JPS6089995A - Composite laminated ceramic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Description of the field to which the invention pertains The present invention relates to a capacitor, a composite ceramic component having a resistor and a conductor wiring, a bamboo lightning dielectric, a metal oxide resistor, an insulator, and a conductor simultaneously fired. This invention relates to composite laminated ceramic parts.

(2) Description of conventional technology Conventionally, in electronic circuits, passive components such as resistors, capacitors, and inductances, and active components such as transistors and diodes are provided with a printed wiring layer on a ceramic substrate.
Circuits were made by soldering and used as a unit. In this case, disk-shaped or chip-shaped capacitors, chip resistors, etc. had to be installed one by one.

On the other hand, in a multilayer ceramic substrate with capacitors and resistors using alumina green sheets as shown in Fig. 1, the capacitor portion is formed at the same time as the substrate material is fired.
After that, the resistor is formed by baking. However, in this case, since the alumina sheet 1 is used as the sill body material, the firing temperature must be as high as 1500'C or higher, and the conductor layer 2 with low electrical conductivity, such as Mo, W, Mn, etc., is used as the conductor material. It had to be carried out in a reducing atmosphere. Also, since alumina is used as the dielectric material of the capacitor forming part 3, the dielectric constant is 6:=q
It was possible to obtain a capacitance of only about 3PF/mm2 at most. Furthermore, in the process of forming the resistor part, the resistor element 4 is printed on the sintered base by screen printing or the like and baked to form it, which increases the number of manufacturing steps and increases the number of resistor parts. There are drawbacks such as the fact that the base area is large, making it difficult to downsize and increase the density of the product.

Further, RC composite parts shown in FIGS. 2 to 4 are also being considered. Each figure shows a schematic perspective view (a) of a composite component and a circuit (b).

In FIGS. 2 and 3, the structure is formed by connecting the resistor 4 between the external electrodes 11 of the multilayer chip capacitor 12, but it is possible to configure a plurality of capacitor and resistor elements in one component. It is difficult to do this, and it also involves a heating cycle that requires many steps, which poses problems in terms of cost and reliability. In FIG. 4, the laminated structure has a capacitor-forming part 3 and a resistor 4, but the ceramic parts of the capacitor-forming part 3 and the insulator 13 are made of the same material, such as steatite, follisterite, and titanate. Since barium or the like is used, the mechanical strength of the ceramic after sintering is low. Therefore, although it has sufficient mechanical strength to be used as a chip component, it has the disadvantage that it cannot be used as a board component on which various chip components are mounted and used for mounting due to insufficient mechanical strength. After cutting and firing, the external electrode 11 is baked to make the finished part, which requires many manufacturing steps and is a large-shaped part. Moreover, it is difficult to construct a large number of resistor and capacitor elements, and high density is required. There are also problems with.

(3) Purpose of the Invention The purpose of the present invention is to eliminate such conventional problems and drawbacks, and to construct a plurality of resistors and capacitors by simultaneous firing at a low temperature in an oxidizing atmosphere, and to produce a high dielectric constant material. The object of the present invention is to provide a composite laminated ceramic component in which a capacitor with a large capacitance of υ is formed by using a dielectric material.

According to the present invention, there is provided a high permittivity dielectric layer having a dielectric constant of 11 or more and having an electrode pattern on the surface and a via hole connected to the electrode pattern, an electrode pattern on the surface, and a via hole connected to the electrode pattern. In a composite laminated ceramic component in which a low dielectric constant dielectric layer having a relative permittivity of 10 or less is laminated with alumina glass having holes,
A composite laminated ceramic component is obtained, which includes a structure in which a heat-resistant metal oxide thin film is interposed between a high-permittivity dielectric layer and a low-permittivity dielectric layer.

(4) Explanation of the structure and operation of the invention Hereinafter, the present invention will be explained in detail with reference to Examples.

〔Example〕

First, the low permittivity dielectric green sheet made of glass/ceramic used in the present invention (hereinafter referred to as glass/ceramic green sheet) has a =5- composition of 40 to 60% by weight of aluminum oxide and 40 to 60% by weight of crystallized glass. A mixed powder selected to have a total amount of 100 ml within the range of 100 ml is made into a slurry with a binder, an organic solvent, and a plasticizer, and a raw sheet with a thickness of 20 μm to 300 μm is formed on a polyester film by slip casting using a doctor blade. After molding and peeling, the sheet is punched to desired external dimensions. The composition of the crystallized glass powder used here is lead oxide, boron oxide, silicon dioxide, group ■ oxide, group ■ element (excluding carbon, silicon, and lead) oxide, according to the oxide conversion notation. Each weight ratio is 3~
It is made up of a composition selected such that the total amount is 100 inches in the composition range of 66 inches, 1.2 to 50 inches, 5.4 to 65 inches, 0.1 to 50 inches, and 0.02 to 20%.

The starting raw material powder for the raw sheet of a high dielectric constant dielectric material (hereinafter referred to as high dielectric material) having a relative permittivity of 11 or more is FezQs,
'pb□, Nb2Qs, WOs powders were weighed in a predetermined amount, mixed in a ball mill, filtered and dried, pre-baked at 700 to 800°C, and the ball milled powder was mixed with a binder, an organic solvent, and a plasticizer. The slurry was turned into a slurry, and a sheet having a thickness of 10 to 200 μm was obtained by slip casting using a doctor blade in the same manner as in the preparation of the insulator green sheet.

The high dielectric material used here is Pb (Fe1/2Nb containing P
The raw materials were weighed to form a 3-Pb (re is W'/3) Oa binary composite perovskite compound.

Well, the resistor paste is made by mixing ruthenium dioxide powder and the crystallized glass powder used for the glass/ceramic green sheet at a weight ratio of 10:90 to 50:50 to obtain the desired resistance value. A paste was prepared by kneading the mixture with an organic vehicle containing ethyl cellulose, α-terpineol, kerosene, and an aromatic hydrocarbon solvent using a triple roll.

The conductors used for the electrode layer and signal line are AU and Ag.

An alloy powder containing one or more metals such as Pd and Pt was kneaded with an organic vehicle such as ethyl cellulose, α-terpineol, kerosene, and an aromatic hydrocarbon solvent to form a paste.

5 to 10 show each manufacturing process of a composite laminated ceramic component according to an embodiment of the present invention. In these figures, (a) is a plan view, and (1)) is a sectional view.

The formed glass/ceramic green sheet was punched to desired external dimensions to form a via hole 21 for providing electrical conduction on the lower surface of the glass/ceramic green sheet 20 shown in FIG. 5. The diameter of the via holes formed here could be as small as 100μ77Lt.Next, as shown in Fig. 6, the via holes 21 were formed on the glass/ceramic fixed raw sheet 20 to be used for signal lines and shield lines. The conductor layer 2 was formed by a screen printing method or the like.

At the same time, a conductor was embedded in the via hole 21. As conductors, AU, Ag, Pd,
A paste consisting of a single metal such as Pt or an alloy containing one or more of these metals was used. A glass/ceramic raw sheet 20 in which the conductor layer 2 was formed only in the via hole 21 portion and its vicinity was also produced.

Next, a seventh layer is applied to the glass/ceramic raw sheet 20 on which the conductor layer 2 is formed only in the via hole 21 portion and its vicinity.
Resistor paste 24 was printed as shown. Further, although not shown, in some cases, a resistor paste is printed in the same manner on the glass ceramic material 20 in which no via hole is formed.

On the other hand, the structure on the capacitor side will be explained.

Sintering of high dielectric materials, which can be co-fired with alumina and glass, progresses by releasing a liquid phase.

Pb(Fe'/, Nb1/2)Os used in this example
-Pb(Fez7.''#173)Os The sintering temperature of the binary composite herovskite compound (hereinafter referred to as PNW) is 910℃, but at the temperature of Nb,!:,'2W
A liquid phase is formed and sintering progresses. However, when this PNW and the above glass/ceramic are laminated and fired, the PNW
Since mutual diffusion occurs between the liquid phase of the PNW and the glass in the glass/ceramic, sintering of the PNW does not proceed, and a large stress is applied between the high dielectric material and the glass/ceramic, and in the worst case, peeling occurs.

Therefore, a heat-resistant metal oxide is interposed to prevent mutual diffusion.

9- Refractory metal oxides that can be used include aluminum oxide, zirconium oxide, boron oxide, silicon oxide, mental oxide or mixtures thereof.

Therefore, in this example, aluminum oxide will be explained.

Sweet PNW raw sheet 25 to form a capacitor
As shown in Figure 8, punch the via hole 21.
was formed.

Next, 1,000 sides of this PNW raw sheet 25 are coated with an aluminum oxide thin film 26 with a thickness of 0.1 μm by AC coating and talling.
was formed.

A conductor layer 2 and a via hole 2 that will become a capacitor electrode are formed on a PNW raw sheet 25 shaped like an aluminum oxide thin film 26.
A conductor layer 2 was formed on one portion and its vicinity.

Next, as shown in FIG. 10, each of the sheets in FIGS. 6 to 8 and the glass fist ceramic raw sheet 20 in FIG. 9 for adjusting the Y tension of the m carcass. ! :, Via Hall 21
and a glass/ceramic raw sheet 20 with a conductor layer 2 formed only in the vicinity thereof were laminated using a press machine at a temperature of 10-100 to 130°C and a pressure of 200 to 300 Kq/cf. In FIG. 10, the high dielectric sheet and the conductor layer 2 formed on its upper and lower surfaces become the capacitor forming part 3 after sintering, and become the conductor layer 27 for external terminals via the via hole 21 and the conductor layer 2. Connected.

Further, the resistor 4 is formed by laminating and firing the RUO2 resistor paste, and is guided to the outside through the pie hole 21 and the conductor layer 2.

The laminated body laminated and thermocompressed in this way is cut into predetermined external dimensions, and a binder removal step is performed to decompose and vaporize the binder, and a final firing step is performed to fire the glass, ceramic, and dielectric. After a while, a fired body was produced.

In this example, the formation of aluminum oxide by AC sputtering was described, but other effective methods include processing aluminum oxide powder into a paste and printing it, and depositing aluminum metal and thermally oxidizing the thin film. .

The capacitor built into the composite laminated ceramic component manufactured in the above manner obtained a capacitance of 50 points compared to a capacitor manufactured using only a dielectric material. The present invention provides a capacitance 10 times higher than that of the conventional method.

(5) Explanation of effects As described above, the present invention has the following effects.

By preventing the liquid phase component of the dielectric material incorporated into the composite laminated ceramic component from diffusing into the glass/ceramic, a dielectric material with a predetermined dielectric constant can be obtained, and as a result, large capacity capacitors and ceramics can be produced. 1, which is integrally formed with the wiring board;

[Brief explanation of drawings]

Figures 1 to 4 show conventional parts, and Figures 1 and 4 (a
) is a sectional view, Figure 2(a) is a perspective view, Figure 3(a) is a perspective view, and Figure 2(a) is a perspective view.
Figure (b), Figure 3 (b), and Figure 4 (b) show equivalent time maps. 5 to 9 show each manufacturing process of a composite end layer ceramic component according to an embodiment of the present invention, in which (a) is a plan view and (b) is a plan view.
) indicates a cross-sectional view. FIG. 10 is a schematic internal sectional view of the composite laminated ceramic component of this example. 1... Alumina sheet, 2... Conductor layer, 3... Capacitor forming part, 4...
Resistor, 11...External electrode, 12...
Multilayer chip capacitor, 13...Insulator, 20
...Glass/ceramic raw sheet, 21...
... Via hole, 24 ... Resistance paste,
25... PNW raw sheet, 26... Aluminum oxide thin film, 27... Conductor layer for external terminals. 13- 'h Figure 3 (1) (b) No 2 Figure 4 (of) (b) Figure 5 Figure 8 (Sink) (b) (6t) (b)

Claims (1)

[Claims] A high permittivity dielectric layer having a relative permittivity of 11 or more and having an electrode pattern on the surface and a via hole connected to the electrode pattern, and an M1 pole pattern on the surface and a via hole connected to the electrode pattern. In a composite laminated ceramic component in which a low-permittivity dielectric layer made of alumina and glass with a relative permittivity of 10 or less is laminated, a heat-resistant metal oxide thin film is formed on the high-permittivity dielectric layer and the low-permittivity dielectric layer. A composite laminated ceramic component characterized by comprising a structure interposed between.