, 2 tons...1)
(Antibody raw sheet, 22...M electric fon raw sheet,
23... Through pole 24... Resistor raw sheet piece, 25.26... Conductor layer, 31...
...Resistance forming part, 32... Capacitor forming part, 3; 3... Conductor layer for external terminal.

Claims (1)

[Scope of Claims] (1) Laminated sintered material in which insulators, dielectrics, resistors, and conductors are mixed with electrical equipment and formed into a sheet or paste, which is then integrally molded and fired. (2) A dielectric layer and a resistor layer, which are characterized by having one or more capacitor elements, one or more resistor elements, and a wiring conductor inside. 1 each
The capacitor electrodes are formed on both sides of the dielectric layer, and the electrodes are filled with through holes formed in the dielectric layer and the insulator layer, and are connected to the conductor formed therein. The resistor layer is connected to the external terminal conductor layer formed on the surface of the laminated sintered body through the body layer, and an electrode is also connected to the resistor layer, and the electrode is connected in the same manner as in the laminated sintered body layer. A composite ceramic part according to claim 1, characterized in that: (3) Steps of forming electric raw sheets, resistor raw sheets, and insulator raw sheets, and forming through-holes in the insulator raw sheets and dielectric raw sheets and filling the through-holes with a conductive material. At the same time, a step of forming a conductive layer on the surface and cutting the raw resistor sheet into a desired shape and providing the surface of the raw insulator sheet with the through holes and the holes filled with a conductive material or through holes are performed. The method includes the steps of laminating one insulator green sheet so as to be in contact with the surface of the green insulator sheet, forming a laminate by laminating and thermocompressing each green sheet, and cutting the laminate into a predetermined size and firing it. A method of manufacturing composite laminated lamic parts using % as enemy.